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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

Exploring the Performance and Reliability of Screen-Printable Fire-Through Copper Paste on PERC Solar Cells

In this work, we present the performance and reliability of a fire-through copper (Cu) paste which has been screen printed on c-Si solar cell with passivated emitter rear contact (PERC). The Cu paste is fired through silicon nitride (SiN) anti-reflection coating at a peak temperature of 630 degrees C . SEM images of the Cu paste show a Cu core with ~200 nm oxide shell around the particles. This conductive oxide layer acts as a diffusion barrier between Cu and Si and prevents the degradation of cell performance during accelerated aging conditions. An efficiency of 19.250% has been achieved with Voc=654mV,FF= 76.68%, Jsc=38.40 m.A/cm 2 for champion PERC cells. Accelerated testing of the PERC mini-modules in damp heat chamber with 85 degrees C and 85% humidity have demonstrated that the devices are operational even after 1,500 hours. Devices with screen printed Ag contacts on the front side have been studied in parallel to the Cu contacts for comparison.

copper↗
DOE OSTI2023

Screen printable copper pastes for silicon solar cells

The current work demonstrates the successful metallization of a PERC silicon solar cell with screen-printable copper (Cu) paste that is sintered at elevated temperature in air atmosphere. The existing state of the art in Silicon (Si) solar cell metallization is silver (Ag) paste; Cu cost is 1/100th the cost of Ag and has a comparable conductivity. However, Cu undergoes rapid oxidation at elevated temperatures and the high diffusion of Cu into Si restricts its usage in the metallization of silicon solar cells. In this paper, a Cu paste containing a proprietary mixture of antioxidant additives and diffusion inhibitors was used to make front gridlines on PERC cells. The Cu-printed cells were fired in an IR belt furnace with a peak temperature of 576°C in air atmosphere. The solar cells discussed here reached an efficiency of 19%, which is 88% of the efficiency measured for a commercial Ag-printed cell. The working devices were further characterized using STEM, EDX, ToF-SIMS and long-term suns-V oc studies demonstrating an absence of Cu diffusion. Furthermore, thermally stressing the Cu-printed solar cells yielded a reduction of less than 1.9% of the initial pseudo fill factor (pFF) after 1000 hours at 200°C. Here, the shunt resistance of cells monitored over 3 years remained within 2.5% of its initial value, which demonstrates the effectiveness of the Cu diffusion barrier.

14 SOLAR ENERGY↗
DOE OSTI2024

Exploring the Performance and Reliability of Screen-Printable Fire-Through Copper Paste on PERC Solar Cells

For 40 TW of PV required to transition our planet to 100% renewables, the silver (Ag) should disappear from PV production. Advantages of copper (Cu) over silver (Ag) include 1) bulk Cu has a similar conductivity to Ag (1.7 mu O-cm for Cu, 1.6 mu O-cm for Ag) and 2) Cu is approximately 100 times cheaper than Ag, making it an excellent potential replacement. Problems associated with copper (Cu) contacts include 1) easy oxidation and 2) diffusion into the Si cell and recombination activity.

copper paste↗
DOE OSTI2024

Evaluating the Performance and Reliability of Screen-Printable Fire-Through Copper Paste on PERC Solar Cells

A bifacial silicon heterojunction solar cell demands approximately 210 mg usage of silver paste (9 busbars, 24.5%, bifacial, M6 size wafer). Copper is an excellent alternative to silver: 100x cheaper, similar elecvtrical resistivities, and 1000x more abundant. Successful demonstration of large area selective emitter PERC solar cells using Cu fire-through paste with FF approximately 75% and approximately 19%. Paste chemistry results in oxide-based Cu diffusion barrier, leading to good reliability of the devices: 1000h DHT giving a 3.5% efficiency drop. The additional series resistance still needs to be lowered. Printed and fired cell performance is governed mostly by pFF, especially J02 ; same for DHT degradation. Further improvement in printing and firing optimization for lower series resistance and higher FF.

