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At least 163 records · Page 9

Analog parallel processor hardware for high speed pattern recognition

A VLSI-based analog processor for fully parallel, associative, high-speed pattern matching is reported. The processor consists of two main components: an analog memory matrix for storage of a library of patterns, and a winner-take-all (WTA) circuit for selection of the stored pattern that best matches an input pattern. An inner product is generated between the input vector and each of the stored memories. The resulting values are applied to a WTA network for determination of the closest match. Patterns with up to 22 percent overlap are successfully classified with a WTA settling time of less than 10 microsec. Applications such as star pattern recognition and mineral classification with bounded overlap patterns have been successfully demonstrated. This architecture has a potential for an overall pattern matching speed in excess of 10 exp 9 bits per second for a large memory.

Daud, T.↗

Synthesis algorithm of VLSI multipliers for ASIC

Multipliers are critical sub-blocks in ASIC design, especially for digital signal processing and communications applications. A flexible multiplier synthesis tool is developed which is capable of generating multiplier blocks for word size in the range of 4 to 256 bits. A comparison of existing multiplier algorithms is made in terms of speed, silicon area, and suitability for automated synthesis and verification of its VLSI implementation. The algorithm divides the range of supported word sizes into sub-ranges and provides each sub-range with a specific multiplier architecture for optimal speed and area. The algorithm of the synthesis tool and the multiplier architectures are presented. Circuit implementation and the automated synthesis methodology are discussed.

Chua, O. H.↗

An advanced, radiation hardened bulk CMOS/LSI technology

An advanced, second generation, bulk, Si-gate CMOS process is described. This process is capable of producing LSI and VLSI parts that are latch-up free and hardened to total dose levels in excess of 2 x 10 to the 5th rad-Si for applications in space and weapons radiation environments. Two memories designed to use this process are also described. Both circuits are 4096-bit, static CMOS RAMs.

Schroeder, J. E.↗

The Zero-Degree Detector System

We will report on a detector system used for accelerator measurement of nuclear fragmentation cross sections. This system consists of two detector planes, each carrying a ring of 8 detectors. Each detector has 64 pads. These two detector planes are arranged facing each other so that the matching detector pads on each plane form a two element charged particle telescope. Each of these telescopes is capable of determining the elemental identity of nuclear fragments passing through it. The system is used to measure light fragment production in the presence of heavier fragments. We will present a detailed discussion of the 64-pad detector design, the substrate design. The front-end electronics used to read out the signals is based on a custom VLSI chip developed for the Advanced Thin Ionization Calorimeter experiment which has been flown successfully twice in Antarctica. Each of these chips has 16 channels and each channel consists of a charge-sensitive preamplifier followed by a shaping amplifier and a track-and-hold circuit. The track-and-hold circuits are connected via a multiplexer to an output line driver. This allows the held signals to be presented, one-by-one via a common data line to a analog-to-digital converter. Because the output line driver can be placed in a high input impedance state when not in use, it is possible to daisy-change many chips on the same common data line. The front-end electronics and data readout scheme will be discussed in detail. The Zero Degree Detector has been used in several accelerator experiments conducted at the NASA Space Radiation Laboratory and the Alternating Gradient Synchrotron at Brookhaven National Laboratory as well as at the HIMAC accelerator in Japan. We will show examples of data taken at these accelerator runs to demonstrate how the system works.

Adams, James H.↗

An optical processor for zero-crossing edge detection

An optical processor for zero-crossing edge detection is presented, which consists of two defocused imaging systems to perform the Gaussian convolutions and a VLSI, ferroelectric liquid crystal spatial light modulator (SLM) to determine the zero-crossings. The zero-crossing SLM is a 32 x 32 array of pixels located on 100 microns centers. Each pixels contains a phototransistor, an auto-scaling amplifier, a zero-crossing detection circuit, and a liquid crystal modulating pad. Electrical and optical characteristics of the zero-crossing SLM are presented along with experimental results of the system.

Jared, David A.↗

Universal programmable logic gate and routing method

An universal and programmable logic gate based on G.sup.4-FET technology is disclosed, leading to the design of more efficient logic circuits. A new full adder design based on the G.sup.4-FET is also presented. The G.sup.4-FET can also function as a unique router device offering coplanar crossing of signal paths that are isolated and perpendicular to one another. This has the potential of overcoming major limitations in VLSI design where complex interconnection schemes have become increasingly problematic.

