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NASA NTRS2006

Universal Controller for Spacecraft Mechanisms

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Levanas, Greg↗

NASA NTRS1971

DALG: A program for test pattern generation in combinational logical circuits

A user's manual for a computer program DALG which generates test patterns for detecting faults in combinational logic circuits containing up to 200 logical gates is presented. The gates may be of logical types AND, OR, NAND, NOR, NOT, or Exclusive OR is presented. The faults may be any one gate or input struck at a fixed value (0 or 1). In addition to test pattern generation DALG will also determine whether or not the given test pattern will detect given faults in a circuit. Sample problems are given along with input data sheets and printed output to illustrate the capabilities of the program.

Source record↗

NASA NTRS1980

Development of a high efficiency thin silicon solar cell

Significant improvements in open-circuit voltage and conversion efficiency, even on relatively high bulk resistivity silicon, were achieved by using a screen-printed aluminum paste back surface field. A 4 sq cm 50 micron m thick cell was fabricated from textured 10 omega-cm silicon which had an open-circuit voltage of 595 mV and AMO conversion efficiency at 25 C of 14.3%. The best 4 sq cm 50 micron thick cell (2 omega-cm silicon) produced had an open-circuit voltage of 607 mV and an AMO conversion efficiency of 15%. Processing modifications are described which resulted in better front contact integrity and reduced breakage. These modifications were utilized in the thin cell pilot line to fabricate 4 sq cm cells with an average AMO conversion efficiency at 25 C of better than 12.5% and with lot yields as great as 51% of starts; a production rate of 10,000 cells per month was demonstrated. A pilot line was operated which produced large area (25 cm) ultra-thin cells with an average AMO conversion efficiency at 25 deg of better than 11.5% and a lot yield as high as 17%.

Storti, G.↗

NASA NTRS2019

Investigation of Anti-Phase Asymmetric Quiet Rotor Technology

The future of urban air mobility has a well-known tall pole challenge in the form of community acceptance which largely comes from the noise. This paper presents a proposed anti-phase rotor technology that could reduce noise sources such as blade vortex interaction noise. The anti-phase rotor technology includes a rotor design with various anti-phase alternating trailing edge patterns and a rotor design with an asymmetric blade tip. Four small-scale anti-phase rotors are fabricated by 3D printing for acoustic measurements conducted in a low-speed open-circuit wind tunnel to assess the effectiveness of the proposed anti-phase rotor technology. Preliminary test results appear to be promising and indicate that the anti-phase rotor designs could be a practical means of reducing blade vortex interactions and noise. The four tested anti-phase rotor designs have peak acoustic performance depending on the RPM and thrust which suggests improved performance through design optimization could be achieved for specific mission requirements.

Cramer, Nicholas B.↗

NASA NTRS2013

Fully Printed, Flexible, Phased Array Antenna for Lunar Surface Communication

NASAs future exploration missions focus on the manned exploration of the Moon, Mars, and beyond, which will rely heavily on the development of a reliable communications infrastructure from planetary surface-to-surface, surface-to-orbit, and back to Earth. Flexible antennas are highly desired in many scenarios. Active phased array antennas (active PAAs) with distributed control and processing electronics at the surface of an antenna aperture offer numerous advantages for radar communications. Large-area active PAAs on flexible substrates are of particular interest in NASA s space radars due to their efficient inflatable package that can be rolled up during transportation and deployed in space. Such an inflatable package significantly reduces stowage volume and mass. Because of these performance and packaging advantages, large-area inflatable active PAAs are highly desired in NASA s surface-to-orbit and surface-to-relay communications. To address the issues of flexible electronics, a room-temperature printing process of active phased-array antennas on a flexible Kapton substrate was developed. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proved feasible for the PAA system. This innovation is a new type of fully inkjet-printable, two-dimensional, high-frequency PAA on a flexible substrate at room temperature. The designed electronic circuit components, such as the FET switches in the phase shifter, metal interconnection lines, microstrip transmission lines, etc., are all printed using a special inkjet printer. Using the developed technology, entire 1x4, 2x2, and 4x4 PAA systems were developed, packaged, and demonstrated at 5.3 GHz. Several key solutions are addressed in this work to solve the fabrication issues. The source/drain contact is developed using droplets of silver ink printed on the source/drain areas prior to applying CNT thin-film. The wet silver ink droplets allow the silver to wet the CNT thin-film area and enable good contact with the source and drain contact after annealing. A passivation layer to protect the device channel is developed by bonding a thin Kapton film on top of the device channel. This film is also used as the media for transferring the aligned CNT thin-film on the device substrate. A simple and cost-effective technique to form multilayer metal interconnections on flexible substrate is developed and demonstrated. Contact vias are formed on the second substrate prior to bonding on the first substrate. Inkjet printing is used to fill the silver ink into the via structure. The printed silver ink penetrates through the vias to contact with the contact pads on the bottom layer. It is then annealed to form a good connection. One-dimensional and two-dimensional PAAs were fabricated and characterized. In these circuits, multilayer metal interconnects were used to make a complete PAA system.

