Search NASA⌕ Search

SEARCH · Search NASA

Results for “Encapsulation”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 145 records · Page 8

Feasibility study of silicon nitride protection of plastic encapsulated semiconductors

The application of low temperature silicon nitride protective layers on wire bonded integrated circuits mounted on lead frame assemblies is reported. An evaluation of the mechanical and electrical compatibility of both plasma nitride and photochemical silicon nitride (photonitride) passivations (parallel evaluations) of integrated circuits which were then encapsulated in plastic is described. Photonitride passivation is compatible with all wire bonded lead frame assemblies, with or without initial chip passivation. Plasma nitride passivation of lead frame assemblies is possible only if the chip is passivated before lead frame assembly. The survival rate after the environmental test sequence of devices with a coating of plasma nitride on the chip and a coating of either plasma nitride or photonitride over the assembled device is significantly greater than that of devices assembled with no nitride protective coating over either chip or lead frame.

Peters, J. W.↗

Integral Glass Encapsulation for Solar Arrays

Progress in the development of permanent, integral glass encapsulation of terrestrial solar photovoltaic arrays by electrostatic bonding is reported. Two basic types of electrostatically bonded modules were demonstrated and their reliability proven in accelerated environmental testing. Economic analyses indicate that electrostatic bonding can be a cost effective, practical, and automatable process for large-scale production of arrays with lifetimes of more than 20 years.

Source record↗

Low-cost encapsulation materials for terrestrial solar cell modules

The paper presents the findings of material surveys intended to identify low cost materials which could be functional as encapsulants (by 1986) for terrestrial solar cell modules. Economic analyses have indicated that in order to meet the low cost goal of $2.70 per sq m, some or all of the following material technologies must be developed or advanced: (1) UV screening outer covers; (2) elastomeric acrylics; (3) weatherproofing and waterproofing of structural wood and paper products; (4) transparent UV stabilizers for the UV-sensitive transparent pottants; and (5) cost-effective utilization of silicone and fluorocarbon materials.

Cuddihy, E. F.↗

Study program for encapsulation materials interface for low cost silicon solar array

An atmospheric corrosion model was developed and verified by five months of corrosion rate and climatology data acquired at the Mead, Nebraska LSA test site. Atmospheric corrosion rate monitors (ACM) show that moisture condensation probability and ionic conduction at the corroding surface or interface are controlling factors in corrosion rate. Protection of the corroding surface by encapsulant was shown by the ACM recordings to be maintained, independent of climatology, over the five months outdoor exposure period. The macroscopic corrosion processes which occur at Mead are shown to be reproduced in the climatology simulator. Controlled experiments with identical moisture and temperature aging cycles show that UV radiation causes corrosion while UV shielding inhibits LSA corrosion.

Kaelble, D. H.↗

Integral glass encapsulation for solar arrays

Electrostatic bonding technology, an encapsulation technique for terrestrial solar array was developed. The process produces full integral, hermetic bonds with no adhesives or pottants. Panels of six solar cells on a simple glass superstrate were produced. Electrostatic bonding for making the cell front contact was also developed. A metal mesh is trapped into contact with the cell front during the bonding process. Six cell panels using the bonded mesh as the only cell front contact were produced. The possibility of using lower cost glass, with a higher thermal expansion mismatch to silicon, by making lower temperature bonds is developed. However, this requires a planar surface cell.

Landis, G. A.↗

Prepolymer Syrup for Encapsulating Solar Cells

Clear polymer syrup, made by disolving n-butyl acrylate prepolymer in monomer, used to encapsulate solar cells by any of three standard processes (dipping, multiple coating, or automated machine coating). Use of cyclohexane instead of methanol/water solvent during initial polymerization stage maintains high molecular weight and raises yield of linear polymer to essentially 100 percent.

Gupta, A.↗

Solar-Cell Encapsulation by One-Step Lamination

Simple method of potting solar cells reduces encapsulating to one-step lamination process. Simplified process saves time and expense. Potting material is added to two inside faces of solar-cell assembly before they are sandwiched and cured.

Sarbolouki, M. N.↗

Investigation of Test Methods, Material Properties, and Processes for Solar Cell Encapsulants

Encapsulant materials and processes for the production of cost effective, long life solar cell modules are identified, and evaluated. Ethylene vinyl acetate lamination pottant studies are conducted with respect to the time/temperature cure requirements for successful use of this compound. The time needed to produce successful gel contents are redetermined at a variety of temperatures and are related to the peroxide half life temperature curve. Formulation of the butyl acrylate syrup casting pottant is complete. The formulation contains an ultraviolet stabilizer system and is cured with an initiator that presents no shipping or handling hazards. The catalyzed syrup is stable at room temperature and has a pot life of at least an eight hour period of time. The syrup cures to a transparent rubber in 18 minutes at a temperature of 60 C.

Willis, P. B.↗

Analysis of field usage failure rate data for plastic encapsulated solid state devices

Survey and questionnaire techniques were used to gather data from users and manufacturers on the failure rates in the field of plastic encapsulated semiconductors. It was found that such solid state devices are being successfully used by commercial companies which impose certain screening and qualification procedures. The reliability of these semiconductors is now adequate to support their consideration in NASA systems, particularly in low cost systems. The cost of performing necessary screening for NASA applications was assessed.

