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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

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NASA NTRS1986

Adhesive evaluation of thin films of LARC-TPI and LARC-TPI with 5 mol % ODA

A commercially available LARC-TPI film and an experimentally prepared film of LARC-TPI with 5 mol % of 4,4'-oxydianiline (ODA), designated as LARC-TPI/ODA in the report, supplied by Mitsui Toatsu Chemicals, Incorporated (MTCI), Japan, were evaluated as thermoplastic adhesive films for bonding Ti-6Al-4V. The LARC-TPI/ODA had been shown by MTCI to possess more flow than thermoplastic LARC-TPI and was, therefore, evaluated and compared to the LARC-TPI. Lap shear strength was used to evaluate the materials as adhesives. They were characterized after fracture by determining the glass transition temperature, Tg. The mode of failure was also reported. Thermal exposure at 204C for 500 and 1000 hrs and a 72-hour water-boil were conducted on lap shear specimens prepared with the two adhesive films. Lap shear tests were conducted at RT, 177C, 204C, and 232C before and after exposures.

Progar, D. J.↗

NASA NTRS1990

Biaxial extrusion of polyimide LARC-TPI and LARC-TPI blends

Biaxial films of polyimide LARC-TPI and LARC-TPI/liquid crystal polymer Xydar were extruded directly from the melt for the first time via an innovative extrusion technique. Three types of films, neat LARC-TPI, LARC-TPI/10 wt pct and 30 wt pct blends were processed as a part of this NASA-funded program. Processability was greatly enhanced by incorporating Xydar. The coefficient of thermal expansion was reduced from 34 ppm/C for the neat LARC-TPI to 15 ppm/C for the 10 wt pct Xydar blend and ultimately down to 1 to 3 ppm/C for the 30 wt pct blend films in the direction of extrusion. The maximum improvement in stiffness was realized by incorporating 10 wt pct Xydar (2.8 GPa up to 4.9 GPa). Tensile strength, however, experienced a drop as a result of Xydar addition, probably caused by inefficient mixing of the two phases.

Haghighat, R. Ross↗

NASA NTRS1985

Adhesive evaluation of LARC-TPI and a water-soluble version of LARC-TPI

The results of a study to evaluate two Langley Research Center thermoplastic polimide (TPI) materials, identified as TPI/MTC for the material from Mitsui Toatsu Chemicals Inc. and TPI/H2O for the material from United Technologies Research Center, as high temperature thermoplastic adhesives and primers for bonding titanium (6AL-4V) adherends are discussed. A limited characterization of the materials was performed using a Diffuse Reflectance-Fourier Transform Infrared Spectroscopy (DR-FTIR) technique. Thermomechanical Analysis (TMA) and torsional braid techniques were used to determine glass transition temperature. The adhesive's strength, as determined by simple lap shear tests, as used to evaluate the effects of long term thermal exposure (up to 1000 hrs) at 204 deg C and a 72-hour water-boil.

Progar, D. J.↗

NASA NTRS1986

Adhesive evaluation of LARC-TPI and a water-soluble version of LARC-TPI

The results of a study to evaluate two Langley Research Center thermoplastic polimide (TPI) materials, identified as TPI/MTC for the material from Mitsui Toatsu Chemicals Inc. and TPI/H2O for the material from United Technologies Research Center, as high temperature thermoplastic adhesives and primers for bonding titanium (6AL-4V) adherends are discussed. A limited characterization of the materials was performed using a Diffuse Reflectance-Fourier Transform Infrared Spectroscopy (DR-FTIR) technique. Thermomechanical Analysis (TMA) and torsional braid techniques were used to determine glass transition temperature. The adhesive's strength, as determined by simple lap shear tests, was used to evaluate the effects of long term thermal exposure (up to 1000 hrs) at 204 deg C and a 72-hour water-boil.

Progar, D. J.↗

NASA NTRS1973

Antenna and propagation studies for spacecraft systems: Addendum to preflight SL-1/SL-3 Skylab VHF ranging coverage (early and late TPI)

A preflight assessment is presented of the expected Skylab VHF ranging coverage for the rendezvous portion of the SL-1/SL-3 mission, assuming a 28 July 1973 launch date, for the alternative trajectory cases characterized by either an early TPI or a late TPI. In this assessment early TPI and late TPI are used to indicate a TPI maneuver occurring 10 minutes prior to or after the nominally scheduled TPI maneuver, respectively. The Saturn workshop (SWS) maintains a solar inertial (SI) attitude throughout rendezvous for both trajectory cases. The results summarized concern VHF ranging function performance during that period most likely to be affected by off-nominal TPI conditions, i.e., NSR (5:56 g.e.t.) to station keeping. Curves are presented which show the variation in received power levels on both spacecraft-to-spacecraft links from about 100 n.mi. range to CSM and SWS station keeping. Appropriate threshold levels are shown on these received power curves to indicate zero circuit margins for the ranging function.

