Search NASA⌕ Search

DOE OSTI · 2466161

Exploring the Performance and Reliability of Screen-Printable Fire-Through Copper Paste on PERC Solar Cells

Abstract

For 40 TW of PV required to transition our planet to 100% renewables, the silver (Ag) should disappear from PV production. Advantages of copper (Cu) over silver (Ag) include 1) bulk Cu has a similar conductivity to Ag (1.7 mu O-cm for Cu, 1.6 mu O-cm for Ag) and 2) Cu is approximately 100 times cheaper than Ag, making it an excellent potential replacement. Problems associated with copper (Cu) contacts include 1) easy oxidation and 2) diffusion into the Si cell and recombination activity.

Explore related subjects

Keep this discovery

Explore connections, maps & timelines

BibTeXRIS

Mitra, Suchismita, Johnston, Steve (ORCID:0000000333088267), Guthrey, Harvey (ORCID:0000000315743379), Hacke, Peter, Dharmadasa, Ruvini, Druffel, Thad, Elmer, Kevin, Nambo, Apolo, Williams, Dustin, Upadhyaya, Ajay, Upadhyaya, Vijaykumar D., Rohatgi, Ajeet, Stradins, Paul. 2024-10-07. Exploring the Performance and Reliability of Screen-Printable Fire-Through Copper Paste on PERC Solar Cells. https://www.osti.gov/biblio/2466161

Cite the original work for its findings. Save a collection to share your selection of sources.

KEEP EXPLORING

Related reports

Development and Reliability of Screen-Printable Fire-Through Cu Paste for Passivated Contact Solar Cells

We present the development of copper (Cu) paste which has been screen printed on Selective Emitter-Passivated Emitter Rear Contact (SE-PERC) solar cells. This paste can also be applied to Tunnel Oxide Passivated Contact (TOPCON) solar cells due to its fire-through nature. Champion PERC cells have achieved ....efficiency with ...parameters . Accelerated testing to investigate reliability performance of the SE- PERC mini-modules were carried out in damp heat chamber with 85oC and 85% humidity. The devices were found to be operational even after 1,500 hours. Devices with screen printed Ag contacts on the front side have been studied in parallel to the Cu contacts for comparison.

copper paste↗