Ag↗
DOE OSTI2025

Front Side Copper Metallization Paste for Silicon Solar Cells (CRADA Final Report)

Adoption and testing of copper (Cu) metallization pastes on existing research and development (R&D) or production lines is hindered by the perceived idea that Cu will contaminate the equipment. The objective of this work is to prove if Cu from the pastes will contaminate and degrade the silver metallized cells being produced in the same firing furnace.

14 SOLAR ENERGY↗
DOE OSTI2024

Development and Reliability of Screen-Printable Fire-Through Cu Paste for Passivated Contact Solar Cells

We present the development of copper (Cu) paste which has been screen printed on Selective Emitter-Passivated Emitter Rear Contact (SE-PERC) solar cells. This paste can also be applied to Tunnel Oxide Passivated Contact (TOPCON) solar cells due to its fire-through nature. Champion PERC cells have achieved ....efficiency with ...parameters . Accelerated testing to investigate reliability performance of the SE- PERC mini-modules were carried out in damp heat chamber with 85oC and 85% humidity. The devices were found to be operational even after 1,500 hours. Devices with screen printed Ag contacts on the front side have been studied in parallel to the Cu contacts for comparison.

copper paste↗
DOE OSTI2025

Metal Complex Inks for Low-Cost Photovoltaic Material Metallization

The aim of the project titled “Metal Complex Inks for Low-Cost Photovoltaic Material Metallization” was to develop new metal complex conductive inks and pastes for PV, invented and commercialized by Electroninks, Inc. (EI, Austin, TX USA, https://electroninks.com), the only global supplier and scaled-manufacturing company of these metal complex inks. These materials were developed in this work for photovoltaic applications to significantly lower the cost of metallization, improve the manufacturability, and greatly reduce metal usage, while maintaining or improving device efficiencies when compared to traditional nanoparticle-based inks. The new pastes will do so by: 1) lowering the finger resistivity and precious metals usage by printing much denser (and therefore thinner/less material) metal films than possible with traditional particle-based screen-printed pastes; 2) decreasing the firing temperature to help preserve passivation; and 3) enabling a path to move the TW-scale PV industry from Ag to other materials including Ni, Cu, and Ni/Cu alloy pastes while continuing to leverage capital investment and expertise in screen printing metallization.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2024

High Temperature Copper Metallization: Demand, Hurdles and Reliability

As newer cells structures come online, the pressing need to replace silver in the metallization pastes has renewed interest in alternative technologies employing base metals. Copper typically leads the charge with its abundance and lower cost but has faced numerous obstacles from relatively higher oxidation and diffusion rates which can damage the lifetime of the devices. In this study, a low-cost alternative to silver metallization pastes has been shown on PERC cells. The screen printable copper paste can be fired in air at temperatures >500 degrees C, and the impact of processing conditions and equipment on the performance and reliability of 274 cm2 cells have been evaluated. Through damp heat testing of micro-modules using 16 cm2 cells, routes that can lead to both the failure and success of durable contacts have been demonstrated.

copper↗
DOE OSTI2023

Improvement of screen-printable metallization paste for low-cost silicon solar cells utilizing silver coated copper powders

This aims of this project were to develop low-cost screen-printable Ag|Cu metallization, as alternative to Ag paste, for contacting PERC solar cells with transparent emitter for high performance and reliability. The intended goal was to achieve 81% fill factor with a screen-printable Ag|Cu paste alternative. This was attempted through a three strand approach including Ag|Cu formulation by SVMT, production using cavitation technology by ACI and contact formation through the understanding of (i) the liquid phase sintering of the nano/macro particles of Ag|Cu to achieve bulk metal with very low series resistance, (ii) optimization of contact firing to avoid penetration of Cu into the silicon bulk, and finally (iii) proper analysis to quantify the contributions of each resistance component and keep the total series resistance at 0.2 Ω-cm2, which would result in high fill factor of 81% by UNC Charlotte. The objectives also involved i) the implementation of glass frit with Cu metal that will etch through the ARC for low contact resistance and adhesion, ii) development of Ag|Cu pastes with the optimized glass frit, iii) investigation of the impact of Cu particle size, morphology and loading on the gridline resistance, iv) narrow gridline screen designs along with narrow gridline prints, v) development of fast belt speeds of up to 375 inches per minute (ipm) sintering, and vi) stability study on Ag|Cu contact to high performance and reliability.

