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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9

Thermal Management and Reliability of Automotive Power Electronics and Electric Machines

Low-cost, high-performance thermal management technologies are helping meet aggressive power density, specific power, cost, and reliability targets for power electronics and electric machines. The National Renewable Energy Laboratory is working closely with numerous industry and research partners to help influence development of components that meet aggressive performance and cost targets through development and characterization of cooling technologies, and thermal characterization and improvements of passive stack materials and interfaces. Thermomechanical reliability and lifetime estimation models are important enablers for industry in cost-and time-effective design.

30 DIRECT ENERGY CONVERSION↗

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

47 OTHER INSTRUMENTATION↗

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

ADVANCED PROPULSION SYSTEMS↗

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

ADVANCED PROPULSION SYSTEMS,ENGINEERING↗

Intrusion Detection for Cybersecurity of Power Electronics Dominated Grids: Inverters PQ Set-Points Manipulation

This work provides cybersecurity analytics for a high photovoltaic (PV) penetrated distribution network, representing future power electronics dominated grid (PEDG). Firstly, the impact of active and reactive power (PQ) set-points manipulation on the network is studied. Then, an intrusion detection system (IDS) is developed for identifying the potentially compromised PV inverters in the network. The proposed IDS is based on defining the normal, safe, and abnormal operation regions of the PV inverters from point of view of the steady state voltage stability of the network. These three-operation regions are identified by utilizing active power, reactive power, and voltage (PQV) limits of each specific grid-following inverter in the network. Each grid-following inverter's PQV contour includes the information of network topology, inverter ratings, and inverter controller. The developed PQ limits are integrated into the centralized secondary control layer for realization of the proposed IDS. Furthermore, the proposed secondary control layer is capable of providing remedial actions during an anomaly event to enhance the grid resiliency. The theoretical analyses are verified by several attack scenarios for a network of grid-following inverters.

41 EE - Solar Energy Technologies Office (EE-4S)↗

A framework to share courses among universities: the case of a course on power electronics for electric vehicles

The paper describes the organizational framework and contents of a newly developed course on power electronics for electric drive vehicles. The course is developed and taught synchronously among three universities, with each institution individually managing student registration and assessments, and course administration. The participation of instructors and students from different institutions increases the impact of the course. In addition to the regular classes, followed on campus and remote, the high quality material generated by the instructors is available for the students, including a repository of recorded video lecturers and conferences given by specialist in key topics. Interaction with instructors and among students is promoted using a collaborative on-line tool.

42 ENGINEERING↗

Thermomechanical Reliability Aspects of Automotive Power Electronics: Current Status and Future Trends

Common failure locations (e.g., wire bonds, solder interface) and mechanisms within traditional automotive power electronics package designs and reliability concerns associated with packaging at higher temperatures and higher heat fluxes will be discussed. Examples of packaging solutions that increase mechanical reliability will be presented and state-of-health (SOH) estimation using offline and online (in situ) techniques will be described.

ADVANCED PROPULSION SYSTEMS,DIRECT ENERGY CONVERSI↗

Wide Bandgap Semiconductor Opportunities in Power Electronics

The report objective is to explore the Wide Bandgap (WBG) Power Electronics (PE) market, applications, and potential energy savings in order to identify key areas where further resources and investments of the U.S. Department of Energy’s Office of Energy Efficiency and Renewable Energy (DOE EERE) would have the most impact on U.S. competiveness. After considering the current market, several potential near-term application areas were identified as having significant market and energy savings potential with respect to clean energy applications: (1) data centers (uninterruptible power supplies and server power supplies); (2) renewable energy generation (photovoltaic-solar and wind); (3) motor drives (industrial, commercial and residential); (4) rail traction; and, (5) hybrid and electric vehicles (traction and charging). After the initial explorative analyses, it became clear that, SiC, not GaN, would be the principal WBG power device material for the chosen markets in the near future. Therefore, while GaN is discussed when appropriate, this report focuses on SiC devices, other WBG applications (e.g., solid-state transformers, combined heat and power, medical, and wireless power), the GaN market, and GaN specific applications (e.g., LiDAR, 5G) will be explored at a later date. In addition to the market, supply and value chain analyses addressed in Section 1 of this report, a SWOT (Strength, Weakness, Opportunity, Threat) analysis and potential energy savings analysis was conducted for each application area to identify the major potential WBG application area(s) with a U.S. competitiveness opportunity in the future.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗

