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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 577 records · Page 32

Ceramic wiring board increases packaging density of electronic modules

Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.

Hamley, L. D.↗

Modal analysis computer program package

Modal analysis computer program package for finding frequencies and mode shapes of any linear discrete system governed by generalized eigenvalue equation

Mather, D. L.↗

Packaging concept for LSI beam lead integrated circuits

Development of packaging system for mounting beam lead integrated chip circuit on lead frame is discussed. Process for fabricating large scale integration circuits is described. Diagrams illustrating method of construction are included.

Kennedy, B. W.↗

FORTRAN read package

Flexible input schemes for digital programs are described. No card format or special order of cards is required. Read package is controlled by small set of parameters which can be changed to account for differences in computers and digital programs.

Diekelman, D. P.↗