Results for “Package” — Page 3

DOE OSTI2022

Textile Carbon Fiber Packaging and NCF Production

This Technical Collaboration Project focused on packaging large tow (≥ 10 grams/meter) textile carbon fibers, for which currently there is no suitable method. Prior to this project, Oak Ridge National Laboratory (ORNL) used a crude packaging approach to deliver (approximately) 100-meter packages for evaluation by intermediates producers, composites fabricators and other collaborators. That packaging approach was simply a hoop wrap on a standard 75 mm (3 inch) cardboard tube, with paper interleaved between layers and little or no tension control during spooling. While this approach was very effective for initial fiber development and sample fiber and small composite sample evaluation, these packages were inadequate for larger-scale demonstrations and more extensive applications development. The paper-interleaved packages were inconsistent, wasteful, and too small for commercial utilization; they were designed as a quick and simple means to package material for delivery into prototyping operations and were never expected to satisfy industrial requirements for commercial production. This project aimed to develop a commercially relevant approach for packaging large tow textile carbon fibers for robust delivery into downstream commercial intermediates and composites production operations. The development of robust packaging equipment that delivers packages meeting industrial requirements is essential to commercial implementation. In this project, the team identified packaging requirements, created a design, and prototyped a new packaging concept at ORNL’s Carbon Fiber Technology Facility (CFTF) and resulting packages were tested in production of non-crimp fabric (NCF).

42 ENGINEERING↗

NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗

NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗

NASA NTRSDate not supplied

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

NASA NTRSDate not supplied

Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications

A prototype high temperature co-fired ceramic (HTCC) alumina packaging system composed of a 32-I/Os package and a compatible circuit board was previously developed and demonstrated for long term operation in 500 °C environments. The electrical / dielectric parasitic parameters of that chip level package were characterized and reported. This co-fired packaging system with platinum (Pt) conductor has successfully facilitated tests of silicon carbide (SiC) analog and digital integrated circuits (ICs) developed at NASA GRC at 500°C for up to 10,000 hours in ambient oven environment and 60 earth days in Venus surface environment with simulated temperature, pressure, and chemical constituents. Based on these previous results, this paper introduces new designs of Pt-HTCC packages with 16, 24, and 44 I/Os for packaging a new generation SiC ICs with 8, 24, 56, 62, and 72 I/Os to be tested in high temperature harsh environments. The package with 44 I/Os is specifically designed for the new SiC ICs with 56, 62, and 72-I/Os and electrical connection needs, the power pads of this package are consolidated, and an array of I/O pads distributed on separated vertical levels (inside the package) is used to control the overall package dimensions and mitigate the parasitic effects at high temperatures. This paper will present the detailed design of these chip-level packages and results of electrical and dielectric characterization of these newly fabricated chip-level Pt-HTCC packages.

High temperature↗

DOE OSTI2020

Assessment of Existing Transportation Packages for Use with HALEU

Commercial light water reactor operators and fuel vendors in the United States are pursuing changes to fuel that include increased 235 U enrichment. Economic studies generally anticipate maximum near-term fuel assembly designs with up to 8 wt.% 235 U. Many next-generation nuclear reactor designs require high-assay low-enriched uranium (HALEU) (19.75 wt.% > 235 U > 5 wt.%) fuel. One necessary element for the commercial-scale use of HALEU is the ability to safely transport large quantities of enriched fuel material in multiple forms. However, there is uncertainty as to whether subcriticality requirements can be satisfied with existing package designs and whether existing critical benchmark experiment data are sufficient to support criticality safety code validation for HALEU transportation applications. This study assesses the potential to use currently licensed transportation packages for the transportation of increased enrichment unirradiated U fuel forms. The assessment uses selected package designs that represent the five categories of fuel form-boiling water reactor pins and assemblies, pressurized water reactor pins and assemblies, UF 6 , U-metal and tristructural isotropic (TRISO) particles, and UO 2 pellets or powder-and focuses on demonstrating subcriticality and identifying benchmark critical experiments appropriate for use in criticality computer code validation. Key quantities of interest that relate to subcriticality are limiting conditions (e.g., optimum moderation), package or package array k eff , package capacity, and package transportation array size. The SCALE TSUNAMI-3D and TSUNAMI Indices and Parameters codes are used for sensitivity and uncertainty calculations and for identification of candidate critical benchmark experiments for code validation. The primary metric for identifying candidate benchmarks is the similarity coefficient, c k . For each fuel form category, a representative package is evaluated. Results provided for each package evaluation include enrichment and packaging limits (e.g., maximum transportation array size as a function of enrichment) and benchmark critical experiment similarity coefficients. Results indicate that there are viable means for increasing enrichments into the HALEU range across the spectrum of fuel forms with differing increase amounts available for different packages. Sources of subcriticality margin to offset increased enrichment reactivity include reduced transportation array size, reduced fissile mass, burnable absorber credit, and safety analysis margin harvesting. For all packages except the DN-30, numerous critical benchmark experiment candidates for validation were identified.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