14 SOLAR ENERGY↗
DOE OSTI2024

Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding

High temperature packaging technologies are a necessity for high temperature capable devices. SAC305 solder has an operational limit of 174°C imposed by creep effects which aligns well with current junction temperature limits of 175°C. Wide band gap semiconductor materials have the potential to reach junction temperatures of up to 800°C that are not currently attainable with significant reliability. Capitalizing on this potential will requires substrates and attachments that can operate well beyond the current 175°C standard. Silver sintering pastes have received widespread interest as a high temperature attachment alternative. However, the process requires high pressure bonding in an inert environment to achieve acceptable bond quality. Transient liquid phase (TLP) sintering is capable of good bond quality without pressure requirements but suffers from low thermal conductivity and only slightly reduced cost compared to silver sintering. SAC305 solder contains the same constituent materials for TLP as available copper-tin TLP sintering paste. By introducing engineered surface structures into the bond, intermetallic formation can be accelerated producing a bond similar to TLP sintering but in an ambient environment and for reduced cost. While this process has been demonstrated, it has not yet been optimized. Currently bonds are formed using a 75 μm stencil on substrate surface structures 24 μm tall, covering 19% of the bonding area. The process takes about 4 hours not including the formation of surface structures. Here, this study will center on the effects of stencil thickness and coating methods. Samples will be analyzed by scanning acoustic microscopy, die shear testing and cross sectional scanning acoustic microscopy.

42 ENGINEERING↗
DOE OSTI2023

Ultra-low radioactivity flexible printed cables

Abstract Flexible printed cables and circuitry based on copper-polyimide materials are widely used in experiments looking for rare events due to their unique electrical and mechanical characteristics. However, past studies have found copper-polyimide flexible cables to contain 400-4700 pg 238 U/g, 16-3700 pg 232 Th/g, and 170-2100 ng nat K/g, which can be a significant source of radioactive background for many current and next-generation ultralow background detectors. This study presents a comprehensive investigation into the fabrication process of copper-polyimide flexible cables and the development of custom low radioactivity cables for use in rare-event physics applications. A methodical step-by-step approach was developed and informed by ultrasensitive assay to determine the radiopurity in the starting materials and identify the contaminating production steps in the cable fabrication process. Radiopure material alternatives were identified, and cleaner production processes and treatments were developed to significantly reduce the imparted contamination. Through the newly developed radiopure fabrication process, fully-functioning cables were produced with radiocontaminant concentrations of 20-31 pg 238 U/g, 12-13 pg 232 Th/g, and 40-550 ng nat K/g, which is significantly cleaner than cables from previous work and sufficiently radiopure for current and next-generation detectors. This approach, employing witness samples to investigate each step of the fabrication process, can hopefully serve as a template for investigating radiocontaminants in other material production processes.

36 MATERIALS SCIENCE↗
DOE OSTI2022

An Electrochemical Electrode to Detect Theophylline Based on Copper Oxide Nanoparticles Composited with Graphene Oxide

The electrochemical analysis of theophylline (THP) was investigated by fabricating a carbon paste electrode (CPE) modified with graphene oxide (GO) along with copper oxide (CuO) nanoparticles (CuO-GO/CPE). The impact of electro-kinetic parameters such as the heterogeneous rate constant, the scan rate, the accumulation time, the pH, the transfer coefficient, and the number of electrons and protons transferred into the electro-oxidation mechanism of THP has been studied utilizing electrochemical methods such as cyclic voltammetry (CV) and differential pulse voltammetry (DPV). The differential pulse voltammetry technique was employed to investigate THP in pharmaceutical and biological samples, confirming the limit of detection (LOD) and quantification (LOQ) of the THP. X-ray diffraction (XRD) and scanning electron microscopy (SEM) analysis were performed to characterize the CuO nanoparticles. The CuO-GO/CPE was more sensitive in THP detection because its electrocatalytic characteristics displayed an enhanced peak current in the 0.2 M supporting electrolyte of pH 6.0, proving the excellent sensing functioning of the modified electrode.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Heat and mass transfer during a sudden loss of vacuum in a liquid helium cooled tube - Part III: Heat deposition in He II

