Search NASASearch

SEARCH · Search NASA

Results for “eigenstate thermalization”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

697 records · Page 4

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

xEMU

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

thermal analysis

Power and Propulsion Element Steerable High Gain Antenna Lunar Transit Thermal Analysis Tracking Methodology

The Power and Propulsion Element (PPE) is an ion thruster propulsion spacecraft developed as an element of Space Reactor (SR-1) Freedom to provide propulsion, communications and power for the spacecraft. PPE was originally being developed for the use with the lunar orbiting space station Gateway as one of the first two planned elements. PPE was to be launched with the Habitation and Logistics Outpost (HALO) element in a configuration called the Co-Manifested Vehicle (CMV) that would arrive at a Near-Rectilinear Halo Orbit (NRHO) around the Moon via a lunar transit spiral trajectory phase. The PPE communication system is equipped with two Steerable High Gain Antennas (SHGA) each steered by a two-axis gimbal (TAG) mechanism. A thermal analysis was conducted during the near-Earth spiral phase of the mission using Thermal Desktop (TD). This analysis utilized multiple axis Earth tracking articulators in combination with SINDA system internal environmental heating symbols to produce accurate Earth ground station tracking communication system temperatures. This presentation provides an overview of the communication system thermal model and the analysis methodology.

Thermal Analysis

Thermal Analysis of the Advanced Modular Power Systems (AMPS) Power Electronic Modules

In an effort to transform future space power system architectures and operations, the Advanced Modular Power Systems (AMPS) project is currently developing an interface standard for power electronic modules to enable modular architectures for space power systems. Each architecture would consist of one or more modular electronic units (MEU) that would comprise of a tailored combination of modules. The standard currently comprises modules enabling switchgear, power conversion, and data interfacing. The objective of the AMPS project is to enable the modularity and interchangeability of different architectures using these standardized modules in hopes of reducing complexity and cost, increasing inherent redundancy and reliability, and minimizing power system redesign for future programs. A key enabler to these future modular architectures will be the thermal management system, which has to contend with acquiring heat from the electronics modules at the card level and then transporting that heat to the radiator of the larger system. The focus of this paper, therefore, will be the thermal design and analysis of multiple AMPS power electronics modules and the development of their thermal-vacuum test.

Modular Power Electronics

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherents

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

bondline thickness

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherends

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

X-ray computed tomography

Method and apparatus for providing thermal wear leveling

Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.

Roberts, David A.

PROTECT: Production and Reuse of Thermally Efficient Ceramic Thermal Protection Systems

PROTECT (Production and Reuse Of Thermally Efficient Ceramic TPS) is a NASA Early Career Initiative focused on developing the next generation of reusable ceramic thermal protection systems (TPS). This project addresses key challenges in TPS design, including temperature capability, thermal stability, and refurbishment time, by integrating novel material development with predictive modeling. Leveraging enhanced capabilities in NASA’s Porous Microstructure Analysis (PuMA) software, PROTECT introduces new modeling tools to predict the thermal and mechanical behavior of fibrous ceramic materials. These tools enable accurate prediction of performance metrics such as thermal conductivity and structural integrity, reducing reliance on costly physical testing. Preliminary advances in these areas will be presented. To support model validation, PROTECT is building a comprehensive database of raw material properties using advanced characterization techniques, including micro computed tomography (CT) scanning in collaboration with the University of Illinois Urbana-Champaign (UIUC). The presentation will detail the sampling workflows and analysis methods used to generate this detailed microstructural data and how it is used to develop improved models in PuMA. This multi-center collaboration, spanning NASA (JSC, ARC, KSC, GRC), Oak Ridge National Laboratory, UIUC, and SpaceX, is developing tailored TPS solutions for LEO, lunar, and Martian missions. By bridging heritage systems with the demands of modern spaceflight, PROTECT contributes to the advancement of reusable TPS technologies for future exploration missions.

Propulsion, Refractory, and Coating Materials

Thermal expansion behavior of LDEF metal matrix composites

The effects of the space environment on the thermal expansion stability of metal matrix composites (graphite/Al and graphite/Mg) will be presented. A sample from each category of metal matrix composites mounted on the leading and trailing edge was chosen for analysis of the temperature-time-thermal strain histories. Typical thermal expansion curves over the same range of temperature were selected at the beginning, mid, and end of the recording duration. The thermal expansion of selected post-flight LDEF samples were measured over the same range of temperature in the laboratory using a Michelson laser interferometer. The thermal strains were monitored concurrently with a laser interferometer and a mounted strain gage.

T. D. Le