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Results for “ELECTRONIC MODULE”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1975

Instruction manual, optical effects module electronic controller and processor, model OEMCP

The OEM-1 electronic module is discussed; it is comprised of four subsystems: the signal processing and display; the stepper motor controls; the chopper controls; and the dc-dc invertor. The OEM-1 module controls the sample wheel so that the relative transmittance of the samples can be compared to the clear aperture position. The 3-1/2 digit digital voltmeter displays the clear aperture signal level as well as the ratio of the remaining sample positions relative to the clear aperture position. The sample wheel position is decoded so that the signals and ratios can be correlated to the data. The OEM is automatically reset to the I sub o on initial turn-on and can be reset to the '0' position by actuating a front panel switch. The sample wheel can be interrupted to change samples or induce a longer integration time if desired by a front panel command. Integration times from 1 - 50 seconds are provided at the front panel, and BCD data for external interfacing is provided.

Source record↗
DOE OSTI2020

Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules: Preprint

Insulated gate bipolar transistor (IGBT) power modules are devices commonly used for switching of high voltages and currents. Usage and environmental conditions can cause these power modules to degrade over time, and this gradual process may eventually lead to catastrophic failure of the device. This degradation process may cause some early performance symptoms related to the state of health of the power module, making it possible to detect reliability degradation of the IGBT module. Testing can be used to accelerate this process, permitting a rapid determination of whether specific declines in device reliability can be characterized. In this study, thermal cycling was conducted on multiple power modules simultaneously in order to assess the effect of thermal cycling on the degradation of the power module. In-situ monitoring of temperature was performed from inside each power module using high temperature thermocouples. Device imaging and characterization was performed along with temperature data analysis, to assess failure modes and mechanisms within the power modules. While the experiment was aimed to assess the potential damage effects of thermal cycling on die attach, results indicated that wirebond degradation was the life limiting failure mechanism.

33 ADVANCED PROPULSION SYSTEMS↗
NASA NTRS1984

Repairable Encapsulated Electronic Modules

Packaging technique seals electronic modules as effectively as potting in epoxy, yet permits removal of encapsulant when component change necessary. Technique encloses module in thin, rigid epoxy/fiberglass shell containing lightweight syntactic foam.

Dozois, P. C.↗
DOE OSTI2022

Electron Modulational Instability in the Strong Turbulent Regime for an Electron Beam Propagating in a Background Plasma

We study collective processes for an electron beam propagating through a background plasma using simulations and analytical theory. A new regime where the instability of a Langmuir wave packet can grow locally much faster than ion frequency is clearly identified. The key feature of this new regime is an electron modulational instability that rapidly creates a local Langmuir wave packet, which in its turn produces local charge separation and strong ion density perturbations because of the action of the ponderomotive force, such that the beam-plasma wave interaction stops being resonant. Three evolution stages of the process and observed periodic burst features are discussed. In conclusion, different physical regimes in the plasma and beam parameter space are demonstrated for the first time.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2023

Automated Design-for-Reliability of a Power Electronics Module

The design of a power electronics module is a multiphysics problem and involves electrical, thermal, and reliability targets and constraints. Although the electrical and thermal design consider multiple aspects such as materials, geometry, and energy losses, reliability design is often limited to the selection of the attachment materials and electrical interconnect types. In this paper, we incorporate reliability metrics in the design phase by investigating the impact of package geometry on the thermomechanical behavior of the die-attachment material. To this end, we conducted thermal and power cycling simulations of a commercial six-pack power module with silicon carbide devices to compute junction temperature and strain energy density per cycle, respectively. We performed multiple simulations with different geometric dimensions and established a correlation between input features and output variables using subspace-based dimension reduction. The machine learning-based dimension reduction method serves as a surrogate model, which can be employed to identify the optimal module design from a thermal and reliability standpoint.

design-for-reliability↗
NASA NTRSDate not supplied

Thermal Analysis of the Advanced Modular Power Systems (AMPS) Power Electronic Modules

In an effort to transform future space power system architectures and operations, the Advanced Modular Power Systems (AMPS) project is currently developing an interface standard for power electronic modules to enable modular architectures for space power systems. Each architecture would consist of one or more modular electronic units (MEU) that would comprise of a tailored combination of modules. The standard currently comprises modules enabling switchgear, power conversion, and data interfacing. The objective of the AMPS project is to enable the modularity and interchangeability of different architectures using these standardized modules in hopes of reducing complexity and cost, increasing inherent redundancy and reliability, and minimizing power system redesign for future programs. A key enabler to these future modular architectures will be the thermal management system, which has to contend with acquiring heat from the electronics modules at the card level and then transporting that heat to the radiator of the larger system. The focus of this paper, therefore, will be the thermal design and analysis of multiple AMPS power electronics modules and the development of their thermal-vacuum test.

Modular Power Electronics↗
NASA NTRS1965

Electronic modules easily separated from heat sink

Metal heat sink and electronic modules bonded to a thermal bridge can be easily cleaved for removal of the modules for replacement or repair. A thin film of grease between a fluorocarbon polymer film on the metal heat sink and an adhesive film on the modules acts as the cleavage plane.

Source record↗
NASA NTRS1968

Encapsulation technique eliminates thermal stresses in welded electronic modules

Encapsulation technique minimizes embedment and thermal stresses in welded electronic modules. A coating of thinned room-temperature- vulcanizing silicone rubber having a high coefficient of expansion and flexibility at low temperature, is applied first and then an encapsulating epoxy resin having a relatively low coefficient of expansion is added.

Kimmel, M.↗
DOE OSTI2024

Electronics module with raceway and submodules

Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

Eickbush, Ryan J.↗
NASA NTRS1967

Transducer measures embedment stresses in electronic modules

Strain gage load transducer measures axial embedment stresses in resins used for encapsulation of welded electronic modules. It simulates the geometry of an actual electronic component and can be modified in size, shape, and operating temperature.

Smith, M. H.↗
DOE OSTI2021

Fast modulating electron cyclotron emission (FMECE) diagnostic for tokamaks

Utilizing variable-frequency channels, e.g., yttrium iron garnet (YIG) bandpass filters, in the intermediate frequency (IF) section of an electron cyclotron emission (ECE) radiometer facilitates flexibility in the volume viewed by the ECE channels as well as high resolution electron temperature and temperature fluctuation measurements in tokamaks. Fast modulating electron cyclotron emission (FMECE), a stand-alone IF section with eight channels, is a novel application of YIG filters for real-time electron temperature gradient and gradient scale length measurements. Key to FMECE is a simultaneous input/output data acquisition unit, as well as a modified type of YIG filters, which is capable of fast switching of their center (set) frequencies with a frequency slew rate of 600 μs/GHz. A new FMECE has been implemented and tested on the DIII-D tokamak, demonstrating its capability in real-time gradient measurements. Here, the data presented here shows that FMECE can identify flattening in the electron temperature profile; the latter can be used as a sensor for real time monitoring and control of plasma instabilities. Implementation and application are planned for the EAST tokamak.

47 OTHER INSTRUMENTATION↗