A sudden loss of vacuum can be catastrophic for superconducting particle accelerators. In such an event, air leaks into the liquid-helium-cooled accelerator beamline tube and condenses on its inner surface, causing rapid boiling of the helium and dangerous pressure build-up. Understanding the coupled heat and mass transfer processes is important for the design of the beamline cryogenic system. Our past experimental study on nitrogen gas propagating in a copper tube cooled by normal liquid helium (He I) has revealed a nearly exponential slowing down of the gas front. A theoretical model that accounts for the interplay of the gas dynamics and the condensation was developed, which successfully reproduced various key observations. However, since many accelerator beamlines are actually cooled by superfluid helium (He II) in which the heat transfer is via a non-classical thermal counterflow mode, we need to extend our work to the He II cooled tube. This paper reports our systematic measurements using He II and the numerical simulations based on a modified model that accounts for the He II heat-transfer characteristics. By tuning the He II peak heat-flux parameter in our model, we have reproduced the observed gas dynamics in all experimental runs. The fine-tuned model is then utilized to reliably evaluate the heat deposition in He II. Finallly, this work not only advances our understanding of condensing gas dynamics but also has practical implications to the design codes for beamline safety.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2020

Liquid–Solid Mixtures of Ga Metal Infused with Cu Microparticles and Nanoparticles for Microscale and Nanoscale Patterning of Solid Metals at Room Temperature

This paper demonstrates and characterizes a simple ink for nanopatterning of solid metallic structures under ambient conditions by taking advantage of the low melting point of gallium and its affinity to form intermetallics with other metals. Bare copper micro- and nanoparticles readily mix with liquid gallium near room temperature to form a paste that ultimately amalgamates into a dense solid when mixed at the appropriate concentration ratios. The paste has sufficient shelf life that can be extruded from a nozzle at modest temperatures to form solid three-dimensional (3D) shapes. Additionally, the paste can be molded at room temperature to replicate feature sizes ranging from a few millimeters down to hundreds of nanometers. In situ X-ray diffraction (XRD) and thermo-mechanical analysis (TMA) data show gallium and copper readily interdiffuse to form the thermodynamically expected intermetallic phase. We describe the capabilities and limitations of a simple way to pattern solid metals in an additive fashion (syringe-based extrusion) and with high resolution (molding) at or near room temperature. Here, the use of a paste that solidifies provides a novel route for 3D printing of solid metals at ambient temperatures as well as the creation of micro- and nanostructured metallic surfaces that may be useful for optics, non-wetting surfaces, or electronic microcomponents.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Nanoscale Consequences of Irradiation Investigated by RAD-AFM (Final Report)

To assess the feasibility of measuring material property changes induced by ion irradiation one pristine and three legacy HT-9 samples were sectioned and polished. The polish protocol was first optimized using a pristine unirradiated HT-9 sample before polishing the ion irradiated samples as the spot size was small and repeated polishing could remove the ion irradiated region entirely. AFM tapping mode was used to assess the surface quality after each polish. AFM based hardness mapping was optimized for new diamond tips specifically for use with the HT-9 samples to compensate for differences in grain size, precipitates, and heterogeneity of hardness relative to past samples. In addition, a hardness calibration protocol was developed using NIST copper, nickel, and steel reference materials. Co-located SEM-EDS and AFM analysis was used to verify the ion irradiated edge using the silver/tungsten coating as a fiducial mark. Once benchmarked, the hardness across the ion irradiated cross section, a comparison of bulk hardness according to neutron irradiation, and the hardness of the ion irradiated surface edge was measured.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Heating of Cs2Te photocathode via field emission and radiofrequency pulsed heating: Implication toward breakdown