Eisenhauer, D. R.↗

NASA NTRS1990

Improved melt flow and physical properties of Mitsui Toatsu's LARC-TPI 1500 series polyimide

The basic thermal properties and melt behavior of an improved form of LARC-TPI polyimide, LARC-TPI 1500, are investigated and compared with those of LARC-TPI 1000 and 2000. The LARC-TPI 1500 powders are thermally stable and melt processable. The absolute molecular weight of the polymer varies from 20,000 to 30,000, indicating recurring unit numbers of about 40-60. The melt flow properties of LARC-TPI 1500 are comparable to those of other engineering plastics, such as PEEK, PSU, and PES. The flexural modulus of injection molded parts of LARC-TPI 1500 is the highest among commercial thermoplastic polymers.

Ohta, Masahiro↗

NASA NTRS1987

Adhesive evaluation of water-soluble LARC-TPI

The water-soluble polyimide, identified as TPI(MTC)/H2O, was evaluated as a high temperature thermoplastic adhesive for bonding Ti-6Al-4V and comparing those results primarily with results reported in earlier work with the polyamic-acid/diglyme material. The lap shear strength test was the primary test performed to evaluate the adhesive before (controls) and after thermal exposure in air at 204 C for up to 5000 hours and after a 72 hour water-boil exposure. Lap shear strengths were determined at RT, 177, 204, and 232 C. The adhesive was also characterized after fracture by determining the glass transition temperature as well as defining the mode of failure by visual observation. In general, the results indicate that the TPI(MTC)/H2O retains high lap shear strengths after thermal exposure but had reduced strengths after the water-boil exposure. All failures were cohesive. The TPI(MTC)/H2O compared very well with previous data reported for the standard polyamic-acid/diglyme LARC-TPI results, and therefore, shows promise as a water-soluble adhesive for use in various applications.

Progar, Donald J.↗

NASA NTRS1988

Adhesive evaluation of water-soluble LARC-TPI

Progar, D. J.↗

NASA NTRS1990

Evaluation of two bisimide additives in LARC-TPI adhesive

The processability of aromatic polyimides can be improved by the addition of bis (amide) acids or bisimides to LARC-TPI. These low molecular weight additives apparently lower the melt viscosity of aromatic polyimides without affecting the glass transition temperature. Well-consolidated, fiber reinforced composites were fabricated using this technology. LARC-TPI can be processed as a thermoplastic polyimide to form high strength bonds, however, this is generally accomplished by processing at relatively high bonding pressures. An adhesive investigation is presented on the effects of two bisimide additives to LARC-TPI in an attempt to improve the bonding process by lowering the viscosity of the material to achieve improved bond strength properties. Apparently, the high flow which is exhibited by the additives when they melt, tended to be masked by the more viscous LARC-TPI.

Progar, Donald J.↗

NASA NTRS1982

LARC-TPI: A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.

St.clair, A. K.↗

NASA NTRS1987

Thermoplastic matrix composites - LARC-TPI, polyimidesulfone and their blends

Composites were fabricated from unidirectional unsized AS-4 carbon fiber and two baseline polyimides: benzophenone dianhydride-3,3'-diaminodiphenylsulfone (PISO2) and benzophenone dianhydride-3,3'-diaminobenzophenone (LARC-TPI). In addition, each polymer solution prior to prepregging was doped with various amounts of crystalline LARC-TPI powder to enhance melt flow during press molding. The 2:1, 1:1, and 1:2 ratios of crystalline to amorphous resin, respectively, were studied in the LARC-TPI system and the 1:2 ratio in the PISO2 system. Matrix characterization, prepreg fabrication/characterization and composite fabrication and physical/mechanical properties are described. The latter include three point short beam shear and flexure, dry and wet, as well as fracture toughness properties in selected compositions.

Johnston, Norman J.↗

NASA NTRS1986

Semi-interpenetrating networks of LARC-TPI

In a previous research project at NASA-Langley, a novel semi-2-interpenetrating polymer network (semi-2-IPN) was prepared from the linear, thermoplastic polyimidesulfone, and the more brittle, crosslinked, acetylene-terminated imidesulfone. Synergistic qualities such as improved thermooxidative stability and better processability were achieved from this combination. The novelty of the system lay in the fact that the structures of the linear and crosslinking components were nearly identical. This similarity in structure eliminates any phase separation problems common to many-IPNs. In a similar way, a semi-2-IPN was prepared from linear, thermoplastic LARC-TPI and acetylene-terminated LARC-TPI (ATLARC-TPI). The preparation and characterization of this system will be discussed as well as adhesive and composite data.

