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At least 73 records · Page 4

A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber will also be discussed.

Saint Clair, A. K.↗

Screen Secures Detonator to Explosive Charge

Brass screen sleeve attaches blasting cap to fuse, shaped charge, detonating cord, or other formed explosive. Screen makes it easy to control distance between cap and charge, because user can see both parts, and to cool cap by convection, making use of low-cost blasting caps possible for some hot environments.

Moshenrose, H. D.↗

LARC-TPI: A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.

St.clair, A. K.↗

A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber is also discussed.

Saint Clair, A. K.↗

EDM Electrode for Internal Grooves

Electroerosive process inexpensive alternative to broaching. Hollow brass electrodes, soldered at one end to stainless-steel holding ring, held in grooves in mandrel. These electrodes used to machine grooves electrically in stainless-steel tube three-eights inch (9.5 millimeters) in diameter. Tool used on tubes already in place in equipment.

Ramani, V.↗

Status of Understanding for Gear Materials

Today's gear designer has a large selection of possible gear materials to choose from. The choice of which material to use should be based on the requirements of the application and will include the operating conditions of load, speed, and temperature in addition to reliability, weight, noise limitation, accuracy, and cost. The plastic materials are generally low in cost with low strength capabilities and are suitable for many light-duty applications. Die-cast alloy and sintered powder-metal gears are also fairly inexpensive and will operate at higher loads and temperatures than plastic gears. The three types of cast iron offer a medium-strength gear at a cost that varies with the accuracy of machining requirements. Gears can be manufactured from several aluminum alloys for lightweight and medium cost and may be anodized for improved load capacity. The copper alloys, bronze and brass, are more costly but have good sliding and wear properties that are useful for worm gear applications. The hot-forged powder-metal gears have the advantage of medium cost with good accuracy and high strength. Several low- to medium alloy steels are available for gear design and most can be heat treated for added strength. The medium-alloy gear materials offer high strength when case hardened and will satisfy most high-load medium-temperature applications. For more severe load, speed, and temperature requirements the advanced high temperature alloys must be used. These include EX-53, CBS 600, Vasco X-2, Super Nitralloy (5Ni-2Al), and forged AISI M-50. As the requirements become more stringent, the cost will also increase. It is necessary that the gear designer have a working knowledge of the various gear materials in order to match the most economical material with the design requirements.

Dennis P Townsend↗

Surface acoustic admittance and absorption of highly porous, layered, fibrous materials

Some acoustic properties of Kevlar-29 - a fine fibered, layered material is investigated. Kevlar is characterized by very high strength, uniform filaments arranged in a parallel batt where most filaments are random in the x-y plane but ordered as planes in the z direction. For experimental purposes, volume porosity, static flow resistance and mean filament diameter are used to identify the material. To determine the acoustic surface admittance of Kevlar, batts of the material are cut into small pads and placed into a standing wave tube terminated by a rigid brass plug. The attenuation and relative phase shift are recorded at each frequency in the range of 50 to 6000 Hz. Normalized conductance and susceptance are combined to form the acoustic absorption coefficient. The data are compared with theory by plotting the normalized admittance and normal incident absorption coefficient versus cyclic frequency.

Tesar, J. S.↗

Deformation and erosion of f.c.c. metals and alloys under cavitation attack

Experimental investigations have been conducted to determine the early stages of cavitation attack on 6061-T6 aluminum alloy, electrolytic tough pitch copper, brass, and bronze, all having polycrystalline fcc matrices. The surface profiles and scanning electron micrographs show that the pits are initially formed at the grain boundaries, while the grain surfaces are progressively roughened by multiple slip and twinning. The initial erosion is noted to have occurred from the material in the grain boundaries, as well as by fragmentation of part of the grains. Further erosion occurred by shearing and necking of the surface undulations caused by plastic deformation. The mean penetration depth, computed on the basis of mass loss, was lowest on the bronze and greatest on the copper. Attention is given to the relation of cavitation attack to grain size, glide stress and stacking fault energy.

Rao, B. C. S.↗

Spring-Loaded Joule-Thomson Valve

Improved design reduces clogging and maintains constant pressure drop as flow rate varies. Spring-Loaded Joule-Thomson Valve pressure drop regulated by spring pushing stainless-steel ball against soft brass seat. Pressure drop remains nearly constant, regardless of helium flow rate and of any gas contaminants frozen on valve seat. Because springloaded J-T valve maintains constant pressure drop, upstream roomtemperature throttle valve adjusts flow rate precisely for any given upstream pressure. In addition, new valve relatively invulnerable to frozen gas contaminants, which clog fixed-orifice J-T valves.

Jones, J. A.↗

Filters for Submillimeter Electromagnetic Waves

New manufacturing process produces filters strong, yet have small, precise dimensions and smooth surface finish essential for dichroic filtering at submillimeter wavelengths. Many filters, each one essentially wafer containing fine metal grid made at same time. Stacked square wires plated, fused, and etched to form arrays of holes. Grid of nickel and tin held in brass ring. Wall thickness, thickness of filter (hole depth) and lateral hole dimensions all depend upon operating frequency and filter characteristics.