Fijany, Amir↗

High performance VLSI telemetry data systems

NASA's deployment of major space complexes such as Space Station Freedom (SSF) and the Earth Observing System (EOS) will demand increased functionality and performance from ground based telemetry acquisition systems well above current system capabilities. Adaptation of space telemetry data transport and processing standards such as those specified by the Consultative Committee for Space Data Systems (CCSDS) standards and those required for commercial ground distribution of telemetry data, will drive these functional and performance requirements. In addition, budget limitations will force the requirement for higher modularity, flexibility, and interchangeability at lower cost in new ground telemetry data system elements. At NASA's Goddard Space Flight Center (GSFC), the design and development of generic ground telemetry data system elements, over the last five years, has resulted in significant solutions to these problems. This solution, referred to as the functional components approach includes both hardware and software components ready for end user application. The hardware functional components consist of modern data flow architectures utilizing Application Specific Integrated Circuits (ASIC's) developed specifically to support NASA's telemetry data systems needs and designed to meet a range of data rate requirements up to 300 Mbps. Real-time operating system software components support both embedded local software intelligence, and overall system control, status, processing, and interface requirements. These components, hardware and software, form the superstructure upon which project specific elements are added to complete a telemetry ground data system installation. This paper describes the functional components approach, some specific component examples, and a project example of the evolution from VLSI component, to basic board level functional component, to integrated telemetry data system.

Chesney, J.↗

High density circuit technology

Polyimide dielectric materials were acquired for comparative and evaluative studies in double layer metal processes. Preliminary experiments were performed. Also, the literature indicates that sputtered aluminum films may be successfully patterned using the left-off technique provided the substrate temperature remains low and the argon pressure in the chamber is relatively high at the time of sputtering. Vendors associated with dry processing equipment are identified. A literature search relative to future trends in VLSI fabrication techniques is described.

Wade, T. E.↗

A DRAM compiler algorithm for high performance VLSI embedded memories

In many applications, the limited density of the embedded SRAM does not allow integrating the memory on the same chip with other logic and functional blocks. In such cases, the embedded DRAM provides the optimum combination of very high density, low power, and high performance. For ASIC's to take full advantage of this design strategy, an efficient and highly reliable DRAM compiler must be used. The embedded DRAM architecture, cell, and peripheral circuit design considerations and the algorithm of a high performance memory compiler are presented .

Eldin, A. G.↗

High density circuit technology, part 3

Dry processing - both etching and deposition - and present/future trends in semiconductor technology are discussed. In addition to a description of the basic apparatus, terminology, advantages, glow discharge phenomena, gas-surface chemistries, and key operational parameters for both dry etching and plasma deposition processes, a comprehensive survey of dry processing equipment (via vendor listing) is also included. The following topics are also discussed: fine-line photolithography, low-temperature processing, packaging for dense VLSI die, the role of integrated optics, and VLSI and technology innovations.

Wade, T. E.↗

Behavioral model simulation studies of an image compressor

The high initial cost of prototype Very Large Scaled Integrated (VLSI) parts requires that sufficient verifications be made to eliminate design errors before actually producing the prototypes. Logic simulation is the means by which the VLSI engineer can ensure that the design will function properly. The computer time required for logic simulation can be reduced through the use of behavioral models. Behavioral models, however, require time to write and verify and they do not always produce a dramatic speed up in logic simulation time. This paper presents a study of behavioral modeling aimed at discovering which circuit types benefit most from the use of behavioral models for logic simulation.

Madani, Navid↗

High density circuit technology

Acquisition of polyimide materials for inter-metal dielectrics was obtained from three vendors, with considerable evaluation conducted on the Dupont PI2550 material. Experimental results indicate this material can be patterned using contact printing to line width far below 0.1 mils. Optimum line width is acquired using plasma etch equipment. Metal lift-off experiments on thermal evaporated films were optimized for application to sputtered deposited films. Alternate metal-lift-off experiments are proposed for future investigation. Dry processing equipment studies and future trends in VLSI fabrication techniques are on-going.

Wade, T. E.↗

Electronic neural networks for global optimization

An electronic neural network with feedback architecture, implemented in analog custom VLSI is described. Its application to problems of global optimization for dynamic assignment is discussed. The convergence properties of the neural network hardware are compared with computer simulation results. The neural network's ability to provide optimal or near optimal solutions within only a few neuron time constants, a speed enhancement of several orders of magnitude over conventional search methods, is demonstrated. The effect of noise on the circuit dynamics and the convergence behavior of the neural network hardware is also examined.

