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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 433 records · Page 24

Body of Knowledge for Graphics Processing Units (GPUs)

Graphics Processing Units (GPU) have emerged as a proven technology that enables high performance computing and parallel processing in a small form factor. GPUs enhance the traditional computer paradigm by permitting acceleration of complex mathematics and providing the capability to perform weighted calculations, such as those in artificial intelligence systems. Despite the performance enhancements provided by this type of microprocessor, there exist tradeoffs in regards to reliability and radiation susceptibility, which may impact mission success. This report provides an insight into GPU architecture and its potential applications in space and other similar markets. It also discusses reliability, qualification, and radiation considerations for testing GPUs.

NASA Electronic Parts and Packaging (NEPP) Program↗

ISSI IS46DR16640B-25DBA25 DDR2 SDRAM Total Ionizing Dose Characterization Test Report

The purpose of this testing is to characterize the ISSI IS46DR16640B-25DBA25 parameter degradation for total dose response. This test’s purpose is to evaluate and compare lot date codes for sensitivity. In the test, the device is exposed to both low dose and high dose rate (HDR) irradiations using gamma radiation. Device parameters such as leakage currents, quantity of upset bits or addresses, and overall chip and die health are investigated to determine which lot is more robust. These parameters directly affect the functionality of the memory within a system and may determine thresholds necessary to mitigate failure.

Total Ionizing Dose (TID)↗

NEPP Processor Enclave

Explore the source record for details and available documents.

graphics processing unit (GPU)↗

Solder Creep-Fatigue Interactions with Flexible Leaded Part

In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.

creep effects↗

Double-probe potential measurements near the Spacelab 2 electron beam

As part of the Spacelab 2 mission the plasma diagnostics package (PDP) was released from the shuttle as a free-flying satellite. The PDP carried a quasi-static electric field instrument which made differential voltage measurements between two floating probes. At various times during the free flight, an electron beam was ejected from the shuttle. Large differential voltages between the double probes were recorded in association with the electron beam. However, analysis indicates that these large signals are probably not caused by ambient electric fields. Instead, they can be explained by considering three effects: shadowing of the probes from streaming electrons by the PDP chassis, crossing of the PDP wake by the probes, and spatial gradients in the fluxes of energetic electrons reaching the probes. Plasma measurements on the PDP show that energetic electrons exist in a region 20 m wide and up to at least 170 m downstream from the electron beam. At 80 or more meters downstream from the beam, the double probe measurements show that the energetic electron flux is opposite to the injection direction, as would be expected for a secondary returning electron beam produced by scattering of the primary electron beam.

Steinberg, J. T.↗

High Energy/LET Radiation EEE Parts Certification Handbook

Certifying electronic components is a very involved process. It includes pre-coordination with the radiation test facility for time, schedule and cost, as well as intimate work with designers to develop test procedures and hardware. It also involves work with radiation engineers to understand the effects of the radiation field on the test article/setup as well as the analysis and production of a test report. The technical content of traditional ionizing radiation testing protocol is in wide use and generally follows established standards (ref. Appendix C). This document is not intended to cover all these areas but to cover the methodology of using Variable Depth Bragg Peak (VDBP) to accomplish the goal of characterizing an electronic component. The Variable Depth Bragg Peak (VDBP) test method is primarily used for deep space applications of electronics. However, it can be used on any part for any radiation environment, especially those parts where the sensitive volume cannot be reached by the radiation beam. An example of this problem would be issues that arise in de-lidding of parts or in parts with flip-chip designs, etc. The VDBP method is ideally suited to test modern avionics designs which increasingly incorporate commercial off-the-shelf (COTS) parts and units. Johnson Space Center (JSC) developed software provides assistance to users in developing the radiation characterization data from the raw test data.