DOE OSTI2020

Codisposal Waste Package Loading Options for DOE SNF and HLW PPT

The U.S. Department of Energy (DOE) is responsible for managing spent nuclear fuel (SNF) that is currently in, or will in the future come into, its possession. DOE must continue to safely store that SNF, transport it to an interim storage site or a repository, and dispose of it. These fuels come from a wide range of reactor types with various cladding materials and enrichments. Many of these reactors, now decommissioned, had unique design features, such as core configuration, fuel element and assembly geometry, moderator and coolant materials, operational characteristics, and neutron spatial and spectral properties, resulting in a large diversity of reactor and fuel designs. Because of the wide variety and conditions of SNF, a robust DOE Standard Canister was proposed that would confine radionuclides and preclude moderator. The DOE Standard Canister had four variations: 3.05-meter (10-foot) or 4.57-meter (15-foot) length, and 45.7-cm (18-inch) or 61.0-cm (24-inch) diameter. For ultimate disposal in the Yucca Mountain Repository, these canisters were to be grouped with 61.0-cm (24-inch) diameter high level waste (HLW) canisters in a 2.13-meter (84-inch) diameter co-disposal waste package. The smaller 45.7-cm (18-inch) diameter DOE Standard Canister could be placed in the middle of five HLW canisters. The larger 61.0-cm (24-inch) diameter DOE Standard Canister would take the place of one of the five HLW canisters on the outer ring in the co-disposal waste package. No DOE Standard Canisters have been loaded. A preliminary evaluation has estimated the number of elements of a fuel type that can fit into the different sizes of the DOE Standard Canister, but no definitive loading configuration has been selected. Changing the loading configuration could impact the number of loadable DOE Standard Canisters and the number of co-disposal waste packages needed for eventual disposition. This paper conveys the ranges of DOE Standard Canisters and HLW canisters that may be produced under certain conditions. It also examines the differences in the estimated number of co-disposal waste packages produced for eventual disposal when using different loading strategies in the DOE Standard Canister for Advanced Test Reactor (ATR), Peach Bottom, and High Flux Isotope Reactor (HFIR) SNF. Changing the loading configurations of ATR, Peach Bottom, and HFIR SNF slightly impacted the number of co-disposal waste packages that may be needed for ultimate disposal. The change in loading configuration was more impactful when a different canister was used, as opposed to varying the number of elements that could fit inside the same size canister. In one case, a reduction of co-disposal waste packages could be achieved by allowing mixing of short HLW canisters with long DOE Standard Canisters. The main conclusion from this analysis is that the ratio between HLW canisters and DOE Standard Canisters will drive the total number of co-disposal waste packages. If too many HLW canisters (i.e., more than five times the number of 18-inch DOE standard canisters) or DOE Standard Canisters are produced, some co-disposal waste packages may not have all positions filled. A co-disposal waste package may be filled with all HLW with no DOE Standard Canister, or a co-disposal waste package could be filled with a single DOE Standard Canister. A ratio that does not closely align to optimum could allow for the design of waste packages that hold just HLW canisters or just DOE SNF canisters.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

