Experimental investigation of thermal stratification development in boiling water reactor suppression pools during reactor core isolation cooling system operation
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In an effort to transform future space power system architectures and operations, the Advanced Modular Power Systems (AMPS) project is currently developing an interface standard for power electronic modules to enable modular architectures for space power systems. Each architecture would consist of one or more modular electronic units (MEU) that would comprise of a tailored combination of modules. The standard currently comprises modules enabling switchgear, power conversion, and data interfacing. The objective of the AMPS project is to enable the modularity and interchangeability of different architectures using these standardized modules in hopes of reducing complexity and cost, increasing inherent redundancy and reliability, and minimizing power system redesign for future programs. A key enabler to these future modular architectures will be the thermal management system, which has to contend with acquiring heat from the electronics modules at the card level and then transporting that heat to the radiator of the larger system. The focus of this paper, therefore, will be the thermal design and analysis of multiple AMPS power electronics modules and the development of their thermal-vacuum test.
Epoxy-potted surface mount electrical components are shown to be vulnerable to thermal stress. An alternate coating is shown to relieve that stress.
Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.
Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.
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Nanoclay enhances the actuation of thermally-responsive 3D-printed hydrogel bilayers.
Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.
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PROTECT (Production and Reuse Of Thermally Efficient Ceramic TPS) is a NASA Early Career Initiative focused on developing the next generation of reusable ceramic thermal protection systems (TPS). This project addresses key challenges in TPS design, including temperature capability, thermal stability, and refurbishment time, by integrating novel material development with predictive modeling. Leveraging enhanced capabilities in NASA’s Porous Microstructure Analysis (PuMA) software, PROTECT introduces new modeling tools to predict the thermal and mechanical behavior of fibrous ceramic materials. These tools enable accurate prediction of performance metrics such as thermal conductivity and structural integrity, reducing reliance on costly physical testing. Preliminary advances in these areas will be presented. To support model validation, PROTECT is building a comprehensive database of raw material properties using advanced characterization techniques, including micro computed tomography (CT) scanning in collaboration with the University of Illinois Urbana-Champaign (UIUC). The presentation will detail the sampling workflows and analysis methods used to generate this detailed microstructural data and how it is used to develop improved models in PuMA. This multi-center collaboration, spanning NASA (JSC, ARC, KSC, GRC), Oak Ridge National Laboratory, UIUC, and SpaceX, is developing tailored TPS solutions for LEO, lunar, and Martian missions. By bridging heritage systems with the demands of modern spaceflight, PROTECT contributes to the advancement of reusable TPS technologies for future exploration missions.
The effects of the space environment on the thermal expansion stability of metal matrix composites (graphite/Al and graphite/Mg) will be presented. A sample from each category of metal matrix composites mounted on the leading and trailing edge was chosen for analysis of the temperature-time-thermal strain histories. Typical thermal expansion curves over the same range of temperature were selected at the beginning, mid, and end of the recording duration. The thermal expansion of selected post-flight LDEF samples were measured over the same range of temperature in the laboratory using a Michelson laser interferometer. The thermal strains were monitored concurrently with a laser interferometer and a mounted strain gage.
The Sixth Annual Thermal and Fluids Analysis Workshop was held at the Ohio Aerospace Institute, Brook Park, Ohio cosponsored by NASA Lewis Research Center and the Ohio Aerospace Institute, August 15-19, 1994. The workshop consisted of classes, vendor demonstrations, and paper sessions. The classes and vendor demonstrations provided participants with the information on widely used tools for thermal and fluids analysis. The paper sessions provided a forum for the exchange of information and ideas among thermal and fluids analysis. Paper topics included advances a uses of established thermal and fluids computer codes (such as SINDA and TRASYS) as well as unique modeling techniques and applications.
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Human thermal analysis and model development inform NASA’s space suit development, vehicle/habitat design, and survivability studies. Historically, human thermal models such as the 41-node metabolic man (METMAN) and the Wissler model have been standalone software tools developed with FORTRAN, a programming language known for its high performance in computationally intensive applications. Though efficient, these standalone programs pose challenges to coupled human-system analysis with detailed life support and thermal control subsystem models in other commercial software. This paper describes the conversion of the METMAN human thermal model from a standalone FORTRAN program to a model in Thermal Desktop (Ansys), a commonly used CAD-based simulation software for engineering that specializes in heat transfer, thermal radiation, and fluid flow analysis. This format was chosen to best facilitate model sharing and compatibility, enabling the direct integration of METMAN human thermal analysis with subsystem models across NASA programs and commercial partners.