Berdahl, C. M.↗

Pressure Rig for Repetitive Casting

Equipment life increased by improved insulation. New design cuts time of preparation for casting from several days to about 1 hour. Savings due to elimination of lengthy heating and drying operations associated with preparation of ceramic mold. Quality of casting improved because moisture in cavity eliminated by use of insulating material, and more uniform pressure applied to process. Commercial blanket insulator protects components from heat, increasing life of pressure rig and enabling repeated use. Improved heat protection allows casting of brass and other alloys with higher melting temperatures in pressure rig.

Vasquez, P.↗

The mechanism of erosion of metallic materials under cavitation attack

The mean depth of penetration rates (MDPRs) of eight polycrystalline metallic materials, Al 6061-T6, Cu, brass, phosphor bronze, Ni, Fe, Mo, and Ti-5Al-2.5Sn exposed to cavitation attack in a viscous mineral oil with a 20 kHz ultrasonic oscillator vibrating at 50 micron amplitude are reported. The titanium alloy followed by molybdenum have large incubation periods and small MDPRs. The incubation periods correlate linearly with the inverse of hardness and the average MDPRs correlate linearly with the inverse of tensile strength of materials. The linear relationships yield better statistical parameters than geometric and exponential relationships. The surface roughness and the ratio of pit depth to pit width (h/a) increase with the duration of cavitation attack. The ratio h/a varies from 0.1 to 0.8 for different materials. Recent investigations (20) using scanning electron microscopy to study deformation and pit formation features are briefly reviewed. Investigations with single crystals indicate that the geometry of pits and erosion are dependent on their orientation.

Rao, B. C. S.↗

Method of making macrocrystalline or single crystal semiconductor material

A macrocrystalline or single crystal semiconductive material is formed from a primary substrate including a single crystal or several very large crystals of a relatively low melting material. This primary substrate is deposited on a base such as steel or ceramic, and it may be formed from such metals as zinc, cadmium, germanium, aluminum, tin, lead, copper, brass, magnesium silicide, or magnesium stannide. These materials generally have a melting point below about 1000 C and form on the base crystals the size of fingernails or greater. The primary substrate has an epitaxial relationship with a subsequently applied layer of material, and because of this epitaxial relationship, the material deposited on the primary substrate will have essentially the same crystal size as the crystals in the primary substrate. If required, successive layers are formed, each of a material which has an epitaxial relationship with the previously deposited layer, until a layer is formed which has an epitaxial relationship with the semiconductive material. This layer is referred to as the epitaxial substrate, and its crystals serve as sites for the growth of large crystals of semiconductive material. The primary substrate is passivated to remove or otherwise convert it into a stable or nonreactive state prior to deposition of the seconductive material.

Shlichta, P. J.↗

Measuring Contact Thermal Conductances at Low Temperatures

Instrument measures thermal conductance of pressed contacts in liquid helium. Makes measurements automatically as function of force on pairs of brass samples having various surface finishes. Developed as part of effort to determine heat-transfer characteristics of bolted joints on cryogenically cooled focal planes in infrared equipment. Cylindrical chamber hangs from cover plate in bath of liquid helium. Inside chamber rocker arm applies controlled force to samples. Upper sample made slightly wider than lower one so two samples remain in complete contact even under slight lateral misalignment.

Salerno, Louis J.↗

Quantitative thermal characterization of thin plates

The principles of quantitative thermal testing of the mechanical integrity of platelike structures are discussed. In this technique, a scanned laser pulse is used to inject a thermal pattern in a sample, and a thermal IR imager is used to document the evolution of the pattern subsequent to injection. The measurements are remote, noncontacting, and one-sided, and the algorithms used to obtain diffusivity are all emissivity-independent. The results yielded by application of the three analytical techniques, used to obtain diffusivity values from the image data on stainless steel, a graphite-epoxy composite, brass, and aluminum 2024 samples, are presented.

Welch, C. S.↗

Local heat transfer augmentation in channels with two opposite ribbed surfaces

The local heat transfer coefficient distribution of a square channel with two opposite ribbed walls was determined. The square channel was connected to a sudden contraction entrance in order to simulate the inlet condition of the turbine blade cooling passages. The test channel was heated by thin stainless steel foils with a thickness of 0.000025 m, and instrumented with 180 thermocouples. The brass ribs of a square cross-section were glued periodically, in line, onto the top and bottom walls of the foil-heated channel in patterns to achieve the desired spacing and angle-of-attack. The local heat transfer coefficients on the smooth side and the ribbed side walls, at the channel entrance and the downstream regions, were measured for eight rib configurations and three Reynolds numbers (Re = 10,000, 30,000, and 60,000).

Han, J. C.↗

High-Resolution, Two-Wavelength Pyrometer

Modified two-color pyrometer measures temperatures of objects with high spatial resolution. Image focused on hole 0.002 in. (0.05 mm) in diameter in brass sheet near end of bundle, causing image to be distributed so fibers covered by defocused radiation from target. Pinhole ensures radiation from only small part of target scene reaches detector, thus providing required spatial resolution. By spreading radiation over bundle, pinhole ensures entire active area of detectors utilized. Produces signal as quiet as conventional instruments but with only 1/64 input radiation.

Bickler, Donald B.↗

Connecting Multiple Wires To A Single Through Hole

Small cup enables more than one wire to be soldered to plated through hole in printed-circuit board. Made of brass plated with silver. Inserted in eyelets or plated through holes and swaged onto boards. Used on breadboard circuits and on newly-manufactured circuit boards. Useful in modification of circuit boards, where they serve as convenient attachment points for jumper wires and leads of added components.

Cortes, Reuben, G.↗