BNL - Alphacore Silicon Carbide Monolithic Active Pixel Sensors (BASiC MAPS)
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42 ENGINEERING↗
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Low power on-chip data transmission for wafer-scale monolithic active pixel sensors
Here, this paper details the implementation of the digital pulse shaping subsystem within the Backbone Transmission Line Encoding (BTLE) driver, a low-power, long-distance on-chip data transmission solution designed in a 65 nm CMOS process. Digital pulse shaping is critical for minimizing inter-symbol interference (ISI) caused by bandwidth limitations of on-chip interconnects, especially in wafer-scale monolithic active pixel sensors (MAPS). A duobinary encoder coupled with a parallelized polyphase finite impulse response (FIR) filter is used for efficient shaping of the transmitted signal spectrum. This reconfigurable architecture achieves reliable 160 Mb/s data transfer over a 10 cm on-chip link, as validated by simulations demonstrating low power consumption (FoM 37.3 fJ/bit/mm of transmission line length) and effective ISI mitigation.
47 OTHER INSTRUMENTATION↗
Monolithic Active-Pixel Infrared Sensors
Monolithic arrays of active-pixel junction field-effect (JFET) devices made from InGaAs proposed for use as imaging sensors sensitive to light in visible and short-wavelength infrared parts of electromagnetic spectrum. Each pixel of such array comprises photodetector monolithically integrated with JFET output-amplifier circuit of source-follower type - structure similar to charge-coupled device (CCD). Sizes of instruments reduced because large cooling systems not needed.
Fossum, Eric R.↗
Readout Characteristics of Integrated Monolithic InGaAs Active Pixel Sensor Array
A newly fabricated Monolithic InGaAs Active Pixel Image Sensor is presented, and its readout characteristics are described.
Readout↗
Deep Learning Approach for High-accuracy Electron Counting of Monolithic Active Pixel Sensor-type Direct Electron Detectors at Increased Electron Dose
Abstract Electron counting can be performed algorithmically for monolithic active pixel sensor direct electron detectors to eliminate readout noise and Landau noise arising from the variability in the amount of deposited energy for each electron. Errors in existing counting algorithms include mistakenly counting a multielectron strike as a single electron event, and inaccurately locating the incident position of the electron due to lateral spread of deposited energy and dark noise. Here, we report a supervised deep learning (DL) approach based on Faster region-based convolutional neural network (R-CNN) to recognize single electron events at varying electron doses and voltages. The DL approach shows high accuracy according to the near-ideal modulation transfer function (MTF) and detector quantum efficiency for sparse images. It predicts, on average, 0.47 pixel deviation from the incident positions for 200 kV electrons versus 0.59 pixel using the conventional counting method. The DL approach also shows better robustness against coincidence loss as the electron dose increases, maintaining the MTF at half Nyquist frequency above 0.83 as the electron density increases to 0.06 e−/pixel. Thus, the DL model extends the advantages of counting analysis to higher dose rates than conventional methods.
Materials Science↗
Monolithic InGaAs JFET Active Pixel Tunable Image Sensor (MAPTIS)
A new Monolithic InGaAs Active Pixel Multispectral Image Sensor is described. This Infrared sensor will utilize high quality InGaAs grown by Molecular Beam Epitaxy on InP substrate for the fabrication of a high speed Junction Field Effect Transistor array.
hyper↗
Digital pixel test structures implemented in a 65 nm CMOS process
The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20–40 µm and bent to form truly cylindrical half barrels. Among the first critical steps towards the realisation of this detector is to validate the sensor technology through extensive characterisation both in the laboratory and with in-beam measurements. The Digital Pixel Test Structure (DPTS) is one of the prototypes produced in the first sensor submission in this technology and has undergone a systematic measurement campaign whose details are presented in this article. The results confirm the goals of detection efficiency and non-ionising and ionising radiation hardness up to the expected levels for ALICE ITS3 and also demonstrate operation at + 20 °C and a detection efficiency of 99% for a DPTS irradiated with a dose of 10 15 1 MeV n eq cm -2 . Furthermore, spatial, timing and energy resolutions were measured at various settings and irradiation levels.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
Design optimization of MAPS-based detectors using a data-driven fast simulation approach
A parametric simulation tool for pixel sensors is presented. A realistic pixel response is simulated purely based on measurement input, without requiring detailed knowledge of the underlying manufacturing process. As such, it provides an efficient alternative to the use of Technology Computer-Aided Design simulations, which typically depend on proprietary process information. Due to its parametric approach, the package is fast and thus particularly useful for larger detector systems and high hit rate environments. This work presents measurements, simulation and its validation for the MALTA2 sensor. It is a small collection electrode monolithic active pixel sensor produced in the Tower 180 nm complementary metal-oxide-semiconductor imaging process. Modifications to the sensor’s periphery, mainly in the hit merger, are studied in order to optimize the performance for tracking and calorimetry. This optimization is of special interest as part of the MALTA3 sensor redesign in the 65 nm Tower Partners Semiconductor Co. process.