DOE OSTI2020

Hydrogen Transport in a Model 9979 Shipping Package with Inner Convenience Cans

Radiolytic hydrogen production and accumulation inside containment packages is a concern at any facility responsible for their packaging, storage, transportation, and/or disposal. When hydrogen gas accumulates to concentrations above the Lower Flammability Limit (LFL) which is 4% or 40,000 ppm in air, the possibility of a deflagration or explosion increases. This concern persists over the course of the package lifetime which is unlimited when disposed of by burial or in permanent repositories. Here, we report on a numerical model used to predict the concentration of hydrogen within each layer of a Model 9979 package containing a convenience can assembly. Simulations show the hydrogen concentration to always be highest in the inner convenience can containing the radioactive source. When the radioactive source is within the Los Alamos National Laboratory (LANL) Packaging Limits, the hydrogen concentration is shown to remain well below the LFL at all times including packaging, storage, transportation, and disposal. A hydrogen transport model is presented for a Model 9979 package system containing a nested arrangement of convenience cans, which are tin oxide coated steel cans of various sizes with a slip-lid assembly. The inner convenience can contains the radioactive source material along with an unknown quantity of incidental water acquired from humid air or processing. While visible organic materials such as paper and plastics were purposely excluded from the inner can, it is not possible to claim the wastes are entirely organic free. The inner convenience can is tape sealed and placed into a plastic bag which is horsetail closed (i.e., twisted and taped). The bagged can is placed into an outer convenience can that is also tape sealed. The can assembly is then placed into the 30 gallon drum and subsequently placed inside the 55 gallon drum in the 9979 package. Here we assume hydrogen gas is produced in the inner convenience can from alpha radiolysis of water at a rate dependent on the quantity of uranium isotopes and water present. The hydrogen transport model was used to calculate hydrogen accumulations within the package’s five layers at different times and conditions. These simulations serve two purposes; (i) to build confidence in the model by comparing predicted values to measured values, and (ii) to check the steady state hydrogen concentrations that are approached at long times in the package’s lifetime. Model simulations were compared to gas samples taken from the 30 gallon drum after storage at LANL’s Chemistry and Metallurgy Research (CMR) building for around 500 days. Hydrogen concentration calculations over much longer periods (i.e., more than 270 years) included extreme storage durations, transportation at extreme cold temperatures, and disposal of packages assuming different average temperatures.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

NASA NTRS2013

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Ramesham, Rajeshuni↗

DOE OSTI2020

Co-Disposal Waste Package Loading Options for DOE SNF and HLW - 20331

The U.S. Department of Energy (DOE) is responsible for managing spent nuclear fuel (SNF) that is currently in, or will in the future come into, its possession. DOE must continue to safely store that SNF, transport it to an interim storage site or a repository, and dispose of it. These fuels come from a wide range of reactor types with various cladding materials and enrichments. Many of these reactors, now decommissioned, had unique design features, such as core configuration, fuel element and assembly geometry, moderator and coolant materials, operational characteristics, and neutron spatial and spectral properties, resulting in a large diversity of reactor and fuel designs. Because of the wide variety and conditions of SNF, a robust DOE Standard Canister was proposed that would confine radionuclides and preclude moderator. The DOE Standard Canister had four variations: 3.05-meter (10-foot) or 4.57-meter (15-foot) length, and 45.7-cm (18-inch) or 61.0-cm (24-inch) diameter. For ultimate disposal in the Yucca Mountain Repository, these canisters were to be grouped with 61.0-cm (24-inch) diameter high level waste (HLW) canisters in a 2.13-meter (84-inch) diameter co-disposal waste package. The smaller 45.7-cm (18-inch) diameter DOE Standard Canister could be placed in the middle of five HLW canisters. The larger 61.0-cm (24-inch) diameter DOE Standard Canister would take the place of one of the five HLW canisters on the outer ring in the co-disposal waste package. No DOE Standard Canisters have been loaded. A preliminary evaluation has estimated the number of elements of a fuel type that can fit into the different sizes of the DOE Standard Canister, but no definitive loading configuration has been selected. Changing the loading configuration could impact the number of loadable DOE Standard Canisters and the number of co-disposal waste packages needed for eventual disposition. This paper conveys the ranges of DOE Standard Canisters and HLW canisters that may be produced under certain conditions. It also examines the differences in the estimated number of co-disposal waste packages produced for eventual disposal when using different loading strategies in the DOE Standard Canister for Advanced Test Reactor (ATR), Peach Bottom, and High Flux Isotope Reactor (HFIR) SNF. Changing the loading configurations of ATR, Peach Bottom, and HFIR SNF slightly impacted the number of co-disposal waste packages that may be needed for ultimate disposal. The change in loading configuration was more impactful when a different canister was used, as opposed to varying the number of elements that could fit inside the same size canister. In one case, a reduction of co-disposal waste packages could be achieved by allowing mixing of short HLW canisters with long DOE Standard Canisters. The main conclusion from this analysis is that the ratio between HLW canisters and DOE Standard Canisters will drive the total number of co-disposal waste packages. If too many HLW canisters (i.e., more than five times the number of 18-inch DOE standard canisters) or DOE Standard Canisters are produced, some co-disposal waste packages may not have all positions filled. A co-disposal waste package may be filled with all HLW with no DOE Standard Canister, or a co-disposal waste package could be filled with a single DOE Standard Canister. A ratio that does not closely align to optimum could allow for the design of waste packages that hold just HLW canisters or just DOE SNF canisters. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

