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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 379 records · Page 21
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
DOE OSTI2020

ABINIT: Overview and focus on selected capabilities

ABINIT is probably the first electronic-structure package to have been released under an open-source license about 20 years ago. It implements density functional theory, density-functional perturbation theory (DFPT), many-body perturbation theory (GW approximation and Bethe–Salpeter equation), and more specific or advanced formalisms, such as dynamical mean-field theory (DMFT) and the “temperature-dependent effective potential” approach for anharmonic effects. Relying on planewaves for the representation of wavefunctions, density, and other space-dependent quantities, with pseudopotentials or projector-augmented waves (PAWs), it is well suited for the study of periodic materials, although nanostructures and molecules can be treated with the supercell technique. The present article starts with a brief description of the project, a summary of the theories upon which ABINIT relies, and a list of the associated capabilities. It then focuses on selected capabilities that might not be present in the majority of electronic structure packages either among planewave codes or, in general, treatment of strongly correlated materials using DMFT; materials under finite electric fields; properties at nuclei (electric field gradient, Mössbauer shifts, and orbital magnetization); positron annihilation; Raman intensities and electro-optic effect; and DFPT calculations of response to strain perturbation (elastic constants and piezoelectricity), spatial dispersion (flexoelectricity), electronic mobility, temperature dependence of the gap, and spin-magnetic-field perturbation. The ABINIT DFPT implementation is very general, including systems with van der Waals interaction or with noncollinear magnetism. Community projects are also described: generation of pseudopotential and PAW datasets, high-throughput calculations (databases of phonon band structure, second-harmonic generation, and GW computations of bandgaps), and the library libpaw. ABINIT has strong links with many other software projects that are briefly mentioned.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2022

Load-Packaged AC/DC and DC/DC Power Electronics Converter Performance Data

This data set contains experimentally characterized performance data from load-packaged alternating current to direct current (AC/DC) and direct current to direct current (DC/DC) power electronics converters associated with lighting devices and miscellaneous electrical loads typically found in commercial buildings in the United States. The data set contains input power, output power, efficiency, and harmonic spectrum data for 58 AC/DC converters and 35 DC/DC converters.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
NASA NTRS1967

Microelectronics on ATS

Fabrication, packaging, and testing of microelectronic equipment for Applications Technology Satellite /ATS/ scientific experimental package

ELECTRONIC PACKAGING↗
NASA NTRS1978

Installation package for integrated programmable electronic controller and hydronic subsystem - solar heating and cooling

A description is given of the Installation, Operation, and Maintenance Manual and information on the power panel and programmable microprocessor, a hydronic solar pump system and a hydronic heating hot water pumping system. These systems are integrated into various configurations for usages in solar energy management, control and monitoring, lighting control, data logging and other solar related applications.

Source record↗
NASA NTRS1995

Microelectronics in Japan

The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

Boulton, William R.↗
DOE OSTI2022

Implementation and Validation of Constrained Density Functional Theory Forces in the CP2K Package

Constrained density functional theory (CDFT) is a powerful tool for the prediction of electron transfer parameters in condensed phase simulations at a reasonable computational cost. In this work we present an extension to CDFT in the popular mixed Gaussian/plane wave electronic structure package CP2K, implementing the additional force terms arising from a constraint based on Hirshfeld charge partitioning. This improves upon the existing Becke partitioning scheme, which is prone to give unphysical atomic charges. We verify this implementation for a variety of systems: electron transfer in (H 2 O) 2 + in vacuum, electron tunnelling between oxygen vacancy centers in solid MgO, and electron self-exchange in aqueous Ru 2+ -Ru 3+ . We find good agreement with previous plane-wave CDFT results for the same systems, but at a significantly lower computational cost, and we discuss the general reliability of condensed phase CDFT calculations.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS2020

Recommendations on Use of Commercial-Off-The-Shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) Parts for NASA Missions

The NASA Electronic Parts & Packaging Program Manager, requested a NASA Engineering and Safety Center independent assessment to summarize Commercial Crew Program and NASA Centers’ current and best practices, and lessons learned, on use of commercial-off-the-shelf (COTS) for all mission risk classifications, and provide recommendations that could lead to future NASA Electronic Parts and Packaging Program and/or Agency guidance on COTS parts. This document contains the outcome of the assessment.