Subbaraman, Harish↗

NASA NTRS1971

Development of a highly reliable composite board for printed circuitry for use in space environment

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.

Bradbury, E. J.↗

NASA NTRS2017

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗

NASA NTRS2016

High Density Packaging Technologies for RF Electronics in Small Spacecraft

Schatzel, Donald↗

NASA NTRS2016

Intern Abstract for Spring 2016

The Human Interface Branch - EV3 - is evaluating Organic lighting-emitting diodes (OLEDs) as an upgrade for current displays on future spacecraft. OLEDs have many advantages over current displays. Conventional displays require constant backlighting which draws a lot of power, but with OLEDs they generate light themselves. OLEDs are lighter, and weight is always a concern with space launches. OLEDs also grant greater viewing angles. OLEDs have been in the commercial market for almost ten years now. What is not known is how they will perform in a space-like environment; specifically deep space far away from the Earth's magnetosphere. In this environment, the OLEDs can be expected to experience vacuum and galactic radiation. The intern's responsibility has been to prepare the OLED for a battery of tests. Unfortunately, it will not be ready for testing at the end of the internship. That being said much progress has been made: a) Developed procedures to safely disassemble the tablet. b) Inventoried and identified critical electronic components. c) 3D printed a testing apparatus. d) Wrote software in Python that will test the OLED screen while being radiated. e) Built circuits to restart the tablet and the test pattern, and ensure it doesn't fall asleep during radiation testing. f) Built enclosure that will house all of the electronics Also, the intern has been working on a way to take messages from a simulated Caution and Warnings system, process said messages into packets, send audio packets to a multicast address that audio boxes are listening to, and output spoken audio. Currently, Cautions and Warnings use a tone to alert crew members of a situation, and then crew members have to read through their checklists to determine what the tone means. In urgent situations, EV3 wants to deliver concise and specific alerts to the crew to facilitate any mitigation efforts on their part. Significant progress was made on this project: a) Open channel with the simulated Caution and Warning system to acquire messages. b) Configure audio boxes. c) Grab pre-recorded audio files. d) Packetize the audio stream. A third project that was assigned to implement LED indicator modules for an Omnibus project. The Omnibus project is investigating better ways designing lighting for the interior of spacecraft-both spacecraft lighting and avionics box status lighting indication. The current scheme contains too much of the blue light spectrum that disrupts the sleep cycle. The LED indicator modules are to simulate the indicators running on a spacecraft. Lighting data will be gathered by human factors personal and use in a model underdevelopment to model spacecraft lighting. Significant progress was made on this project: Designed circuit layout a) Tested LEDs at LETF. b) Created GUI for the indicators. c) Created code for the Arduino to run that will illuminate the indicator modules.

Gibson, William↗

NASA NTRS2013

Flight Hardware Packaging Design for Stringent EMC Radiated Emission Requirements

This packaging design approach can help heritage hardware meet a flight project's stringent EMC radiated emissions requirement. The approach requires only minor modifications to a hardware's chassis and mainly concentrates on its connector interfaces. The solution is to raise the surface area where the connector is mounted by a few millimeters using a pedestal, and then wrapping with conductive tape from the cable backshell down to the surface-mounted connector. This design approach has been applied to JPL flight project subsystems. The EMC radiated emissions requirements for flight projects can vary from benign to mission critical. If the project's EMC requirements are stringent, the best approach to meet EMC requirements would be to design an EMC control program for the project early on and implement EMC design techniques starting with the circuit board layout. This is the ideal scenario for hardware that is built from scratch. Implementation of EMC radiated emissions mitigation techniques can mature as the design progresses, with minimal impact to the design cycle. The real challenge exists for hardware that is planned to be flown following a built-to-print approach, in which heritage hardware from a past project with a different set of requirements is expected to perform satisfactorily for a new project. With acceptance of heritage, the design would already be established (circuit board layout and components have already been pre-determined), and hence any radiated emissions mitigation techniques would only be applicable at the packaging level. The key is to take a heritage design with its known radiated emissions spectrum and repackage, or modify its chassis design so that it would have a better chance of meeting the new project s radiated emissions requirements.

Lortz, Charlene L.↗

NASA NTRS1981

Diagnostic study of BSF silicon solar cells

Solar cells equipped with back surface fields (BSF) were fabricated by means of an aluminum alloy, boron diffusion, and boron ion implantation. The importance of initial thickness, resistivity, orientation, and the crystal growth method were examined. Aluminum in paste form was screen printed on the cell, followed by alloy formation at 800 C for a minute. Application of the BSFs resulted in open circuit voltage improvements dependent on the substrate resistivity, ranging from 10 mV at 0.3 ohm-cm to 50 mV at 15 ohm-cm. The gains in performance were attributed to a longer penetration depth, a heightened concentration profile at the interface, and higher concentrations in the p+ layer.