DOE OSTI2024

Deeplynx Airflow Provider Package

The DeepLynx Airflow Provider Package is a python package used to interact with the data warehouse DeepLynx when using the workflow orchestration tool Apache Airflow. This python package is packaged together using the airflow package standard so that it can be easily installed and used in any Apache Airflow environment. This package is meant to encapsulate the DeepLynx API for use in Airflow so that any interactions with DeepLynx that a user may want to use in their Airflow workflow can be easily accomplished using this provider package. This allows us to develop, implement, and test our DeepLynx-Airflow interactions in one provider package repository, and then easily install and use this package in any airflow instance. This DeepLynx Airflow Provider Package will be used extensively by the DeepLynx DAG repository.

Cavaluzzi, JackM↗

DOE OSTI2025

ORNL Package Testing Program Overview

When transporting radioactive or hazardous materials, safety and security are top priorities. Packaging and transportation regulations require reliable evidence that containers have passed rigorous performance tests to ensure that the public and the environment are protected from the hazardous nature of the cargo. Because of its long history in energy and security research, Oak Ridge National Laboratory (ORNL) has needed to ship hazardous packages for the past 65 years. Since the 1940s, ORNL has made significant contributions to transportation regulations and has been at the forefront of regulatory testing development. Today, ORNL is a leader in standards development and testing of designs of radioactive material packages. ORNL plays a critical role in ensuring the safe transportation of radioactive materials across the United States by executing rigorous testing campaigns of packages that contain radioactive materials. Early testing activities focused on supporting the development of transportation regulations established by both the International Atomic Energy Agency (IAEA) and the United States. Currently, all package testing activities are performed under the Package Testing Program (PTP) at the Package Evaluation Facility (PEF) located at the National Transportation Research Center (NTRC), which is about 10 miles from the main ORNL campus. The PTP develops and evaluates testing solutions, ensuring that they are safe efficient, and in compliance with regulatory requirements. The vision for the PTP is to be a world-class leader in the evaluation and testing of radioactive and hazardous material packages. The key elements necessary to fulfill this mission are an experienced and professional staff; state-of-the-art facilities, equipment, and instrumentation; and completion of challenging programs and projects important to package transportation. Collaborations with other internal and external organizations play a significant role in building stronger teams and achieving this vision. By adhering to and advancing regulatory standards, ORNL’s PTP supports development of safe and compliant packaging, safeguarding the transportation process from potential risks associated with radioactive material logistics.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

NASA NTRS1992

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

Shalkhauser, K. A.↗

NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗

NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗

NASA NTRS2010

Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

LaBel, Kenneth A.↗

NASA NTRS2017

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗

DOE OSTI2022

When One Cannot Bypass the Byproducts: Plastic Packaging Waste Embedded in Production and Export

While packaging is praised for reducing waste of perishable food products, packaging waste is a growing concern. Its least recyclable type, plastics waste, is increasingly polluting the marine environment and many developing countries are now refusing to take the waste from developed countries. Before responsibility can be established, one has to identify the key producers and consumers. This paper adjusts the packaging waste satellite account in EXIOBASE 3 by combining the official waste data published by the World Bank. Based on input-output methods, we find that the world's top suppliers of plastic packaging waste are the United States, China, and Brazil. Food and beverage products constitute the bulk of the problem. Yet, 21% of these countries' plastic packaging waste is induced export. At the global level, it is 25.8%. About 76.0% of export-induced plastic packaging waste corresponds to packaging of the exported goods that will ultimately be disposed of in the destination country; while the others correspond to the packaging used in their supply-chain and wasted domestically. We conclude that international efforts need to assign shared responsibility and promote improvement in plastic packaging recyclability.

environment responsibility↗