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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Material and Design Optimization of Printed Melt Wire Arrays

Recent work conducted by the Advanced Sensors and Instrumentation (ASI) program at Idaho National Laboratory resulted in the establishment of in-house capabilities for fabricating and testing new advanced manufactured sensors for measuring irradiation temperatures inside a nuclear test reactor. Though current methods of real-time temperature monitoring (e.g., thermocouples) can still be used, the complexity of the feedthroughs and attachments needed for collecting real time measurements greatly increases the experiment-related costs. On the other hand, passive monitoring techniques can be used for collecting post irradiation temperature measurements by inferring reactor temperatures, based on the melting points of well-characterized materials (i.e., standard melt wires). However, challenges have arisen due to the limited space available for including instrumentation in experiments. To resolve this issue, the ASI program expanded its temperature detection capabilities to include advance manufactured melt wires for post-irradiation temperature measurements. These melt wires can determine reactor temperatures while also accommodating space limitations in irradiation experiments. To improve performance reliability and enhance melt wire readability following irradiation, FY-22 efforts have focused on optimizing the materials used in the encapsulation and printed melt wire array. This report details the design and fabrication tasks, along with the subsequent x ray computed tomography (XCT) evaluation process. The melt wire array consisted of indium with a melting point of 157°C, indium/silver (96/4 at%) with a melting point of 219°C, and tin with a melting point of 230°C. The encapsulation disc was made of vanadium due to its low activation properties and radiation resistance when deployed in nuclear reactors. Additionally, the melt wire design consisted of a ceramic sublayer (alumina disc) to further enhance the XCT post melting images of the printed melt wires. However, when sealing the vanadium container, all three melt wires melted, reflecting the temperature limitations that must be considered when employing metal containers in the sealing process.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2026

Nondestructive Modular Leak Detection in 3D Printed 316L Stainless Steel Pipes via Laser Powder Bed Fusion

This research investigates the leak detection features of 316L Stainless Steel pipe structures manufactured via Laser Powder Bed Fusion (LPBF). This work involves the design of a modular sensor system integrating nondestructive evaluation (NDE) methods, including thermal imaging and ultrasonic frequency detection to detect and characterize leaks in components. This aims to improve leak detection sensitivity within medium-pressure gas systems, during continuous operation without halting flow or introducing safety risks. The system could be adaptable for use on unmanned aerial vehicles (UAVs), enabling remote leak detection in active environments. A custom pneumatic system incorporating temperature and pressure sensors was assembled to detect leaks in LPBF-printed 316L SS tee pipes. Experimental results and simulations confirm the system’s effectiveness in leak detection and material evaluation. This research program also integrated a Python-based image recognition platform based on a metallography and optical microscopy to assess the porosity and complement the leak detection data on the printed structures. This allows a detailed analysis of pore distribution and internal leak paths, which could compromise structural integrity, critical for quality control during manufacturing. Findings suggest that the investigated approach holds potential for enhancing leak detection technologies and adapt them for advanced manufactured parts.

36 MATERIALS SCIENCE↗
NASA NTRS1984

Preliminary evaluation of the airborne imaging spectrometer for vegetation analysis

The primary goal of the project was to provide ground truth and manual interpretation of data from an experimental flight of the Airborne Infrared Spectrometer (AIS) for a naturally vegetated test site. Two field visits were made; one trip to note snow conditions and temporally related vegetation states at the time of the sensor overpass, and a second trip following acquisition of prints of the AIS images for field interpretation. Unfortunately, the ability to interpret the imagery was limited by the quality of the imagery due to the experimental nature of the sensor.