Yoo, H.↗

NASA NTRS2009

Improving the Visible and Infrared Contrast Ratio of Microshutter Arrays

Three device improvements have been developed that dramatically enhance the contrast ratio of microshutters. The goal of a microshutter is to allow as much light through as possible when the shutters are in the open configuration, and preventing any light from passing through when they are in the closed position. The ratio of the transmitted light that is blocked is defined here as the contrast ratio. Three major components contribute to the improved performance of these microshutters: 1. The precise implementation of light shields, which protect the gap around the shutters so no light can leak through. It has been ascertained that without the light shield there would be a gap on the order of 1 percent of the shutter area, limiting the contrast to a maximum of 100. 2. The precise coating of the interior wall of each microshutter was improved with an insulator and metal using an angle deposition technique. The coating prevents any infrared light that finds an entrance on the surface of the microshutter cell from being emitted from a sidewall. Since silicon is in effect transparent to any light with a wavelength longer than .1 micrometer, these coatings are essential to blocking any stray signals when the shutters are closed. 3. A thin film of molybdenum nitride (MoN) was integrated onto the surface of the microshutter blade. This film provides the majority of light blockage over the microshutter and also ensures that the shutter can be operated over a wide temperature range by maintaining its flatness. These improvements were motivated by the requirements dictated by the James Webb Space Telescope NIRSpec instrument. The science goals of the NIRSpec require observing some of the very faintest objects in a given field of view that also may contain some very bright objects. To observe the faint objects, the light from the bright objects - which could be thousands of times brighter - must be completely blocked. If a closed microshutter is even slightly transmissive, a very bright object will still transmit a small signal, which can be larger than a signal from a very faint object transmitted through an open shutter. Since this situation can completely corrupt the results, it was necessary that the closed shutters be able to attenuate light by at least a factor of 2,000. There currently exist four flight-quality microshutter arrays that have been fully or are currently undergoing testing and the results support that the three improvements described above have successfully led to contrast levels greater than 50,000 in over 99 percent of the microshutters at an operating temperature of 35 K. Applications for these high-contrast microshutters are in the photomask generation and stepper equipment used to make integrated circuits and microelectromechanical (MEMS) devices. Since microshutters are a reconfigurable optical element, their versatility in these industries provides an improvement over printed masks and fixed projection alignment systems.

Jhabvala, Murzy↗

NASA NTRSDate not supplied

Development of an Additive Manufactured Cryogenic TVS Augmented Injector

Cryogenic fluid transfer is critical in ground and space systems. Transfer typically requires venting a receiver vessel during the chill and fill process to maintain a pressure favorable to fluid flow. Venting in space is problematic due to low-gravity where fluid position is indeterminate; possibly allowing fluid to flow out the vent. To control receiver tank venting the vented chill/no-vent fill methodology is attractive. An additively manufactured Injector coupled with a Thermodynamic Venting System (TVS) augmentation can enable the vented chill/no-vent fill approach with simplified operations. The TVS augmented injector includes an internal heat exchanger, fluid injector spray head, and external surface condensation heat exchange; combined with integrated flow paths in one part. Operations using the injector allow the tank vent to be closed very early in the transfer and not reopened. The TVS circuit eliminates the potential for stalled fill by maintaining cooling flow on the injector and condenser elements, reducing tank pressure. The injector can also be employed for long-term cryo fluid storage as a means of controlling tank pressure if integrated with a recirculation pump. A cryo-cooler can be used in place of/or augmenting the TVS flow circuit for a zero loss pressure control system. The Injector was developed using the principles of design for additive manufacture and printed as one part, resulting in part count reduction, improved reproducibility, shorter lead times, and reduced cost. The TVS augmented injector is compact and highly adaptable simplifying its integration. A key benefit is that this methodology enables simplified operations in reaching 100% fill conditions.

