Search NASA⌕ Search

SEARCH · Search NASA

Results for “Texas Instruments”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS1981

Heat Loss Imagery

Infrared scanning devices are being used to produce images that show, by color or black-and-white shading differences, which buildings and homes are losing heat to the outdoors, and how much. Heat loss surveys done by Texas Instruments, Daedalus Enterprises, Inc. and other companies have growing acceptance of their services among industrial firms, utilities, local governments, and state and federal agencies interested in promoting heat loss awareness and inspiring corrective actions.

Source record↗
NASA NTRS2004

DSP Implementation of the Retinex Image Enhancement Algorithm

The Retinex is a general-purpose image enhancement algorithm that is used to produce good visual representations of scenes. It performs a non-linear spatial/spectral transform that synthesizes strong local contrast enhancement and color constancy. A real-time, video frame rate implementation of the Retinex is required to meet the needs of various potential users. Retinex processing contains a relatively large number of complex computations, thus to achieve real-time performance using current technologies requires specialized hardware and software. In this paper we discuss the design and development of a digital signal processor (DSP) implementation of the Retinex. The target processor is a Texas Instruments TMS320C6711 floating point DSP. NTSC video is captured using a dedicated frame-grabber card, Retinex processed, and displayed on a standard monitor. We discuss the optimizations used to achieve real-time performance of the Retinex and also describe our future plans on using alternative architectures.

Hines, Glenn↗
NASA NTRS1996

Monolithic Microwave Integrated Circuit (MMIC) Phased Array Demonstrated With ACTS

Monolithic Microwave Integrated Circuit (MMIC) arrays developed by the NASA Lewis Research Center and the Air Force Rome Laboratory were demonstrated in aeronautical terminals and in mobile or fixed Earth terminals linked with NASA's Advanced Communications Technology Satellite (ACTS). Four K/Ka-band experimental arrays were demonstrated between May 1994 and May 1995. Each array had GaAs MMIC devices at each radiating element for electronic beam steering and distributed power amplification. The 30-GHz transmit array used in uplinks to ACTS was developed by Lewis and Texas Instruments. The three 20-GHz receive arrays used in downlinks from ACTS were developed in cooperation with the Air Force Rome Laboratory, taking advantage of existing Air Force integrated-circuit, active-phased-array development contracts with the Boeing Company and Lockheed Martin Corporation. Four demonstrations, each related to an application of high interest to both commercial and Department of Defense organizations, were conducted. The location, type of link, and the data rate achieved for each of the applications is shown. In one demonstration-- an aeronautical terminal experiment called AERO-X--a duplex voice link between an aeronautical terminal on the Lewis Learjet and ACTS was achieved. Two others demonstrated duplex voice links (and in one case, interactive video links as well) between ACTS and an Army high-mobility, multipurpose wheeled vehicle (HMMWV, or "humvee"). In the fourth demonstration, the array was on a fixed mount and was electronically steered toward ACTS. Lewis served as project manager for all demonstrations and as overall system integrator. Lewis engineers developed the array system including a controller for open-loop tracking of ACTS during flight and HMMWV motion, as well as a laptop data display and recording system used in all demonstrations. The Jet Propulsion Laboratory supported the AERO-X program, providing elements of the ACTS Mobile Terminal. The successful performance of experimental, proof-of-concept MMIC K/Ka-band arrays developed with U.S. industry in field demonstrations with ACTS indicates that high density MMIC integration at 20 and 30 GHz is indeed feasible. The successful development and demonstration of the MMIC array systems was possible only because of significant intergovernmental and Government/industry cooperation and the high level of teamwork within Lewis. The results provide a strong incentive for continuing the focused development of MMIC-array technology for satellite communications applications, with emphasis on packaging and cost issues, and for continuing the planning and conducting of other appropriate demonstrations or experiments of phased-array technology with ACTS. Given the present pressures on reducing funding for research and development in Government and industry, the extent to which this can be continued in a cooperative manner will determine whether MMIC array technology will make the transition from the proof-of-concept level to the operational system level.

Source record↗
NASA NTRS2004

DSP Implementation of the Multiscale Retinex Image Enhancement Algorithm

The Retinex is a general-purpose image enhancement algorithm that is used to produce good visual representations of scenes. It performs a non-linear spatial/ spectral transform that synthesizes strong local contrast enhancement and color constancy. A real-time, video frame rate implementation of the Retinex is required to meet the needs of various potential users. Retinex processing contains a relatively large number of complex computations, thus to achieve real-time performance using current technologies requires specialized hardware and software. In this paper we discuss the design and development of a digital signal processor (DSP) implementation of the Retinex. The target processor is a Texas Instruments TMS320C6711 floating point DSP. NTSC video is captured using a dedicated frame grabber card, Retinex processed, and displayed on a standard monitor. We discuss the optimizations used to achieve real-time performance of the Retinex and also describe our future plans on using alternative architectures.