Strahler, A. H.↗
NASA NTRS2014

Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

Why printed electronics? Why should NASA use printed electronics to make a spacecraft? Three words provide the answer: universal, impactful, progressive. The technology is universal because the applications it can affect are broad and diverse from simple sensors to fully functional spacecraft. The impact of flexible, printed electronics range from straightforward mass, volume and cost savings all the way to enabling new mission concepts. The benefits of the technology will become progressively larger from what is achievable today so that investments will pay dividends tomorrow, next year and next decade. We started off three years ago asking the question can you build an entire spacecraft out of printed electronics? In other words, can you design and fabricate a fully integrated, electronic system that performs the same end-to-end functions of a spacecraft - take scientific measurements, perform data processing, provide data storage, transmit the data, powers itself, orients and propels itself - all out of thin flexible sheets of printed electronics? This "Printable Spacecraft" pushes the limits of printed flexible electronics performance. So the answer is yes, more or less. In our studies for the NIAC (NASA Innovative Advanced Concepts) program, we have explored this question further, to explain more completely what "more or less" means and to outline what is needed to make the answer a definitive "yes". Despite its appealing "Flat Stanley"-like (a book series by Jeff Brown) qualities, making a Printable Spacecraft is not as easy as flattening the Cassini spacecraft with a bulletin board, as was Stanley Lamchop's fate. But, if NASA invests in the design challenges, the materials challenges, the performance challenges of printed electronics, it might find itself with a spacecraft that can enable as many adventures and advantages as Flat Stanley including putting it in an envelope and mailing it to the planet of your choice. You just have to let your imagination take over. In this report we document the work of the Phase 2 Printable Spacecraft task conducted under the guidance and leadership of the NIAC program. In Phase One of the NIAC task entitled "Printable Spacecraft", we investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. In Phase 2 we tried to answer the more practical questions such as can you really build a multi-functional printed electronic spacecraft system? If you do, can it survive the space environment? Even if it can, what benefit does a printable system provide over a traditional implementation of a spacecraft?

Materials↗
DOE OSTI2022

Self-contained, automated, long-term sensor system for monitoring of soil and water nutrients in fields

An automated, fieldable ion-selective sensor system for frequent detection of nutrients in soils or water is set forth. In one aspect, an integrated small form-factor housing includes a battery, processor, a fluid manipulation unit and reservoirs, and a chemical species detection cell. A flow-through sampling head can be connected to the detection cell and a waste reservoir by flexible tubing sealingly connected at opposite ends of the tube. In one aspect, improved performance of the ion-selective sensor includes adding an ion-to-electron transfer interlayer between an ion-selective membrane and its working electrode. In one aspect, the sensor is solid-state and uses printed polymeric composite of POT-MoS$_{2}$. The use of a porous tube for a sampling head and fluid connection at opposite ends allows not only fluid to be removed from the head to the detection cell for measurement but also flow in an opposite direction and out to a waste reservoir to clean and reset for a next sample measurement.

60 APPLIED LIFE SCIENCES↗
DOE OSTI2020

Development of the Intelligent, Preventive Infrared (IR) Inspection System Housed in Hybrid Robotic Platforms

