Metrics Evaluations for Enviornmental and Reliability Testing
Presented here in are the latest metric evaluations for the effectiveness of the tests involved in one of JPL's recent space flight programs.
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Presented here in are the latest metric evaluations for the effectiveness of the tests involved in one of JPL's recent space flight programs.
Wafer level reliability testing has been nurtured in the DARPA supported workshops, held each autumn since 1982. The seeds planted in 1982 have produced an active crop of very large scale integration manufacturers applying wafer level reliability test methods. Computer Aided Reliability (CAR) is a new seed being nurtured. Users are now being awakened by the huge economic value of the wafer reliability testing technology.
The work on reliability testing of solar cells is discussed. Results are given on initial temperature and humidity tests of amorphous silicon devices. Calibration and measurement procedures for amorphous and crystalline cells are given. Temperature stress levels are diagrammed.
Reliability testing of aerospace problems including sampling, distribution functions, and accelerated life tests
Statistical method in reliability tests including confidence limits for normal, lognormal, and binomial functions
Reliability testing and demonstration lecture notes
Saturn integrated circuit reliability tests performed to improve failure mode screening
Statistical truncated normal distribution function is applied as a time-to-failure distribution function in equipment reliability estimations. Age-dependent characteristics of the truncated function provide a basis for formulating a system of high-reliability testing that effectively merges statistical, engineering, and cost considerations.
For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.
Test program to determine reliability of integrated circuit amplifiers for Saturn program
Reliability and failure mode prevention tests for Saturn integrated circuits
Literature survey and test program to study reliability of linear integrated circuits
Reliability and its interdependence with testing are important topics for development and manufacturing of successful products. This generally accepted fact is not only a technical statement, but must be also seen in the light of 'Human Factors.' While the background for this paper is the experience gained with electromechanical/electronic space products, including control and system considerations, it is believed that the content could be also of interest for other fields.
NASA's Constellation program has selected the closed cycle hydrogen oxygen Polymer Electrolyte Membrane (PEM) regenerative Fuel Cell (RFC) as its baseline solar energy storage system for the lunar outpost and manned rover vehicles. Since the outpost and manned rovers are "human-rated", these energy storage systems will have to be of proven reliability exceeding 99 percent over the length of the mission. Because of the low (TRL=5) development state of the closed cycle hydrogen oxygen PEM RFC at present, and because there is no equivalent technology base in the commercial sector from which to draw or infer reliability information from, NASA will have to spend significant resources developing this technology from TRL 5 to TRL 9, and will have to embark upon an ambitious reliability development program to make this technology ready for a manned mission. Because NASA would be the first user of this new technology, NASA will likely have to bear all the costs associated with its development. When well-known reliability estimation techniques are applied to the hydrogen oxygen RFC to determine the amount of testing that will be required to assure RFC unit reliability over life of the mission, the analysis indicates the reliability testing phase by itself will take at least 2 yr, and could take up to 6 yr depending on the number of QA units that are built and tested and the individual unit reliability that is desired. The cost and schedule impacts of reliability development need to be considered in NASA's Exploration Technology Development Program (ETDP) plans, since life cycle testing to build meaningful reliability data is the only way to assure "return to the moon, this time to stay, then on to Mars" mission success.
NASA's Constellation program has selected the closed cycle hydrogen oxygen Polymer Electrolyte Membrane (PEM) Regenerative Fuel Cell (RFC) as its baseline solar energy storage system for the lunar outpost and manned rover vehicles. Since the outpost and manned rovers are "human-rated," these energy storage systems will have to be of proven reliability exceeding 99 percent over the length of the mission. Because of the low (TRL=5) development state of the closed cycle hydrogen oxygen PEM RFC at present, and because there is no equivalent technology base in the commercial sector from which to draw or infer reliability information from, NASA will have to spend significant resources developing this technology from TRL 5 to TRL 9, and will have to embark upon an ambitious reliability development program to make this technology ready for a manned mission. Because NASA would be the first user of this new technology, NASA will likely have to bear all the costs associated with its development.When well-known reliability estimation techniques are applied to the hydrogen oxygen RFC to determine the amount of testing that will be required to assure RFC unit reliability over life of the mission, the analysis indicates the reliability testing phase by itself will take at least 2 yr, and could take up to 6 yr depending on the number of QA units that are built and tested and the individual unit reliability that is desired. The cost and schedule impacts of reliability development need to be considered in NASA's Exploration Technology Development Program (ETDP) plans, since life cycle testing to build meaningful reliability data is the only way to assure "return to the moon, this time to stay, then on to Mars" mission success.
This viewgraph presentation reviews an approach to testing microcircuits at cryogenic temperatures. Standard testing procedures are not adequate to test microcircuits that are to operate at cryogenic temperatures. It is therefore necessary to perform analysis of operation conditions and reliability conditions for planning qualification testing of microcircuits at cryogenic temperatures. The major degradations for microcircuits operating at low temperatures depend on the number of switching cycles rather than on the duration of part operation. Therefore instead of accelerating degradation of the parts by increasing the level of stress, the possibility of which is very limited at cryogenic temperatures, the reliability testing can be based on the number of switching cycles.
Several aerospace problems are solved using various reliability methods. The problems considered are associated with distribution functions, sampling, accelerated life testing, and accept/reject decisions with sequential testing. In addition, two reliability case histories are described in detail. They include the second space Electric Rocket Test (SERT II), and the Microthruster Power Conditioner (MTPC) life test, both conducted by the Lewis Research Center.
The rising power density in electronic systems requires thermal management solutions that are both high-performing and reliable. Porous materials such as Copper Inverse Opal (CuIOs) have unique structural features, including high permeability and high thermal conductivity, to enhance pool boiling performance. However, there is little understanding of the degradation mechanism of such porous materials under pool boiling conditions. In this study, samples of 10 ..mu..m thick CuIOs with 4.8 ..mu..m diameter, covering silicon substrate of area 11 mm x 11 mm, with various heated areas ranging from 2.5 mm x 2.5 mm to 10 mm x 10 mm, were tested in 100 degrees C deionized water at a constant heat flux of 110 Wcm -2 for 3-to-7 days. The combined effect of erosion and corrosion caused structural degradation of the CuIOs. The directly heated area had the most severe degradation while the edge of the heater and the unheated area showed progressively less degradation, maintaining some CuIOs structure even after the 7-day reliability test. Among all the tested samples with various heater sizes, the 2.5 mm x 2.5 mm heater sample - in which the heater size was designed to be comparable to the water bubble characteristic length - had the largest critical heat flux (CHF) up to 300 Wcm -2 with a superheat ~ 13 degrees C. Additionally, CuIOs with a smaller heated area performed better in terms of reliability. This study offers preliminary insights into CuIOs degradation mechanisms, contributing to the development of more robust thermal management solutions. We expect that electroless plating of CuIOs with gold (Au), nickel (Ni), and atomic layer deposition (ALD) aluminum oxide (Al 2 O 3 ) in combination with appropriate application-specific coolants will further improve the reliability and lifetime of the CuIOs.