Hines, Glenn D.↗
NASA NTRS2009

Performance of the THS4302 and the Class V Radiation-Tolerant THS4304-SP Silicon Germanium Wideband Amplifiers at Extreme Temperatures

This report discusses the performance of silicon germanium, wideband gain amplifiers under extreme temperatures. The investigated devices include Texas Instruments THS4304-SP and THS4302 amplifiers. Both chips are manufactured using the BiCom3 process based on silicon germanium technology along with silicon-on-insulator (SOI) buried oxide layers. The THS4304-SP device was chosen because it is a Class V radiation-tolerant (150 kRad, TID silicon), voltage-feedback operational amplifier designed for use in high-speed analog signal applications and is very desirable for NASA missions. It operates with a single 5 V power supply [1]. It comes in a 10-pin ceramic flatpack package, and it provides balanced inputs, low offset voltage and offset current, and high common mode rejection ratio. The fixed-gain THS4302 chip, which comes in a 16-pin leadless package, offers high bandwidth, high slew rate, low noise, and low distortion [2]. Such features have made the amplifier useful in a number of applications such as wideband signal processing, wireless transceivers, intermediate frequency (IF) amplifier, analog-to-digital converter (ADC) preamplifier, digital-to-analog converter (DAC) output buffer, measurement instrumentation, and medical and industrial imaging.

Patterson, Richard L.↗
NASA NTRS2010

Characterization of Low Noise, Precision Voltage Reference REF5025-HT Under Extreme Temperatures

The performance of Texas Instruments precision voltage reference REF5025-HT was assessed under extreme temperatures. This low noise, 2.5 V output chip is suitable for use in high temperature down-hole drilling applications, but no data existed on its performance at cryogenic temperatures. The device was characterized in terms of output voltage and supply current at different input voltage levels as a function of temperature between +210 C and -190 C. Line and load regulation characteristics were also established at six load levels and at different temperatures. Restart capability at extreme temperatures and the effects of thermal cycling, covering the test temperature range, on its operation and stability were also investigated. Under no load condition, the voltage reference chip exhibited good stability in its output over the temperature range of -50 C to +200 C. Outside that temperature range, output voltage did change as temperature was changed. For example, at the extreme temperatures of +210 C and - 190 C, the output level dropped to 2.43 V and 2.32 V, respectively as compared to the nominal value of 2.5 V. At cryogenic test temperatures of -100 C and -150 C the output voltage dropped by about 20%. The quiescent supply current of the voltage reference varied slightly with temperature but remained close to its specified value. In terms of line regulation, the device exhibited excellent stability between -50 C and +150 C over the entire input voltage range and load levels. At the other test temperatures, however, while line regulation became poor at cryogenic temperatures of -100 C and below, it suffered slight degradation at the extreme high temperature but only at the high load level of 10 mA. The voltage reference also exhibited very good load regulation with temperature down to -100 C, but its output dropped sharply at +210 C only at the heavy load of 10 mA. The semiconductor chip was able restart at the extreme temperatures of -190 C and +210 C, and the limited thermal cycling did not influence its characteristics and had no impact on its packaging as no structural or physical damage was observed.

Patterson, Richard↗
NASA NTRS2012

Stereo and IMU-Assisted Visual Odometry for Small Robots

This software performs two functions: (1) taking stereo image pairs as input, it computes stereo disparity maps from them by cross-correlation to achieve 3D (three-dimensional) perception; (2) taking a sequence of stereo image pairs as input, it tracks features in the image sequence to estimate the motion of the cameras between successive image pairs. A real-time stereo vision system with IMU (inertial measurement unit)-assisted visual odometry was implemented on a single 750 MHz/520 MHz OMAP3530 SoC (system on chip) from TI (Texas Instruments). Frame rates of 46 fps (frames per second) were achieved at QVGA (Quarter Video Graphics Array i.e. 320 240), or 8 fps at VGA (Video Graphics Array 640 480) resolutions, while simultaneously tracking up to 200 features, taking full advantage of the OMAP3530's integer DSP (digital signal processor) and floating point ARM processors. This is a substantial advancement over previous work as the stereo implementation produces 146 Mde/s (millions of disparities evaluated per second) in 2.5W, yielding a stereo energy efficiency of 58.8 Mde/J, which is 3.75 better than prior DSP stereo while providing more functionality.

Source record↗
NASA NTRS2015

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗
NASA NTRS2016

[STEM on Station Education]

The STEM on Station team is part of Education which is part of the External Relations organization (ERO). ERO has traditional goals based around BHAG (Big Hairy Audacious Goal). The BHAG model is simplified to a saying: Everything we do stimulates actions by others to advance human space exploration. The STEM on Station education initiate is a project focused on bringing off the earth research and learning into classrooms. Educational resources such as lesson plans, activities to connect with the space station and STEM related contests are available and hosted by the STEM on Station team along with their partners such as Texas Instruments. These educational activities engage teachers and students in the current happenings aboard the international space station, inspiring the next generation of space explorers.