Robots and robotic systems that are designed for inspection, environmental study, and health and safety aid are becoming an increasing necessity. However, there is a number of challenges that accompany robots that are designed for these specific applications. These challenges include: navigating compact, enclosed spaces, travelling over multiple terrains and large obstacles, using the proper sensing and detection methods to assess an environment, and the use of lightweight and durable materials. The robotic platforms currently in development look at all of these challenges and attempt to overcome them. These designs specific use of hybrid robotic platforms, or platform that utilizes soft and rigid materials, allows for a more flexible platform and makes environments more navigable. To further improve the navigation of the platforms and environmental assessment, a novel infrared detection system is housed in the platforms to create a robot that can be used for the applications listed above and more. Objectives: Further develop two types of robotic platforms that utilize additive manufacturing, soft materials, and rigid materials. Continue the development of an intelligent and inhibitory infrared detection system based on an artificial intelligence (AI) algorithm. Continued study and fabrication of active soft materials designed for both sensing and actuation in hybrid robotic systems. Improve additive manufacturing fabrication to design rigid and semi-rigid components for hybrid robotic platforms. Transformable Wheel Robotic Platform: The chassis, wheels, tires and inspection system housing use different additive manufacturing techniques for fabrication. Continued work with additive manufacturing has lead to studies in metal-based printing and modular design and manufacturing. The new platform design with integrated electrical component printed. This will allow integration of the sensor housing onto the platform. Electrical components are being tested for battery life and performance. To improve this performance, such as integration of Lithium Polymer (LiPo) batteries. Snake Robotic Platform: The main focus of the development has centered around liquid-based soft actuators. That act on the principles of electrostatic and hydraulic actuation. A liquid dielectric sits between two compliant electrodes, contained by a flexible polymer shell. The electrodes and film gradually collapse toward each other from one corner of the electrode to the other. When the electrodes and film close together, a majority of the fluid is pushed into the area not covered by an electrode. A thin layer of the liquid dielectric remains between the electrode. The actuators will be stacked to cause large displacement, and move the linkages. The chassis of this platform uses purely additively manufactured linkages. Intelligent, Preventive IR Inspection System: Development of the AI for the system has lead to using a Scikit-Learn which assists in creating predictive models based on Regression, clustering, classification etc. To improve the infrared thermometry for low emissivity sources, work on the fabrication of a tandem photoconductive infrared thermometer was a main focus. Distance-Voltage-Temperature response data has been collected in the range of 7 cm - 100 cm and 200-400 deg. C. Modifications were made to the existing test bench to have a better control over the data. Automated data collection was realized using a Python code and an Arduino controlled stepper motor to increase the sample rate. A protective enclosure has been built around the setup to minimize the effect of the environment on the measurements. To better predict temperature, different AI models are being optimized. The regression model, LARS showed a high accuracy but had convergence issues and only works for the current test set-up. Results: The Transformable Wheel Robot has developed into a more flexible and modular platform. With the improvements to the current work, effort on the tire or soft gripper design been a large focus. The soft grippers will be interchange able to allow for increased performance in identified terrain types. The development of the liquid-based actuators allows the snake robotic platform to achieve the goals of being flexible and able to navigate confined spaces. However, there is room for improvement. Optimization work is currently being done in COMSOL Multiphysics. With the current IR system set-up the LARS model perfectly predicts the data; however, considering the mobility aspect of the project other models will allow for an optimized system. Testing of other model types is currently being done.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗
NASA NTRS1996

Design and Application of a Collocated Capacitance Sensor for Magnetic Bearing Spindle

This paper presents a collocated capacitance sensor for magnetic bearings. The main feature of the sensor is that it is made of a specific compact printed circuit board (PCB). The signal processing unit has been also developed. The results of the experimental performance evaluation on the sensitivity, resolution and frequency response of the sensor are presented. Finally, an application example of the sensor to the active control of a magnetic bearing is described.

Shin, Dongwon↗
DOE OSTI2020

Thermal and radiation response of 4H–SiC Schottky diodes with direct-write electrical contacts

In this work, a high-sensitivity 4H–SiC temperature sensor and an alpha detector have been fabricated using additively printed metal contacts. The surface morphology and electrical conductivity of the printed electrodes were established prior to Schottky diode development. 4H–SiC Schottky diodes with direct-write printed silver contacts on the 5 μ m-thick epilayer on 4H–SiC were characterized electrically in terms of the forward and reverse current–voltage and high-frequency capacitance–voltage characteristics. Furthermore, the turn-on voltage of the Schottky diodes, as established from the forward current–voltage characteristics measured up to a temperature of 400 °C, showed a linear temperature dependence. Schottky diodes with direct-write printed Ag electrodes were able to measure alpha particles emitted from Americium-241. The high temperature and radiation response of the Schottky diodes show their suitability for multi-modal sensor fusion on the 4H–SiC platform for harsh environment applications.