Source record↗

Design, analysis, and test verification of advanced encapsulation systems

Thermal, optical, structural, and electrical isolation analyses are decribed. Major factors in the design of terrestrial photovoltaic modules are discussed. Mechanical defects in the different layers of an encapsulation system, it was found, would strongly influence the minimum pottant thickness required for electrical isolation. Structural, optical, and electrical properties, a literature survey indicated, are hevily influenced by the presence of moisture. These items, identified as technology voids, are discussed. Analyses were based upon a 1.2 meter square module using 10.2 cm (4-inch) square cells placed 1.3 mm apart as shown in Figure 2-2. Sizing of the structural support member of a module was determined for a uniform, normal pressure load of 50 psf, corresponding to the pressure difference generated between the front and back surface of a module by a 100 mph wind. Thermal and optical calculations were performed for a wind velocity of 1 meter/sec parallel to the ground and for module tilt (relative to the local horizontal) of 37 deg. Placement of a module in a typical array field is illustrated.

Garcia, A.↗

Design, analysis, and test verification of advanced encapsulation systems

Design sensitivities are established for the development of photovoltaic module criteria and the definition of needed research tasks. The program consists of three phases. In Phase I, analytical models were developed to perform optical, thermal, electrical, and structural analyses on candidate encapsulation systems. From these analyses several candidate systems will be selected for qualification testing during Phase II. Additionally, during Phase II, test specimens of various types will be constructed and tested to determine the validity of the analysis methodology developed in Phase I. In Phse III, a finalized optimum design based on knowledge gained in Phase I and II will be developed. All verification testing was completed during this period. Preliminary results and observations are discussed. Descriptions of the thermal, thermal structural, and structural deflection test setups are included.

Mardesich, N.↗

Stoichiometry-controlled compensation in liquid encapsulated Czochralski GaAs

It is shown that the electrical compensation of undoped GaAs grown by the liquid encapsulated Czochralski technique is controlled by the melt stoichiometry. The concentration of the deep donor EL2 in the crystal depends on the As concentration in the melt, increasing from about 5 x 10 to the 15th per cu cm to 1.7 x 10 to the 16th per cu cm as the As atom fraction increases from 0.48 to 0.51. Furthermore, it is shown that the free-carrier concentration of semi-insulating GaAs is determined by the relative concentrations of EL2 and carbon acceptors. As a result, semi-insulating material can be obtained only above a critical As concentration (0.475-atom fraction in the material here) where the concentration of EL2 is sufficient to compensate residual acceptors. Below the critical As concentration the material is p type due to excess acceptors.

Holmes, D. E.↗

Development of a weatherable acrylic elastomer for solar cell encapsulation

Poly-n-butylacrylate (PnBA) will be discussed as a potential candidate to be used in solar cell encapsulation. A new process has been developed in which PnBA can be readily cross-linked from a solvent-free syrup by a thermal process to give a highly flexible transparent film which does not creep significantly at temperature of up to 90 C. This process can be automated without the use of high cost capital equipment. Photodegradation of PnBA has also been modeled as a function of wavelengths and intensities. Its photostability will be discussed.

Liang, R.↗

Compensation mechanism in liquid encapsulated Czochralski GaAs Importance of melt stoichiometry

It is shown that the key to reproducible growth of undoped semi-insulating GaAs by the liquid encapsulated Czochralski (LEC) technique is the control over the melt stoichiometry. Twelve crystals were grown from stoichiometric and nonstoichiometric melts. The material was characterized by secondary ion mass spectrometry, localized vibrational mode far infrared spectroscopy, Hall-effect measurements, optical absorption, and photoluminescence. A quantitative model for the compensation mechanism in the semi-insulating material was developed based on these measurements. The free carrier concentration is controlled by the balance between EL2 deep donors and carbon acceptors; furthermore, the incorporation of EL2 is controlled by the melt stoichiometry, increasing as the As atom fraction in the melt increases. As a result, semi-insulating material can be grown only from melts above a critical As composition. The practical significance of these results is discussed in terms of achieving high yield and reproducibility in the crystal growth process.

Holmes, D. E.↗

Repairable Encapsulated Electronic Modules

Packaging technique seals electronic modules as effectively as potting in epoxy, yet permits removal of encapsulant when component change necessary. Technique encloses module in thin, rigid epoxy/fiberglass shell containing lightweight syntactic foam.

Dozois, P. C.↗

Photovoltaic Module Encapsulation Design and Materials Selection, Volume 1, Abridged

A summary version of Volume 1, presenting the basic encapsulation systems, their purposes and requirements, and the characteristics of the most promising candidate systems and materials, as identified and evaluated by the Flat-Plate Solar Array Project is presented. In this summary version considerable detail and much supporting and experimental information has necessarily been omitted. A reader interested in references and literature citations, and in more detailed information on specific topics, should consult Reference 1, JPL Document No. 5101-177, JPL Publication 81-102, DOE/JPL-1012-60 (JPL), June 1, 1982.

Cuddihy, E. F.↗