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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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1,329 records · Page 22

In-Space Laser Forming Simulated Under Thermal Vacuum (TVAC) Conditions

NASA Marshall Space Flight Center is investigating laser forming under thermal vacuum conditions representative of the space environment through a partnership with the DARPA NOM4D program. The thermal gradient mechanism (TGM) is used to bend a metal sheet towards the laser optics. Laser equipment and process parameters are being optimized for thermal vacuum conditions. Such conditions are representative of the extreme cold and hot temperatures and high vacuum that exist on orbit or on the lunar surface. in situ photogrammetry and thermography assess the bend/counterbend and elucidate the TGM in thermal vacuum. Structured light scanning and metallography after bending reveal the macroscopic and microscopic structure after TGM.

thermal vacuum

Performance Assessment of LunaNet’s Augmented Forward Signal

LunaNet provides a common set of interoperable specifications for communication and position, navigation and time (PNT) services and interfaces soon to be implemented in lunar vicinity. The LunaNet Interoperability Specification (LNIS) provides the design for the GNSS-like Augmented Forward Signal (AFS), which enables orbiting and surface users in lunar space, such as Artemis, to estimate their position, velocity, and time. The specification of AFS defines two orthogonal signal components on a single carrier: the in-phase component (AFS-I), a lower-chip-rate data channel tailored for applications where low SWaP (Size, Weight, and Power) is critical (e.g., IoT devices or search and rescue), and the quadrature component (AFS-Q), a high-chip-rate data-less pilot signal for high-precision, robust lunar navigation and positioning applications. An initial description of AFS was provided in [1], with initial analysis results shown in [2] and [3] and the current signal in space description provided in [4]. As part of NASA's Lunar Communication Relay and Navigation Systems (LCRNS) project, this work expands upon the initial analysis results and proposes a new expanded set of AFS-Q spreading codes that exceed the cross-correlation and autocorrelation sidelobe performance of L1C and other GNSS signals, while providing additional expansion capabilities for future provider satellites. A set of 420 codes was selected from a Weil-based code derived from the prime number 10247, which is larger than the 10243 prime number used to derive Beidou’s B1C Weil sequences. Both the initial set of 210 codes and the expanded set of 420 codes are shown to provide the best cross-correlation of any 10230-chip satellite navigation codes. The performance is demonstrated for hierarchical sets of spreading codes optimized and organized in sets of 30 codes. The new codes were developed using an optimization approach and correlation methodology described in [5]. The work also compares LunaNet’s AFS to terrestrial GNSS signals in terms of acquisition, tracking, and data demodulation performance. Performance is evaluated for receivers that only track the 1.023 MCPS data channel spreading code for low SWaP IoT use cases, as well as for receivers that track both the 1.023 MCPS data channel and the 5.115 MCPS pilot channel spreading code for high-performance use cases. Performance is assessed in the presence of interference and thermal noise. The analysis is performed in terms of expected operating conditions on the lunar surface. Several unique flexibility aspects of the augmented forward signal are described, including the use of the Q channel’s secondary and tertiary codes to enable variable coherent integrations during acquisition. This is compared to GNSS signals such as L5/E5 and MBOC in terms of achievable processing gain for interference mitigation versus acquisition complexity. The work details acquisition and tracking techniques used to optimally acquire and track the primary, secondary, and tertiary codes on the Q channel, as well as acquisition of the I channel spreading code. Acquisition of the 8 ms Q channel spreading code is also compared to joint acquisition of the I and Q channel primary codes in noise and interference environments.

LCRNS

Thermal Testing of High Performance: Thermal Barrier Coatings for Turbine Blades

A 350 micron thick 7 wt.% Y 2 O 3 -ZrO 2 (7YSZ) ceramic Thermal Barrier Coating (TBC) was manufactured in an argon atmosphere and with a strictly controlled substrate temperature on flat IN 600 samples and on IN 100 aircraft turbine blades. This new atmosphere and temperature controlled spraying (ATCS) allows the reduction of the residual stresses and an improvement in the microstructure and in the mechanical properties of the coating. The good performance of these new TBC's was assessed in thermal fatigue and in thermal shock tests carried out in air at 1100°C and at 1280°C respectively. The oxidation rate of the metal-ceramic interface was measured at 1100°C. Failure of the TBC's was induced only by the deterioration (like oxidation, cracking, ...) of the uncoated parts of the samples, as testing temperature was too severe for the base metals. Spalling was thereafter driven by compressive stresses near the aluminum oxide layer at the metal-ceramic interface. The results of these tests underline the good quality of the ceramic coating manufactured by the new ATCS technology.

L Bertamini

TRACE Input Modernization

This work presents a Tom’s Obvious Minimal Language (TOML)-based representation of input for the US Nuclear Regulatory Commission’s TRAC/RELAP Advanced Computational Engine (TRACE) thermal hydraulics code. Implemented using the Workbench Analysis Sequence Processor (WASP), the approach maps traditional TRACE input structures to a hierarchical format composed of named parameters, typed values, and native data collections. The resulting representation preserves TRACE’s existing modeling capabilities while providing a modern, structured interface for model development and management. WASP further extends TOML through a file import directive that supports modular model composition and reusable input organization. In addition, WASP provides extended array data entry convenience with various data repeat and interpolation capabilities. Examples of the new TOML syntax are provided for major TRACE input categories, including hydraulic components, heat structures, control systems, and trip logic. The TOML representation establishes a foundation for improved validation, tooling, automation, and model maintainability while remaining compatible with existing TRACE workflows. To facilitate migration to the TOML-based input format, the TRACE executable now supports conversion of native TRACE input into an intermediate JSON representation. A Python utility subsequently transforms the JSON data into an equivalent TOML model. Lastly, the TRACE executable now supports execution using TOML-formatted input.

Lefebvre, Robert A. [Oak Ridge National Laboratory

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherents

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

bondline thickness

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherends

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

X-ray computed tomography

Method and apparatus for providing thermal wear leveling

Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.

Roberts, David A.