42 ENGINEERING↗
NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗
DOE OSTI2024

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Additive manufacturing of functional devices on various rigid and flexible substrates is rising rapidly due to their design flexibility, rapid manufacturing, and lower cost. Current printing technologies are ink-based and focused on printing silver (Ag) as conductive lines due to its matured ink formulation process, low sintering temperature, ease of printing, and low oxidation rate. However, Ag is the 68th most abundant element on Earth, while copper (Cu) is the 25th, making it much cheaper (>100×) while having a comparable conductivity to Ag. Therefore, printing Cu has become technologically and economically more attractive than Ag. Nevertheless, Cu printing is still a significant challenge in ink-based printing methods due to the higher sintering temperature relative to the glass-transition temperature of most flexible substrates, the higher oxidation rate, the challenging ink formulation process, and ink stability concerns. Here, we demonstrate printing highly conductive Cu on flexible polyimide substrates using a dry printing technique. Cu nanoparticles (~3–30 nm) are generated by on-demand laser ablation of a solid Cu target inside the printer head and under argon background gas. These Cu nanoparticles are then transported through a nozzle and onto the substrate, where they are laser-sintered in real time. The argon gas plays three critical roles in laser plume condensation for nanoparticle generation, transport, and sheath gas to avoid oxidation during sintering. The sintered nanoparticles thus show high electrical conductivity and mechanical stability under static and cyclic tests. Our dry printing technique can potentially revolutionize how electronic devices and sensors are additively manufactured for earth and space applications.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2024

Fabrication and Testing of a Stainless Steel Quartz Coaxial Cable Structure for High Temperature Measurement

This paper presents a stainless-steel quartz coaxial cable structure for distributed sensing of high temperatures. The coaxial cable sensor uses stainless steel as the inner and outer conductors and quartz as the insulator in order to achieve mechanical strength and temperature resilience. Girdle-shaped reflectors are fabricated on the quartz tubing by CNC grinding and CO 2 laser resurfacing. The sensor operates by measuring the temperature dependent change in the effective electromagnetic length between the two adjacent reflectors on the quartz tubing. A retaining collar is fabricated at the tip of the quartz tubing by 3D printing and laser resurfacing to secure the connection between the sensor and the signal cable. The prototype sensor was tested for high temperature measurements up to 600°C, and the performance characteristics of the sensor such as sensitivity, resolution uncertainty, repeatability, and stability were estimated based on the test results.

Jiao, Xinyu↗
NASA NTRSDate not supplied

Metabolic Vessel for Impedance Spectroscopy and Electrochemistry (MVISE): The Ground Mapping Unit for the Lunar Explorer Instrument for Space Biology Applications (LEIA)​

The BioSensor payload on the upcoming LEIA platform aboard a CLPS lander will carry yeast to the moon to study response to radiation and lunar gravity. The LEIA BioSensor is designed to monitor metabolic activity using absorbance in conjunction with alamarBlue for measuring colorimetric changes as proxy measurement for redox potential. The science data returned from small spacecraft mission modules like LEIA is limited as it relies solely on optical measurements, necessitating a corresponding ground mapping unit that is equipped with multiple electrochemical sensors for accurate mapping of the optical data and operates fully automatically. This technology development work discusses the extensive design and optimization efforts put into the ground mapping unit, MVISE. MVISE is a custom designed, 3D-printed vessel with an agitation system, with six different electrochemical sensor probes, and ports for sample collection and a pressure release valve. The sensors provide real-time data, with dry absorbance measurements aligning with LEIA flight hardware and wet measurements demonstrating invasive sensor design enabling a comparison between the two setups. The 3D printer resin was tested for mechanical robustness, biocompatibility, and resistance to autoclave sterilization. The inner walls were coated with food-grade epoxy, ensuring a smooth finish to prevent microbial lodging and dye staining. The MVISE has successfully passed a week-long leak test and is now undergoing active biology tests. The MVISE prototype will be prepared for radiation tests, with three identical units being tested for varying radiation levels and culture compositions at the NASA Space Radiation Laboratory in November 2024. The integrated sensor approach proposed in this work will enable the accurate mapping of the BioSentinel/LEIA optical flight data to six sensor parameters on the ground unit for better science data return and will enable the first effort to evaluate classical biochemical sensor measurements by comparing and contrasting their responses.