The occurrence of radiofrequency (RF) breakdown limits operational electromagnetic gradients in accelerator structures. Experimental evidence often suggests that breakdown events are associated with temperature and dark current spikes on the surface of RF devices. In the past decade, there has been increased interest in unveiling the mechanism behind breakdown initiation in metal copper and copper alloys; however, efforts regarding a breakdown phenomenon in photocathode-relevant semiconductors have been more limited. In this work, we explore field-emission-assisted heating via Nottingham and Joule processes, as a possible candidate for breakdown initiation. For this, field emission from an intrinsic Cs2Te ultrathin film coated on a copper substrate was modeled within the Stratton–Baskin–Lvov–Fursey formalism, describing the processes and effects in the bulk and on the surface of a photocathode exposed to high RF electromagnetic fields. It is shown that a field-emission characteristic deviates significantly from the classical Fowler–Nordheim (FN) theory, whereby predicting that dark current is orders of magnitude lower than the one expected by FN law. Conventional pulsed heating was also found to impose negligible heating to the photocathode. Both conclusions suggest that a Cs2Te photocathode coated on a metal substrate would be insensitive to catastrophic thermal-material runaway breakdown, unlike what is observed for metal surfaces. Finally, a few unconventional breakdown candidate scenarios are identified and discussed, including thermoelastic deformation and avalanche breakdown.

Shinohara, Ryo (ORCID:0000000276995732)↗
DOE OSTI2024

Investigation of Local Parameters of PERC Solar Cells Metallized with Screen Printed Cu-Paste

For 40 TW of PV required to transition our planet to 100% renewables, the silver (Ag) should disappear from PV production. Advantages of copper (Cu) over silver (Ag) include: 1) bulk Cu has a similar conductivity to Ag (1.7 one millionth O-cm for Cu, 1.6 one millionth O-cm for Ag, and 2) Cu is -100 times cheaper than Ag, making it an excellent potential replacement. Problems associated with copper contacts include: 1) easy oxidation, and 2) diffusion into the Si cell and recombination activity. To summarize: 1) Rs map shows some regions with very high Rs, indicating no contact in those areas; 2) the histogram shows the peak Rs -5 ohm.cm2, which explains the high FF loss due to Rs; and 3) DLIT indicates non-uniformity in J01 and J02.

copper↗
DOE OSTI2023

Outcomes of WPEC SG47 on "Use of Shielding Integral Benchmark Archive and Database for Nuclear Data Validation"

The Working Party on International Nuclear Data Evaluation Co-operation Subgroup 47 (WPECSG47) entitled "Use of Shielding Integral Benchmark Archive and Database for Nuclear Data Validation" was organised from 2019 and 2022 with the objectives to promote more systematic and wider use of shielding benchmark experiments in nuclear data (ND) and transport code validation and development, to provide feedback on the Shielding Integral Benchmark Archive and Database (SINBAD), and to promote its further development in coordination with the Expert Group on Physics of Reactor Systems (EGPRS). Altogether 9 meetings, the large majority (8) held remotely, were organised during the past 3 years to discuss the experience on the use of SINBAD, evaluation of new benchmarks and improvements to be contributed to the database which was severely neglected and lacking maintenance over the past ← 10+ years. Several proposals for new or updated benchmark evaluation were presented and discussed, such as FNG copper, LLNL pulsed spheres, CIAE iron sphere, KFK 1977 gamma measurements, Rez Fe sphere, ASPIS, ORNL Oxygen broomstick, TIARA and others. Complementing the database with new features was also discussed, for example providing the nuclear data sensitivity profiles more systematically would facilitate and better guide the use of data. Information on the geometry, (radiation source) and materials available in CAD format is expected to allow an easier and less error prone reference for computational model preparation and a potential input to CAD based workflows. Inputs for various transport codes and other benchmark data from participants have been shared via the NEA GitLab which could hopefully in the future evolve and form a bases for critically checked and validated benchmark data. Future development of SINBAD will be monitored by EGPRS and the newly created SINBAD Task Force.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