Reddell, Brandon↗

Photoionization of lithium

The photoionization of lithium from threshold to 50 eV above threshold is calculated using the method of polarized orbitals. The method is applied in as orthodox a manner as possible; this means that total wave functions are constructed as by Temkin and Lamkin (1961) using only the static dipole part of the perturbation of core electrons by the outer part of the external electron. According to other previously given prescriptions, both initial (bound) and final (continuum) wave functions are so polarized, only the length form of the matrix is calculated, and bilinear terms from the polarization contributions are retained (although their effect in this calculation is small). The results themselves are essentially identical to those of a recent diagrammatic calculation of Chang and Poe (1975) (in the region below 5 eV where thay have calculated), and as such they differ in certain significant components from exchange-adiabatic and extended-polarization results of Matese and LaBahn (1969) (although their overall result is similar). The s- and p-wave e-Li(+) phase shifts, which are derived as by-products of this calculation, are also presented and compared with other phase-shift calculations.

Bhatia, A. K.↗

Echoes of the Past, Glimpses of the Future - Ongoing Trends in Assurance of EEE Parts for Spaceflight

This presentation will review some past NASA presentations that had identified challenges and future trends in the assurance of Electrical, Electronic and Electromechanical (EEE) parts for spaceflight applications. It will contrast the concerns expressed in those presentations with the challenges of today and identify trends that give insight into the future. Common themes include the use of commercial parts, limited technical and physical resources, the pace of technology change and the difficulties in handling and testing individual parts as they become smaller and more complex. Some options for dealing with these challenges will be suggested to accommodate increasing numbers of smallsats, cubesats, constellations and other disruptive concepts, as space becomes more and more commercialized.

NASA Electronic Parts and Packaging (NEPP) Program↗

Past, Present and Future Trends for NASA's EEE Parts Program

The foundation of NASA's Electrical, Electronic and Electromechanical (EEE) parts program is standardization. Standardization helps to reduce the number of unknown variables present as a project or program progresses; unknown variables equate to unknown risk. NASA spacecraft are usually 'one-offs' or at least part of a very short run, and every new part that is used represents a risk that has to be understood and mitigated as necessary. This equates directly to time and cost. Standardization of component parts is used to provide a foundation of known, dependable, qualified parts upon which a safe, reliable system can be built. In addition, the evaluation and selection of parts for the standard parts list unifies the activity under one group of experts rather than having engineers on each project overlapping and duplicating efforts. Thus, the project support engineers are able to concentrate on understanding and mitigating the risks for the non standard parts required to meet specific requirements of their project. Rapid technology change is producing conditions that make any form of parts-based standardization increasingly difficult, particularly the use of Commercial Off The Shelf (COTS) parts and assemblies. There are many complications to COTS-based standardization. COTS parts change rapidly and unpredictably, often have different characteristics fiom manufacturer to manufacturer, frequently are only available through distribution, have no universal specification and have variable and unpredictable radiation characteristics. This presentation will discuss some potential approaches to COTS parts standardization. Further into the future, in three to five years perhaps, the use of COTS boards and boxes will be extensive and standardization at these levels of assembly will be necessary. In five to ten years, most major spacecraft functions will probably be performed by COTS boards. How will this be achieved? What role will the parts engineer play, if any? This presentation will borrow from the lessons of the past to suggest some scenarios for the future.

Sampson, Michael J.↗

EBF3 Design and Sustainability Considerations

Electron beam freeform fabrication (EBF3) is a cross-cutting technology for producing structural metal parts using an electron beam and wire feed in a layer-additive fashion. This process was developed by researchers at NASA Langley to specifically address needs for aerospace applications. Additive manufacturing technologies like EBF3 enable efficient design of materials and structures by tailoring microstructures and chemistries at the local level to improve performance at the global level. Additive manufacturing also facilitates design freedom by integrating assemblies into complex single-piece components, eliminating flanges, fasteners and joints, resulting in reduced size and mass. These same efficiencies that permit new design paradigms also lend themselves to supportability and sustainability. Long duration space missions will require a high degree of self-sustainability. EBF3 is a candidate technology being developed to allow astronauts to conduct repairs and fabricate new components and tools on demand, with efficient use of feedstock materials and energy.