Egli, Annemarie H.↗

NASA NTRS1987

A DSC study on crystalline LaRC TPI powder - A new version with higher initial molecular weight

A new version of crystalline Langley Research Center Thermoplastic Polyimide (LaRC-TPI) imidized powder, which possesses a higher initial molecular weight (MW), has been prepared and characterized. The scheme used for cyclodehydration during the synthesis of this material is described. Evidence of a higher initial MW for the subject LaRC-TPI is supported by both measurements of the inherent viscosity and the DSC thermograms. An initial melting peak at 295 C is noted in the freshly-synthesized sample. The powder can be recrystallized at any elevated temperatures below 340 C, and a single crystalline endothemic peak is always observed after various thermal histories. The heat of fusion for the fresh sample, as represented by the area under the melting peak in the directional scanning calorimeter thermogram, is about 3.9 cal/gm. Comparisons of thermal properties for the subject material are made to those exhibited by the commercial LaRC-TPI powder.

Hou, Tan-Hung↗

NASA NTRS1990

LARC-I-TPI: A New Thermoplastic Polyimide

"LARC-I-TPI" denotes improved version of LARC-TPI class of thermoplastic polyimides: high-performance polymers developed for manufacture of strong, lightweight aircraft structures. Melt-flow and adhesive properties of new polymers make them attractive for use as matrix resins for composites, molding powders, adhesives, and coating films. Less toxic, improved LARC-I-TPI polymers formulated without 3, 3'-diaminobenzophenone, which is mutagenic and commercially unavailable.

St. Clair, Terry L.↗

NASA NTRS1990

LARC-TPI 1500 series controlled molecular weight polyimide

LARC-TPI, a linear high temperature thermoplastic polyimide, was developed several years ago at NASA Langley Research Center. This material has been commercialized by Mitsui Toatsu Chemicals, Inc., Tokyo, Japan, as a varnish and powder. More recently, a melt-extruded film of a controlled molecular weight of this same polymer has been supplied to NASA Langley Research Center for evaluation. This new form, called LARC-TPI 1500 series, has been prepared in three molecular weights - high, medium and low flow polymers. The subject of this investigation deals with the rheological properties of the high and medium flow powders and the adhesive properties of the medium flow melt-extruded film. Rheological studies indicate that the high and medium flow forms of the polymer fall in the flow range of injection moldable materials. Adhesive data generated on the medium flow extruded film shows this form to be well suited for structural adhesive bonding. The data are as good or better than that for LARC-TPI data of previous studies.

Progar, Donald↗

NASA NTRS1990

LaRC-I-TPI - A status report on a new high performance, thermoplastic polyimide

A new thermoplastic polyimide designated LaRC-I-TPI has been prepared from 4,4'-isophthaloyldiphthalic anhydride (IDPA) and 1,3-phenylenediamine (m-PDA), phthalic anhydride endcapped or unendcapped. It is closely related to the well-known commercial LaRC-TPI. A survey of the synthesis and some thermal, film, adhesive, fracture toughness, and composite properties of this new polyimide is presented. While both materials have similar properties at comparable stages of development, LaRC-I-TPI should be less expensive to manufacture as a result of the use of lower cost readily available monomers.

Pratt, J. Richard↗

NASA NTRS1990

LaRC-TPI 1500 composites fabricated using an aqueous slurry process

Unidirectional composites from unsized carbon fiber and LaRC-TPI matrix material were fabricated using 'high flow' and'medium flow' grades of the LaRC-TPI 1500 series of polyimides. Prepreg was drum-wound from a slurry composed of the polyimide powder dispersed in an aqueous solution of LaRC-TPI poly(amide acid). The poly(amide acid) was found to be an effective binding agent in the prepregging process. Composite short beam shear and flexure properties were measured at room and elevated temperatures (to 177 C) with both dry and moisture-saturated specimens. The mechanical properties observed for composites fabricated from the high and medium flow materials were virtually identical. Additionally, double cantilever beam measurements showed nearly equivalent fracture toughness for the two composite materials.

Towell, Timothy W.↗

DOE OSTI2025

Exploring the Coexistence of Spin States in [Fe(tpy-Ph) 2 ] 2+ Complexes on Au(111) Using DFT Calculations

In this work, we systematically study the electronic structure and stability of spin states of the [Fe-(tpy-ph) 2 ] 2+ molecule in both the gas phase and on a Au(111) substrate using density functional theory + U (DFT+ U ) calculations. We find that the stability of the Fe 2+ ion’s spin states predicted by the computations is significantly influenced by the Hubbard U parameter. In the gas phase, the low-spin (LS, S = 0) state is found to be energetically favorable for U (Fe) ≤ 3 eV, whereas the high-spin (HS, S = 2) state is stabilized for U (Fe) > 3 eV. Interaction with the Au(111) substrate is found to elevate the critical U for the spin-state transition to 3.5 eV. Additionally, we perform L-edge X-ray absorption spectroscopy (XAS) calculations for both HS and LS states. The calculated XAS suggests that the HS state more closely aligns with the experimental observations, indicating the potential coexistence of the HS state as the initial state during the X-ray excitation process. These findings enrich our understanding of spin-state dynamics in [Fe(tpy-Ph) 2 ] 2+ .

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