Chinmayee Govinda Raj↗
DOE OSTI2020

Trace-Level, Multi-Gas Detection for Food Quality Assessment Based on Decorated Silicon Transistor Arrays

Multiplexed gas detection at room temperature is critical for practical applications, such as for tracking the complex chemical environments associated with food decomposition and spoilage. Here, an integrated array of multiple silicon-based, chemical-sensitive field effect transistors (CSFETs) is presented to realize selective, sensitive, and simultaneous measurement of gases typically associated with food spoilage. CSFETs decorated with sensing materials based on ruthenium, silver, and silicon oxide are used to obtain stable room-temperature responses to ammonia (NH 3 ), hydrogen sulfide (H 2 S), and humidity, respectively. For example, one multi-CSFET sensor signal changes from its baseline by 13.34 in response to 1 ppm of NH 3 , 724.45 under 1 ppm H 2 S, and 23.46 under 80% relative humidity, with sensitive detection down to 10 ppb of NH 3 and H 2 S. To demonstrate this sensor for practical applications, the CSFET sensor array is combined with a custom-printed circuit board into a compact, fully integrated, and portable system to conduct real-time monitoring of gases generated by decomposing food. By using existing silicon-based manufacturing methodologies, this room-temperature gas sensing array can be fabricated reproducibly and at low cost, making it an attractive platform for ambient gas measurement needed in food safety applications.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Direct writing of PVBVA/Ti 3 C 2 T x (MXene) triboelectric nanogenerators for energy harvesting and sensing applications

Triboelectric nanogenerators (TENGs) have gained recognition for their potential to convert mechanical energy into electrical energy, making them attractive for applications in healthcare, robotics, and human-device interfaces. However, many TENG devices rely on fluorinated polymers for high charge generation and involve complex fabrication processes, which limit their practicality and environmental sustainability. Here, we developed an eco-friendly composite of poly (vinyl butyral-co-vinyl alcohol-co-vinyl acetate) (PVBVA) and Ti 3 C 2 T x MXene for extrusion printing onto aluminum foil substrates, enabling the additive manufacturing of TENGs. Experimental results indicate that integrating 5.5 mg mL -1 of MXene (P-MX 5.5) into PVBVA resulted in a power density of 760 mW·m -2 , with simultaneous improvements in open-circuit voltage (129 %) and short-circuit current (250 %), demonstrating enhanced charge transfer efficiency. Beyond aluminum foil-based devices, we further explored the fully printed P-MX 5.5 TENG by utilizing silver ink electrodes, eliminating the need for aluminum foil. This fully printed, flexible TENG was successfully used for real-time human motion sensing, demonstrating its ability to detect activities such as walking, running, knee bending, and jumping. Collectively, our additively manufactured and sustainable PVBVA-MXene TENG composites, including both aluminum-based and fully printed versions, show promise for future energy harvesters, sensors, wearable electronics, healthcare, and robotic applications.

Additive manufacturing↗
DOE OSTI2024

Machine learning informed control systems for extrusion printing processes

Systems and methods for controlling a material extrusion device to extrude a filament of an ink are provided. An extrusion printing control system collects from one or more sensors measurements representing an internal state of material extrusion processing during extrusion of the filament. In addition, the system collects an image of the filament as the filament is extruded. The system applies a classifier to the collected image to generate an image-derived state characterizing the filament. Based on the internal state and the image-derived state, the system estimates a derived state using a model. The system determines control parameters using the model to achieve a desired quality of the filament by minimizing a cost function based on the internal state, the image-derived state, the derived state, and constraints of the material extrusion device. Finally, the system provides the control parameters to a controller of the material extrusion device.

Howell, Brian↗
NASA NTRS2015

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

High temperature↗