A ferry package for transporting reusable spacecraft and launch vehicles
Strap-on ferry package for reusable spacecraft and launch vehicles subsonic lift/drag increase
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Strap-on ferry package for reusable spacecraft and launch vehicles subsonic lift/drag increase
General Optimization Software Package for Electrical network and system design, noting application to engineering problems and education
High density packaging of micrologic flatpacks using high interconnection method for two-side use of double-sided card in space flight applications
Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.
Flight control software package for digital flight control and landing system of CH-46C helicopter
Guidance software package for digital flight control and landing system of CH-46C helicopter
System packaging of LSI circuits
TREETRAN subroutine package in FORTRAN 4 for manipulation of tree structured data
Modal analysis computer program package for finding frequencies and mode shapes of any linear discrete system governed by generalized eigenvalue equation
Study program to develop packaging techniques for space electrical power assemblies
Familiarization manual for Apollo Lunar Surface Experiments Package describing mission, equipment, subsystems, maintenance, and operations
Technology utilization briefs on packaging and containers
Vacuum packaged titanium bulk sublimator/ion pump combination for reducing tritium hazard in neutron accelerator
Si solar cell cover glass assembly and packaging improvements using Teflon
HF microcircuits packaging inside magnetic cores, discussing inherent advantages of RF interference and radiation shielding and heat transfer properties
Vacuum package with Ti bulk sublimator/ion pump combination for 150 kv neutron generator tritium decontamination
Development of packaging system for mounting beam lead integrated chip circuit on lead frame is discussed. Process for fabricating large scale integration circuits is described. Diagrams illustrating method of construction are included.
Flexible input schemes for digital programs are described. No card format or special order of cards is required. Read package is controlled by small set of parameters which can be changed to account for differences in computers and digital programs.