Omar Mireles↗

NASA NTRS1993

Analysis of microstrip dipoles and slots transversely coupled to a microstrip line using the FDTD method

Printed dipole elements and their complement, linear slots, are elementary radiators that have found use in low-profile antenna arrays. Low-profile antenna arrays, in addition to their small size and low weight characteristics, offer the potential advantage of low-cost, high-volume production with easy integration with active integrated circuit components. The design of such arrays requires that the radiation and impedance characteristics of the radiating elements be known. The FDTD (Finite-Difference Time-Domain) method is a general, straight-forward implementation of Maxwell's equations and offers a relatively simple way of analyzing both printed dipole and slot elements. Investigated in this work is the application of the FDTD method to the analysis of printed dipole and slot elements transversely coupled to an infinite transmission line in a multilayered configuration. Such dipole and slot elements may be used in dipole and slot series-fed-type linear arrays, where element offsets and interelement line lengths are used to obtain the desired amplitude distribution and beam direction, respectively. The design of such arrays is achieved using transmission line theory with equivalent circuit models for the radiating elements. In an equivalent circuit model, the dipole represents a shunt impedance to the transmission line, where the impedance is a function of dipole offset, length, and width. Similarly, the slot represents a series impedance to the transmission line. The FDTD method is applied to single dipole and slot elements transversely coupled to an infinite microstrip line using a fixed rectangular grid with Mur's second order absorbing boundary conditions. Frequency-dependent circuit and scattering parameters are obtained by saving desired time-domain quantities and using the Fourier transform. A Gaussian pulse excitation is applied to the microstrip transmission line, where the resulting reflected signal due to the presence of the radiating element is used to determine the equivalent element impedance.

Tulintseff, A. N.↗

NASA NTRS1980

High density circuit technology

Acquisition of polyimide materials for inter-metal dielectrics was obtained from three vendors, with considerable evaluation conducted on the Dupont PI2550 material. Experimental results indicate this material can be patterned using contact printing to line width far below 0.1 mils. Optimum line width is acquired using plasma etch equipment. Metal lift-off experiments on thermal evaporated films were optimized for application to sputtered deposited films. Alternate metal-lift-off experiments are proposed for future investigation. Dry processing equipment studies and future trends in VLSI fabrication techniques are on-going.

Wade, T. E.↗

NASA NTRS1987

An interactive wire-wrap board layout program

An interactive computer-graphics-based tool for specifying the placement of electronic parts on a wire-wrap circuit board is presented. Input is a data file (currently produced by a commercial logic design system) which describes the parts used and their interconnections. Output includes printed reports describing the parts and wire paths, parts counts, placement lists, board drawing, and a tape to send to the wire-wrap vendor. The program should reduce the engineer's layout time by a factor of 3 to 5 as compared to manual methods.

Schlutsmeyer, A.↗

NASA NTRS1994

Document analysis with neural net circuits

Document analysis is one of the main applications of machine vision today and offers great opportunities for neural net circuits. Despite more and more data processing with computers, the number of paper documents is still increasing rapidly. A fast translation of data from paper into electronic format is needed almost everywhere, and when done manually, this is a time consuming process. Markets range from small scanners for personal use to high-volume document analysis systems, such as address readers for the postal service or check processing systems for banks. A major concern with present systems is the accuracy of the automatic interpretation. Today's algorithms fail miserably when noise is present, when print quality is poor, or when the layout is complex. A common approach to circumvent these problems is to restrict the variations of the documents handled by a system. In our laboratory, we had the best luck with circuits implementing basic functions, such as convolutions, that can be used in many different algorithms. To illustrate the flexibility of this approach, three applications of the NET32K circuit are described in this short viewgraph presentation: locating address blocks, cleaning document images by removing noise, and locating areas of interest in personal checks to improve image compression. Several of the ideas realized in this circuit that were inspired by neural nets, such as analog computation with a low resolution, resulted in a chip that is well suited for real-world document analysis applications and that compares favorably with alternative, 'conventional' circuits.

Graf, Hans Peter↗

NASA NTRS1994

The two-way time synchronization system via a satellite voice channel

A newly developed two-way time synchronization system is described in this paper. The system uses one voice channel at a SCPC satellite digital communication earth station, whose bandwidth is only 45 kHz, thus saving satellite resources greatly. The system is composed of one master station and one or several, up to sixty-two, secondary stations. The master and secondary stations are equipped with the same equipment, including a set of timing equipment, a synthetic data terminal for time synchronizing, and a interface unit between the data terminal and the satellite earth station. The synthetic data terminal for time synchronization also has an IRIG-B code generator and a translator. The data terminal of master station is the key part of whole system. The system synchronization process is full automatic, which is controlled by the master station. Employing an autoscanning technique and conversational mode, the system accomplishes the following tasks: linking up liaison with each secondary station in turn, establishing a coarse time synchronization, calibrating date (years, months, days) and time of day (hours, minutes, seconds), precisely measuring the time difference between local station and the opposite station, exchanging measurement data, statistically processing the data, rejecting error terms, printing the data, calculating the clock difference and correcting the phase, thus realizing real-time synchronization from one point to multiple points. We also designed an adaptive phase circuit to eliminate the phase ambiguity of the PSK demodulator. The experiments have shown that the time synchronization accuracy is better than 2 mu S. The system has been put into regular operation.

Heng-Qiu, Zheng↗