Taminger, Karen M. B.↗

Interpretable, extensible linear and symbolic regression models for charge density prediction using a hierarchy of many-body correlation descriptors

Here, density functional theory (DFT) is routinely used to make electronic structure predictions for high-throughput screening of materials and molecules for technologically relevant areas, like the identification of better catalysts, electronic materials, and drug discovery. However, the DFT formalism is limited by (a) its poor (quadratic-to-quartic) scaling, and (b) the need to perform repeated eigenvalue computations of the electronic Hamiltonian as part of its self-consistent field (SCF) iteration procedure to obtain the converged ground state electron density, ρ (r). Approaches that directly predict ρ (r) of a structure with high accuracy can accelerate conventional SCF calculations and can also be used in linearly scaling methods such as orbital-free DFT. To this end, we present a procedure to predict the ground state electron density of molecular and periodic three-dimensional systems directly from the atomic structure with a particular emphasis on physical interpretability. In our framework, ρ (r) is modeled using many-body correlation descriptors that accurately capture the effects of local atomic arrangements in the neighborhood of a grid point. Our use of a linear regression scheme to fit to charge density data enables transparent analysis of the relative contributions of various types of local atomic correlations. By systematically including increasingly complex correlations, our model is shown to accurately predict ρ (r) for a variety of chemically and electronically diverse systems — amorphous Ge, Al(001) slab, crystalline Ga 2 O 3 , molecular benzene, and polyethylene. We then demonstrate a symbolic regression-based protocol to construct easily computable, interpretable features from lower-order correlations that significantly improves our electron density predictions with effectively no increase in the computational cost.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Structure-property relationships and mobility optimization in sputtered La-doped BaSn O 3 films: Toward 100cm 2 V -1 s -1

he wide band gap semiconducting perovskite BaSnO 3 is of high current interest due to outstanding room temperature mobility at high electron density, fueled by potential applications in oxide, transparent, and power electronics. Due in part to a lack of lattice-matched substrates, BaSnO 3 thin films suffer from high defect densities, however, limiting electron mobility. Additionally, the vast majority of BaSnO 3 thin film research has focused on pulsed laser deposition or molecular beam epitaxy. In this work, we present an exhaustive optimization of the mobility of Ba 0.98 La 0.02 SnO 3 films grown by a scalable, high-throughput method: high-pressure-oxygen sputter deposition. Considering target synthesis conditions, substrate selection, buffer layer structure, deposition temperature, deposition rate, thickness, and postdeposition annealing conditions, and by combining high-resolution x-ray diffraction, reciprocal space mapping, rocking curve analysis, scanning transmission electron microscopy, atomic force microscopy, and temperature-dependent electronic transport measurements, detailed understanding of synthesis-structure-property relationships is attained. Optimized room temperature mobility of 96 cm 2 V –1 s –1 is achieved in vacuum-annealed GdScO 3 (110)/BaSnO 3 (120 nm)/Ba 0.98 La 0.02 SnO 3 (200 nm) heterostructures, as well as 92 cm 2 V –1 s –1 on unbuffered substrates and 87 2 V –1 s –1 without postdeposition annealing. These results, including important trends in defect densities and a surprising dependence of mobility on lattice mismatch, substantially expand the understanding of the interplay between deposition conditions, microstructure, and transport in doped BaSnO 3 films, establishing competitive mobilities in films fabricated via a scalable, high-throughput, industry-standard technique.

36 MATERIALS SCIENCE↗

Electron microscopy data on irradiation effects in glassy carbon, nuclear graphite, pyrolytic carbon, and carbon fibers

Glassy carbon, a monoatomic allotrope of carbon, is a candidate material for components in fission nuclear power systems due to its radiation tolerance. This article presents comprehensive electron microscopy data revealing the effects of neutron and electron irradiation on glassy carbon. For comparison, additional data are provided for pyrolytic graphite and carbon fibers, materials that exhibit similar structural behavior under irradiation. In situ electron irradiation experiments further illustrate the real-time microstructural evolution of glassy carbon during exposure. The dataset is organized into five parts: (1) transmission electron microscopy (TEM) micrographs of as-received and neutron-irradiated glassy carbon; (2) TEM micrographs of neutron-irradiated graphite; (3) TEM micrographs of unirradiated and irradiated carbon–carbon composites; (4) TEM micrographs of pyrolytic carbon specimens in both conditions; (5) scanning transmission electron microscopy (STEM) micrographs of as-received and neutron-irradiated glassy carbon and (6) in situ electron irradiation data of a glassy carbon particle. These datasets provide valuable insights into radiation-induced structural changes in carbon-based materials relevant to nuclear applications.

36 MATERIALS SCIENCE↗