A set of Fortran IV subroutines for generating printed plots
Subroutines written in Fortran IV for generating printed plots as part of normal output
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Subroutines written in Fortran IV for generating printed plots as part of normal output
Method for preparing project transparencies, or view graphs, permits the use of almost any expendable printed material, pictures, charts, or text, in unlimited color or black and white. The method can be accomplished by either of two techniques, with a slight difference in materials.
Study of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material specifications.
Production methods for contact prints in emulsions or chromium coated glass plate
Flow charts for recognizing hand printed characters on-line in real time operation
Application of the microhm measuring circuit to measurement of plated-through hole resistances, when combined with appropriate probes, provides data that can be related to the quality of copper plating on printed wiring boards. Acceptance limits can be established and continuous inspection performed, with plating defects causing abnormal readings.
Printed circuit boards retaining as much copper as possible provide electromagnetic shielding between stages of the high frequency amplifiers and transmitters. Oscillation is prevented, spurious output signals are reduced, and multiple stages are kept isolated from each other, both thermally and electrically.
Spiral-like coil is printed with several extra turns which increase the realizable coil inductance. Included are shorting connections which not only short the extra turns, but also short out several turns of the main body. Coil tuning is accomplished by removing the shorts until the desired inductance is obtained.
FORTRAN 4 subroutines to generate printed plots as normal output
Highly reliable soldered joints for printed circuit boards
Printed wiring board component mounting configurations to ensure successful solder terminations
Printed matter as two dimensional, two valued, and stochastic process
Printed circuit board has a thermal coefficient of expansion similar to that of the electronic component leads. High-expansion composite materials are sandwiched between the outer layers of copper and woven fiber glass.
Cold testing method prevents formation of frost on printed circuit boards and part holders during testing at sub-zero temperatures. Freon permits rapid attainment of the required testing temperature.
Ferric chloride in an aqueous medium etches copper from the surface of printed-circuit boards. Ferric ions are reduced to ferrous ions resulting in a reduced etching rate.
Techniques for preparing printed circuit boards are used to provide an alternate method for producing panel symbology for ground computer test trap. After processing, the panel unit is either solder or gold plated.
Computer program for analyzing hand printed mathematical expressions
Materials compatibility study for improved multilayer printed circuit board