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This presentation will include information about Double Data Rate (DDR) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.
This presentation will include information about Double Data Rate (DDR) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.
The Orion CEV Northstar ASIC (application- specific integrated circuit) project required a DDR (double data rate) memory bus driver/receiver (DDR PHY block) to interface with external DDR memory. The DDR interface (JESD79C) is based on a source synchronous strobe (DQS\) that is sent along with each packet of data (DQ). New data is provided concurrently with each edge of strobe and is sent irregularly. In order to capture this data, the strobe needs to be delayed and used to latch the data into a register. A circuit solves the need for training a DDR PRY block by incorporating a PVT-compensated delay element in the strobe path. This circuit takes an external reference clock signal and uses the regular clock to calibrate a known delay through a data path. The compensated delay DQS signal is then used to capture the DQ data in a normal register. This register structure can be configured as a FIFO (first in first out), in order to transfer data from the DDR domain to the system clock domain. This design is different in that it does not rely upon the need for training the system response, nor does it use a PLL (phase locked loop) or a DLL (delay locked loop) to provide an offset of the strobe signal. The circuit is created using standard ASIC building blocks, plus the PVT (process, voltage, and temperature) compensated delay line. The design uses a globally available system clock as a reference, alleviating the need to operate synchronously with the remote memory. The reference clock conditions the PVT compensated delay line to provide a pre-determined amount of delay to any data signal that passes through this delay line. The delay line is programmed in degrees of offset, so that one could think of the clock period representing 360deg of delay. In an ideal environment, delaying the strobe 1/4 of a clock cycle (90deg) would place the strobe in the middle of the data packet. This delayed strobe can then be used to clock the data into a register, satisfying setup and hold requirements of the system.
This document reports the status of the NEPP Double Data Rate (DDR) Device Reliability effort for FY2013. The task targeted general reliability of > 100 DDR2 devices from Hynix, Samsung, and Micron. Detailed characterization of some devices when stressed by several data storage patterns was studied, targeting ability of the data cells to store the different data patterns without refresh, highlighting the weakest bits. DDR2, Reliability, Data Retention, Temperature Stress, Test System Evaluation, General Reliability, IDD measurements, electronic parts, parts testing, microcircuits
Convolutional interleavers are used in many different communications systems to correct for burst errors due to atmospheric fades and scintillation. The interleaver size is related to the channel coherence time and the data rate. Small convolutional interleavers can be implemented in a field programmable gate array (FPGA) block random access memory (BRAM). However, large interleavers exceeding the size of the BRAM on the FPGA are necessary for channels with longer fades and higher data rates. Therefore, an implementation utilizing double data rate (DDR) memory external to the FPGA is necessary. Wide DDR memory data buses can make the use of DDR memory for convolutional interleavers inefficient when individual symbols are written to and read from the memory. DDR memory operational speeds can also limit the data rate of the interleaver. The Consultative Committee for Space Data Systems (CCSDS) Optical Communications High Photon Efficiency (HPE) standard utilizes a convolutional channel symbol interleaver. A previous implementation of the HPE standard utilized BRAM for the convolutional interleaver, but mission requirements for the upcoming Optical Artemis-2 Orion (O2O) communications demonstration dictate the use of an interleaver exceeding the size of the BRAM. An algorithm and method for implementing the convolutional interleaver in the FPGA with DDR memory is described in this paper.
Convolutional interleavers are used in many different communications systems to correct for burst errors due to atmospheric fades and scintillation. The interleaver size is related to the channel coherence time and the data rate. Small convolutional interleavers can be implemented in a field programmable gate array (FPGA) block random access memory (BRAM). However, large interleavers exceeding the size of the BRAM on the FPGA are necessary for channels with longer fades and higher data rates. Therefore, an implementation utilizing double data rate (DDR) memory external to the FPGA is necessary. Wide DDR memory data buses can make the use of DDR memory for convolutional interleavers inefficient when individual symbols are written to and read from the memory. DDR memory operational speeds can also limit the data rate of the interleaver. The Consultative Committee for Space Data Systems (CCSDS) Optical Communications High Photon Efficiency (HPE) standard utilizes a convolutional channel symbol interleaver. A previous implementation of the HPE standard utilized BRAM for the convolutional interleaver, but mission requirements for the upcoming Optical Artemis-2 Orion (O2O) communications demonstration dictate the use of an interleaver exceeding the size of the BRAM. An algorithm and method for implementing the convolutional interleaver in the FPGA with DDR memory is described in this paper.
