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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 145 records · Page 8
All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

Visual and x-ray inspection characteristics of eutectic and lead free assemblies

For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).

x-ray↗
NASA NTRS2005

Reliability of CCGA and PBGA assemblies

Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.

stakes↗
NASA NTRS2004

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗
NASA NTRS2008

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

plastic ball grid array (PBGA)↗
NASA NTRS2011

BOK-Underfill Optimization for FPGA Package/Assembly

Commercial-off-the-shelf area array package technologies in high-reliability versions are being considered for NASA electronic systems. These packages are prone to early failure due to the severe mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of ball interconnections decrease, susceptibility to mechanical loading and cycling fatigue grows. This report presents a summary of the body of knowledge developed for the evaluation of area array packages and is based on surveys of literature from industry and academia. For high-reliability applications, the limited data that exists will be presented. Most data from industry deals with mechanical fatigue caused by four-point bend tests, as well as from drop tests for hand-held electronics; the most recent data will be presented, along with a brief background of prior literature. Understanding the key design guidelines and failure mechanisms from past tests is critical to developing an approach that will minimize future failures. Additional specific testing enables low-risk insertion of these advanced electronic packages.

mechanical fatigue↗
NASA NTRS2010

Reliability and Qualification of Hardware to Enhance the Mission Assurance of JPL/NASA Projects

Packaging Qualification and Verification (PQV) and life testing of advanced electronic packaging, mechanical assemblies (motors/actuators), and interconnect technologies (flip-chip), platinum temperature thermometer attachment processes, and various other types of hardware for Mars Exploration Rover (MER)/Mars Science Laboratory (MSL), and JUNO flight projects was performed to enhance the mission assurance. The qualification of hardware under extreme cold to hot temperatures was performed with reference to various project requirements. The flight like packages, assemblies, test coupons, and subassemblies were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases. Qualification/life testing was performed by subjecting flight-like qualification hardware to the environmental temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experimental flight qualification test results will be described in this presentation.

PRTs↗
NASA NTRS1999

Chip Scale Package Implementation Challenges

The JPL-led MicrotypBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

chipscale↗
NASA NTRS1987

Ensuring Fully Soldered Through Holes

Simple differential-pressure soldering method provides visual evidence that hidden joints are fully soldered. Intended for soldering connector pins in plated through holes in circuit boards. Molten solder flows into plated through holes, drawn by vacuum in manifold over circuit board. Differential-pressure process ensures solder wets entire through hole around connector pin.

Blow, Raymond K.↗
NASA NTRS2014

NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview

This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention (JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort would continue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free Electronics Project while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occur during assembly, rework, and post assembly handling and testing.

electronics↗
NASA NTRS1967

Pipe joints reinforced in place with fitted aluminum sleeves

Installation of an aluminum sleeve, using specially designed tools, reinforces solder- sealed ferrule joints in installed small-diameter aluminum tubing. Tubing joints reinforced by this method withstand considerable torsional tensional, and vibrational stresses at moderately elevated temperatures.

Cortez, I., Jr.↗
NASA NTRS2011

NASA-DoD Lead-Free Electronics Project. DRAFT Joint Test Report

The use of conventional tin-lead (SnPb) in circuit board manufacturing is under ever-increasing political scrutiny due to increasing regulations concerning lead. The "Restriction of Hazardous Substances" (RoHS) directive enacted by the European Union (EU) and a pact between the United States National Electronics Manufacturing Initiative (NEMI), Europe's Soldertec at Tin Technology Ltd. and the Japan Electronics and Information Technology Industries Association (JEITA) are just two examples where worldwide legislative actions and partnerships/agreements are affecting the electronics industry. As a result, many global commercial-grade electronic component suppliers are initiating efforts to transition to lead-free (Pb-free) in order to retain their worldwide market. Pb-free components are likely to find their way into the inventory of aerospace or military assembly processes under current government acquisition reform initiatives. Inventories "contaminated" by Pb-free will result in increased risks associated with the manufacturing, product reliability, and subsequent repair of aerospace and military electronic systems. Although electronics for military and aerospace applications are not included in the RoHS legislation, engineers are beginning to find that the commercial industry's move towards RoHS compliance has affected their supply chain and changed their parts. Most parts suppliers plan to phase out their non-compliant, leaded production and many have already done so. As a result, the ability to find leaded components is getting harder and harder. Some buyers are now attempting to acquire the remaining SnPb inventory, if it's not already obsolete. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides more and more parts with Pb-free finishes-some labeled no differently than their Pb counterparts-while at the same time providing the traditional Pb parts. The longer the transition period, the greater the likelihood of Pb-free parts inadvertently being mixed with Pb parts and ending up on what are supposed to be Pb systems. As a result, OEMs, depots, and support contractors need to take action now to either abate the influx of Pb-free parts, or accept it and deal with the likely interim consequences of reduced reliability due to a wide variety of matters, such as Pb contamination, high temperature incompatibility, and tin whiskering. Allowance of Pb-free components produces one of the greatest risks to the reliability of a weapon system. This is due to new and poorly understood failure mechanisms, as well as unknown long-term reliability. If the decision is made to consciously allow Pb-free solder and component finishes into SnPb electronics, additional effort (and cost) will be required to make the significant number of changes to drawings and task order procedures. This project is a follow-on effort to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Pb-free Solder Project which was the first group to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community.

Kessel, Kurt↗
NASA NTRS1965

Probe tests microweld strength

Probe is developed to test strength of soldered, brazed or microwelded joints. It consists of a spring which may be adjusted to the desired test pressure by means of a threaded probe head, and an indicator lamp. Device may be used for electronic equipment testing.

Source record↗