Thakoor, A. P.↗

Hierarchical Design and Verification for VLSI

The specification and verification work is described in detail, and some of the problems and issues to be resolved in their application to Very Large Scale Integration VLSI systems are examined. The hierarchical design methodologies enable a system architect or design team to decompose a complex design into a formal hierarchy of levels of abstraction. The first step inprogram verification is tree formation. The next step after tree formation is the generation from the trees of the verification conditions themselves. The approach taken here is similar in spirit to the corresponding step in program verification but requires modeling of the semantics of circuit elements rather than program statements. The last step is that of proving the verification conditions using a mechanical theorem-prover.

Shostak, R. E.↗

Prototype Focal-Plane-Array Optoelectronic Image Processor

Prototype very-large-scale integrated (VLSI) planar array of optoelectronic processing elements combines speed of optical input and output with flexibility of reconfiguration (programmability) of electronic processing medium. Basic concept of processor described in "Optical-Input, Optical-Output Morphological Processor" (NPO-18174). Performs binary operations on binary (black and white) images. Each processing element corresponds to one picture element of image and located at that picture element. Includes input-plane photodetector in form of parasitic phototransistor part of processing circuit. Output of each processing circuit used to modulate one picture element in output-plane liquid-crystal display device. Intended to implement morphological processing algorithms that transform image into set of features suitable for high-level processing; e.g., recognition.

Fang, Wai-Chi↗

VLSI processors for signal detection in SETI

The objective of the Search for Extraterrestrial Intelligence (SETI) is to locate an artificially created signal coming from a distant star. This is done in two steps: (1) spectral analysis of an incoming radio frequency band, and (2) pattern detection for narrow-band signals. Both steps are computationally expensive and require the development of specially designed computer architectures. To reduce the size and cost of the SETI signal detection machine, two custom VLSI chips are under development. The first chip, the SETI DSP Engine, is used in the spectrum analyzer and is specially designed to compute Discrete Fourier Transforms (DFTs). It is a high-speed arithmetic processor that has two adders, one multiplier-accumulator, and three four-port memories. The second chip is a new type of Content-Addressable Memory. It is the heart of an associative processor that is used for pattern detection. Both chips incorporate many innovative circuits and architectural features.

NASA Program Exobiology↗

A parallel row-based algorithm with error control for standard-cell replacement on a hypercube multiprocessor

A new row-based parallel algorithm for standard-cell placement targeted for execution on a hypercube multiprocessor is presented. Key features of this implementation include a dynamic simulated-annealing schedule, row-partitioning of the VLSI chip image, and two novel new approaches to controlling error in parallel cell-placement algorithms; Heuristic Cell-Coloring and Adaptive (Parallel Move) Sequence Control. Heuristic Cell-Coloring identifies sets of noninteracting cells that can be moved repeatedly, and in parallel, with no buildup of error in the placement cost. Adaptive Sequence Control allows multiple parallel cell moves to take place between global cell-position updates. This feedback mechanism is based on an error bound derived analytically from the traditional annealing move-acceptance profile. Placement results are presented for real industry circuits and the performance is summarized of an implementation on the Intel iPSC/2 Hypercube. The runtime of this algorithm is 5 to 16 times faster than a previous program developed for the Hypercube, while producing equivalent quality placement. An integrated place and route program for the Intel iPSC/2 Hypercube is currently being developed.

Sargent, Jeff Scott↗

Sequence information signal processor for local and global string comparisons

A sequence information signal processing integrated circuit chip designed to perform high speed calculation of a dynamic programming algorithm based upon the algorithm defined by Waterman and Smith. The signal processing chip of the present invention is designed to be a building block of a linear systolic array, the performance of which can be increased by connecting additional sequence information signal processing chips to the array. The chip provides a high speed, low cost linear array processor that can locate highly similar global sequences or segments thereof such as contiguous subsequences from two different DNA or protein sequences. The chip is implemented in a preferred embodiment using CMOS VLSI technology to provide the equivalent of about 400,000 transistors or 100,000 gates. Each chip provides 16 processing elements, and is designed to provide 16 bit, two's compliment operation for maximum score precision of between -32,768 and +32,767. It is designed to provide a comparison between sequences as long as 4,194,304 elements without external software and between sequences of unlimited numbers of elements with the aid of external software. Each sequence can be assigned different deletion and insertion weight functions. Each processor is provided with a similarity measure device which is independently variable. Thus, each processor can contribute to maximum value score calculation using a different similarity measure.

Peterson, John C.↗