Passive Two-Phase Cooling of Automotive Power Electronics: Preprint

Experiments were conducted to evaluate the use of a passive two-phase cooling strategy as a means of cooling automotive power electronics. The proposed cooling approach utilizes an indirect cooling configuration to alleviate some reliability concerns and to allow the use of conventional power modules. An inverter-scale proof-of-concept cooling system was fabricated, and tests were conducted using the refrigerants hydrofluoroolefin HFO-1234yf and hydrofluorocarbon HFC-245fa. Results demonstrated that the system can dissipate at least 3.5 kW of heat with 250 cm3 of HFC-245fa. An advanced evaporator design that incorporates features to improve performance and reduce size was conceived. Simulation results indicate its thermal resistance can be 37% to 48% lower than automotive dual side cooled power modules. Tests were also conducted to measure the thermal performance of two air-cooled condensers--plain and rifled finned tube designs. The results combined with some analysis were then used to estimate the required condenser size per operating conditions and maximum allowable system (i.e., vapor and liquid) temperatures.

30 DIRECT ENERGY CONVERSION↗

Multi-Objective Optimization for Power Electronics used in Grid-Tied Energy Storage Systems

Multi-objective optimization is used to find a nondominated set of solutions for two conflicting performance metrics or objective functions. These functions are dependent variables in the system, controlled by a set of independent variables called decision variables. The decision variables represent the inputs to the problem, chosen by the system designer, and are values listed in the solution set. In this study, a multi-objective genetic algorithm compared insulated-gate bipolar transistor (IGBT) failure rate to filter and cooling system costs. This study demonstrated the use of multi-objective optimization for energy storage systems. IGBT failure rate was compared to its associated filter and cooling-system costs as part of the DC-AC inverter power electronics system in a battery energy storage system (BESS). The independent or decision variables were determined to be switching frequency and thermal resistance of a heat sink, R sink . The final results indicated that high values of switching frequency increased the effects of R sink . Future work will add additional objective functions and decision variables to the study to optimize additional components in the power electronics system and BESS.

25 ENERGY STORAGE↗

Power Electronics Thermal Management

Thermal modeling was conducted to evaluate and develop thermal management strategies for high-temperature wide-bandgap (WBG)-based power electronics systems. This presentation reviews progress made over the past year.

25 ENERGY STORAGE↗

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging.

ADVANCED PROPULSION SYSTEMS↗

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

High temperature operation of wide bandgap devices continue to be a challenge for the power electronics packages. Thermal performance and reliability are important factors that determine the viability of a bonded interface for operation at high temperatures. In this presentation, we present the technical approach and key results from the research on sintered silver, transient liquid phase alloy, and polymeric materials. A lifetime prediction model that incorporates the thermomechanical behavior of sintered silver at 200C was developed. The copper-aluminum transient alloy completed 350 thermal cycles from -40C to 200C and little increase in the defect level was observed. In addition to material research, we initiated a time-series analysis on the scanning acoustic microscope images of eutectic solder to explore statistical forecasting methods and machine learning techniques. Initial results that report the accuracy of a few different statistical models are presented.

ADVANCED PROPULSION SYSTEMS↗

Power Electronics Thermal Management

Thermal modeling was conducted to evaluate and develop thermal management strategies for high-temperature wide-bandgap (WBG)-based power electronics systems. WBG device temperatures of 175 degrees C to 250 degrees C were modeled under various under-hood temperature environments. Modeling result were used to identify the most effective capacitor cooling strategies under high device temperature conditions.

30 DIRECT ENERGY CONVERSION↗

Framework for Supporting Adaptive Droop Based Power Electronic Systems

The electric grid is evolving into an electrical network composed of power electronic converters interconnected with renewable and energy storage technologies. This requires the adoption of more advanced control such as volt/var regulation, fast frequency control, and active power frequency response. This work presents a communication and control framework to support dynamically changing droop control segments that can be used for different optimization schemes. Results are presented to work in a controller hardware in the loop testbed.

Starke, Michael↗

Oscillating heat pipe integrated thermal management system for power electronics

Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

Wang, Jim↗

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [11] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project evaluates, designs, and develops thermal management strategies that use dielectric fluid (single-phase heat transfer) as coolants.

ADVANCED PROPULSION SYSTEMS↗

Load-Packaged AC/DC and DC/DC Power Electronics Converter Performance Data

This data set contains experimentally characterized performance data from load-packaged alternating current to direct current (AC/DC) and direct current to direct current (DC/DC) power electronics converters associated with lighting devices and miscellaneous electrical loads typically found in commercial buildings in the United States. The data set contains input power, output power, efficiency, and harmonic spectrum data for 58 AC/DC converters and 35 DC/DC converters.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