Lundebjerg, Kristen↗
NASA NTRS2017

Total Ionizing Dose Test Report for the UC1823A Pulse Width Modulator

The purpose of this study is to examine the total ionizing dose susceptibility for the UC1823A pulse width modulator manufactured by Texas Instruments, Inc. The part is suspected to be vulnerable to enhanced low dose rate sensitivity (ELDRS).

enhanced low dose rate sensitivity (ELDRS↗
NASA NTRS2010

Radiation Performance of Commercial SiGe HBT BiCMOS-High Speed Operational Amplifiers

We present results on heavy-ion and proton irradiations for commercial SiGe BiCMOS operational amplifiers: LTC6400-20 from Linear Technology and THS4304 from Texas Instruments. We found that the devices are susceptible to heavy-ion-induced SETs. The SET cross-sections increase with increasing operating frequency. The LTC6400 exhibits a LET(sub th) < 7.4 MeV·sq cm/mg for frequencies ranging from 10 to 1000 MHz. The THS4304 exhibits a LET(sub th) < 4.4 MeV·sq cm/mg at 200 MHz; the LET(sub th) decreases with increasing frequency. The significance of the SETs also increases with frequency. The SETs at 1000 MHz can erase several signal cycles. We al.so found that the LTC6400 is relatively robust against 198 and 54 MeV protons. We did not observe angular sensitivity from the proton irradiations.

Chen, Dakai↗
NASA NTRS2017

LM193 Dual Differential Comparator Total Ionizing Dose Test Report

The purpose of this test was to characterize the flight lot of Texas Instruments' LM193 (flight part number is 5962-9452601Q2A) for total dose response. This test served as the radiation lot acceptance test (RLAT) for the lot date code (LDC) tested. Low dose rate (LDR) irradiations were performed in this test so that the device susceptibility to enhanced low dose rate sensitivity (ELDRS) was determined.

enhanced low dose rate sensitivity (ELDRS↗
NASA NTRS2021

SEE Test Report for Arizona Microtek AZ88923 High Speed Limiting Post Amplifier

The primary purpose of this testing is to characterize the Texas Instruments AZ88923 post amplifier for susceptibility to single-event latchup (SEL) and other destructive Single-Event Effects (SEE). These data will be used to assess the destructive SEE risk for the OSIRIS-REx Laser Altimeter (OLA). A secondary goal is to assess the susceptibility of the post amplifier to single-event transients (SET) and other nondestructive SEE. In particular, the loss-of-signal feature could give rise to some significant anomalies. However, it is not used on OLA.

Raymond Ladbury↗
NASA NTRS1974

Rigidity spectrum of z greater than or equal to 3 cosmic-ray nuclei in the range 4-285 GV and a search for cosmic antimatter

A measurement, using the magnetic emulsion spectrometer system, of the differential rigidity spectrum of Z greater than or equal to 3 nuclei of the galactic cosmic radiation is presented. The system was flown on Aug. 22, 1969, from Palestine, Texas. The instrument floated above 125,000 feet for eight hours. The data in the rigidity range 8-285 GV can be represented by a power-law spectrum in rigidity, J(rho) = A rho to the minus gamma power, with the exponent gamma = 2.6 plus or minus 0.10. The spectrum in the range 15-285 GV is also described by the same exponent, gamma = 2.6 plus or minus 0.25. The data below 8 GV cannot be described by the same power law without invoking solar modulation. A set of nonunique parameters for modulation are given. Upper limit for the fraction of antimatter in the rigidity range 4-125 GV is .005 with 95% confidence limit.

Golden, R. L.↗
NASA NTRS1994

Using Commercial Off-the-Shelf Software Tools for Space Shuttle Scientific Software

In October 1993, the Astronaut Science Advisor (ASA) was on board the STS-58 flight of the space shuttle. ASA is an interactive system providing data acquisition and analysis, experiment step re-scheduling, and various other forms of reasoning. As fielded, the system runs on a single Macintosh PowerBook 170, which hosts the six ASA modules. There is one other piece of hardware, an external (GW Instruments, Sommerville, Massachusetts) analog-to-digital converter connected to the PowerBook's SCSI port. Three main software tools were used: LabVIEW, CLIPS, and HyperCard: First, a module written in LabVIEW (National Instruments, Austin, Texas) controls the A/D conversion and stores the resulting data in appropriate arrays. This module also analyzes the numerical data to produce a small set of characteristic numbers or symbols describing the results of an experiment trial. Second, a forward-chaining inference system written in CLIPS (NASA) uses the symbolic information provided by the first stage with a static rule base to infer decisions about the experiment. This expert system shell is used by the system for diagnosis. The third component of the system is the user interface, written in HyperCard (Claris Inc. and Apple Inc., both in Cupertino, California).

Groleau, Nicolas↗