This version of the SpaceCube will be a full-fledged, onboard space processing system capable of 2500+ MIPS, and featuring a number of plug-andplay gigabit and standard interfaces, all in a condensed 3x3x3 form factor [less than 10 watts and less than 3 lb (approximately equal to 1.4 kg)]. The main processing engine is the Xilinx SIRF radiation- hardened-by-design Virtex-5 FX-130T field-programmable gate array (FPGA). Even as the SpaceCube 2.0 version (currently under test) is being targeted as the platform of choice for a number of the upcoming Earth Science Decadal Survey missions, GSFC has been contacted by customers who wish to see a system that incorporates key features of the version 2.0 architecture in an even smaller form factor. In order to fulfill that need, the SpaceCube Mini is being designed, and will be a very compact and low-power system. A similar flight system with this combination of small size, low power, low cost, adaptability, and extremely high processing power does not otherwise exist, and the SpaceCube Mini will be of tremendous benefit to GSFC and its partners. The SpaceCube Mini will utilize space-grade components. The primary processing engine of the Mini is the Xilinx Virtex-5 SIRF FX-130T radiation-hardened-by-design FPGA for critical flight applications in high-radiation environments. The Mini can also be equipped with a commercial Xilinx Virtex-5 FPGA with integrated PowerPCs for a low-cost, high-power computing platform for use in the relatively radiation- benign LEOs (low-Earth orbits). In either case, this version of the Space-Cube will weigh less than 3 pounds (.1.4 kg), conform to the CubeSat form-factor (10x10x10 cm), and will be low power (less than 10 watts for typical applications). The SpaceCube Mini will have a radiation-hardened Aeroflex FPGA for configuring and scrubbing the Xilinx FPGA by utilizing the onboard FLASH memory to store the configuration files. The FLASH memory will also be used for storing algorithm and application code for the PowerPCs and the Xilinx FPGA. In addition, it will feature highspeed DDR SDRAM (double data rate synchronous dynamic random-access memory) to store the instructions and data of active applications. This version will also feature SATA-II and Gigabit Ethernet interfaces. Furthermore, there will also be general-purpose, multi-gigabit interfaces. In addition, the system will have dozens of transceivers that can support LVDS (low-voltage differential signaling), RS-422, or SpaceWire. The SpaceCube Mini includes an I/O card that can be customized to meet the needs of each mission. This version of the SpaceCube will be designed so that multiple Minis can be networked together using SpaceWire, Ethernet, or even a custom protocol. Scalability can be provided by networking multiple SpaceCube Minis together. Rigid-Flex technology is being targeted for the construction of the SpaceCube Mini, which will make the extremely compact and low-weight design feasible. The SpaceCube Mini is designed to fit in the compact CubeSat form factor, thus allowing deployment in a new class of missions that the previous SpaceCube versions were not suited for. At the time of this reporting, engineering units should be available in the summer 2012.
The Micron MT46V128M8 was tested for single event effects (SEE) at the Texas AM University Cyclotron Facility (TAMU) in June of 2017. Testing revealed a sensitivity to device hang-ups classified as single event functional interrupts (SEFI) and possible soft data errors classified as single event upsets (SEU).
The purpose of this testing is to characterize the ISSI IS46DR16640B-25DBA25 parameter degradation for total dose response. This test’s purpose is to evaluate and compare lot date codes for sensitivity. In the test, the device is exposed to both low dose and high dose rate (HDR) irradiations using gamma radiation. Device parameters such as leakage currents, quantity of upset bits or addresses, and overall chip and die health are investigated to determine which lot is more robust. These parameters directly affect the functionality of the memory within a system and may determine thresholds necessary to mitigate failure.
Although system-level radiation hardening can enable the use of high-performance components and enhance the capabilities of a spacecraft, hardening techniques can be costly and can compromise the very performance designers sought from the high-performance components. Moreover, such techniques often result in a complicated design, especially if several complex commercial microcircuits are used, each posing its own hardening challenges. The latter risk is particularly acute for Commercial-Off-The-Shelf components since high-performance parts (e.g. double-data-rate synchronous dynamic random access memories - DDR SDRAMs) may require other high-performance commercial parts (e.g. processors) to support their operation. For these reasons, it is essential that system-level radiation hardening be a coordinated effort, from setting requirements through testing up to and including validation.
This document reports the status of the NEPP Double Data Rate 2 (DDR2) Reliability effort for FY2012. The task expanded the focus of evaluating reliability effects targeted for device examination. FY11 work highlighted the need to test many more parts and to examine more operating conditions, in order to provide useful recommendations for NASA users of these devices. In order to develop these approaches, it is necessary to develop test capability that can identify reliability outliers. To do this we must test many devices to ensure outliers are in the sample, and we must develop characterization capability to measure many different parameters. For FY12 we increased capability for reliability characterization and sample size. We increased sample size by moving from loose devices to DIMMs with an approximate reduction of 20 to 50 times in terms of per DUT cost. By increasing sample size we have improved our ability to characterize devices that may be considered reliability outliers. This report provides an update on the effort to improve DDR2 testing capability. Although focused on DDR2, the methods being used can be extended to DDR and DDR3 with relative ease.
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This document reports the status of the NASA Electronic Parts and Packaging (NEPP) Double Data Rate 2 (DDR2) Reliability effort for FY2012. The task expanded the focus of evaluating reliability effects targeted for device examination. FY11 work highlighted the need to test many more parts and to examine more operating conditions, in order to provide useful recommendations for NASA users of these devices. This year's efforts focused on development of test capabilities, particularly focusing on those that can be used to determine overall lot quality and identify outlier devices, and test methods that can be employed on components for flight use. Flight acceptance of components potentially includes considerable time for up-screening (though this time may not currently be used for much reliability testing). Manufacturers are much more knowledgeable about the relevant reliability mechanisms for each of their devices. We are not in a position to know what the appropriate reliability tests are for any given device, so although reliability testing could be focused for a given device, we are forced to perform a large campaign of reliability tests to identify devices with degraded reliability. With the available up-screening time for NASA parts, it is possible to run many device performance studies. This includes verification of basic datasheet characteristics. Furthermore, it is possible to perform significant pattern sensitivity studies. By doing these studies we can establish higher reliability of flight components. In order to develop these approaches, it is necessary to develop test capability that can identify reliability outliers. To do this we must test many devices to ensure outliers are in the sample, and we must develop characterization capability to measure many different parameters. For FY12 we increased capability for reliability characterization and sample size. We increased sample size this year by moving from loose devices to dual inline memory modules (DIMMs) with an approximate reduction of 20 to 50 times in terms of per device under test (DUT) cost. By increasing sample size we have improved our ability to characterize devices that may be considered reliability outliers. This report provides an update on the effort to improve DDR2 testing capability. Although focused on DDR2, the methods being used can be extended to DDR and DDR3 with relative ease.