Commercial-Off-The-Shelf↗
NASA NTRS1985

Suprathermal plasma observed on STS-3 Mission by plasma diagnostics package

Artificially produced electron beams were used extensively during the past decade as a means of probing the magnetosphere, and more recently as a means of actively controlling spacecraft potential. Experimentation in these areas has proven valuable, yet at times confusing, due to the interaction of the electron beam with the ambient plasma. The OSS-1/STS-3 Mission in March 1982 provided a unique opportunity to study beam-plasma interactions at an altitude of 240 km. On board for this mission was a Fast Pulse Electron Generator (FPEG). Measurements made by the Plasma Diagnostics Package (PDP) while extended on the Orbiter RMS show modifications of the ion and electron energy distributions during electron beam injection. Observations made by charged particle detectors are discussed and related to measurements of Orbiter potential. Several of the PDP instruments, the joint PDP/FPEG experiment, and observations made during electron beam injection are described.

Paterson, W.↗
NASA NTRS1988

Hermetically sealable package for hybrid solid-state electronic devices and the like

A light-weight, inexpensively fabricated, hermetically sealable, repairable package for small electronic or electromechanical units, having multiple connections, is described. A molded ring frame of polyamide-imide plastic (Torlon) is attached along one edge to a base plate formed of a highly heat conducting material, such as aluminum or copper. Bores are placed through a base plate within the area of the edge surface of ring frame which result in an attachment of the ring frame to the base plate during molding. Electrical leads are molded into the ring frame. The leads are L-shaped gold-plated copper wires imbedded within widened portions of the side wall of the ring frame. Within the plastic ring frame wall the leads are bent (typically, though not necessarily at 90 deg) so that they project into the interior volume of the ring frame for connection to the solid state devices.

Miller, Wilson N.↗
NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗
DOE OSTI2020

Guest Editorial: Special Issue on InterPACK 2019 - Part 1

This is a collection of papers drawn from the 2019 ASME InterPACK Conference. The content spans the areas of heterogeneous integration, servers, flexible and wearable electronics, photonics, power electronics, energy storage, and autonomous and electric vehicles.

47 OTHER INSTRUMENTATION↗
NASA NTRS1994

AI and workflow automation: The prototype electronic purchase request system

Automating 'paper' workflow processes with electronic forms and email can dramatically improve the efficiency of those processes. However, applications that involve complex forms that are used for a variety of purposes or that require numerous and varied approvals often require additional software tools to ensure that (1) the electronic form is correctly and completely filled out, and (2) the form is routed to the proper individuals and organizations for approval. The prototype electronic purchase request (PEPR) system, which has been in pilot use at NASA Ames Research Center since December 1993, seamlessly links a commercial electronics forms package and a CLIPS-based knowledge system that first ensures that electronic forms are correct and complete, and then generates an 'electronic routing slip' that is used to route the form to the people who must sign it. The PEPR validation module is context-sensitive, and can apply different validation rules at each step in the approval process. The PEPR system is form-independent, and has been applied to several different types of forms. The system employs a version of CLIPS that has been extended to support AppleScript, a recently-released scripting language for the Macintosh. This 'scriptability' provides both a transparent, flexible interface between the two programs and a means by which a single copy of the knowledge base can be utilized by numerous remote users.

Compton, Michael M.↗
NASA NTRS1995

MEMS in Space Systems

Micro-electro-mechanical systems (MEMS) provide an emerging technology that has the potential for revolutionizing the way space systems are designed, assembled, and tested. The high launch costs of current space systems are a major determining factor in the amount of functionality that can be integrated in a typical space system. MEMS devices have the ability to increase the functionality of selected satellite subsystems while simultaneously decreasing spacecraft weight. The Air Force Phillips Laboratory (PL) is supporting the development of a variety of MEMS related technologies as one of several methods to reduce the weight of space systems and increase their performance. MEMS research is a natural extension of PL research objectives in micro-electronics and advanced packaging. Examples of applications that are under research include on-chip micro-coolers, micro-gyroscopes, vibration sensors, and three-dimensional packaging technologies to integrate electronics with MEMS devices. The first on-orbit space flight demonstration of these and other technologies is scheduled for next year.

Lyke, J. C.↗