72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
Beam test performance of AstroPix sensor with 120 GeV protons
AstroPix is a High-Voltage CMOS Monolithic Active Pixel Sensor (HV-CMOS MAPS) developed for precision gamma-ray imaging and spectroscopy in the medium-energy regime, as well as for precise shower imaging and tracking in the Barrel Imaging Calorimeter (BIC) of the Electron Proton/Ion Collider (ePIC) detector at the future Electron–Ion Collider (EIC). We present beam test results of the AstroPix_v3 sensor using a 120 GeV proton beam at the Fermilab Test Beam Facility (FTBF), performed as part of the broader experimental campaign for the BIC prototype calorimeter. The sensor’s 500 µm pixel pitch enabled precise measurement of the beam profile, providing important information for the calorimeter performance studies. Using the measured 120 GeV proton data, we measure the energy deposit of minimum ionizing particles (MIP) and use them to extract the corresponding effective depletion depth at a single bias voltage of −150 V .
AstroPix↗
Development of CMOS Sensors for HEP with a US-based foundry
We will present a program to establish the first development and manufacturing of HEP-specific sensors monolithically integrated into a standard CMOS process using a US-based foundry. In collaboration with several US universities the project aims to develop Monolithic Active Pixel Sensors (MAPS) designs implemented in the 90 nm technology node, including simple test structures and multi-pixel arrays, and monolithic CMOS sensors with readout integrated circuits, perform detailed characterization of the detector prototypes and quantify their performance for HEP applications.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
AstroPix: A pixelated HVCMOS sensor for space-based gamma-ray measurement
A next-generation medium-energy gamma-ray telescope targeting the MeV range would address open questions in astrophysics regarding how extreme conditions accelerate cosmic-ray particles, produce relativistic jet outflows, and more. One concept, AMEGO-X, relies upon the mission-enabling CMOS Monolithic Active Pixel Sensor silicon chip AstroPix. AstroPix is designed for space-based use, featuring low noise, low power consumption, and high scalability. Desired performance of the device include an energy resolution of 5 keV (or 10% FWHM) at 122 keV and a dynamic range per-pixel of 25–700 keV, enabled by the addition of a high-voltage bias to each pixel which supports a depletion depth of 500 μ m. This work reports on the status of the AstroPix development process with emphasis on the current version under test, version three (v3), and highlights of version two (v2). Version 3 achieves energy resolution of 10.4 ± 3.2% at 59.5 keV and 94 ± 6 μ m depletion in a low-resistivity test silicon substrate.
Astrophysics instrumentation↗
Advanced silicon tracking detector developments for the future Electron-Ion Collider
The proposed Electron-Ion Collider (EIC) will operate high-luminosity high-energy electron+proton and electron+nucleus collisions at the collision energies from 20 GeV to 141 GeV to solve several fundamental questions in the high energy and nuclear physics fields. Its instantaneous luminosity can reach 10 33-34 cm -2 s -1 and the bunching crossing rate is around 10 ns. The EIC project has received CD1 approval from the US DOE in 2021 and moves toward the machine design and preparation for construction. To realize various particle measurements with high precision at the future EIC, a low material-budget and high-granularity silicon vertex and tracking detector with fine spatial and momentum resolutions and nearly 4π solid angle coverage is desired. The Monolithic Active Pixel Sensor (MAPS) and AC Coupled Low Gain Avalanche Diode (AC-LGAD) technologies stand out of several advanced technology options for the EIC silicon vertex and tracking detector subsystems. The MAPS technology has advanced features of low material budget, low power consumption, good radiation resistance and fine spatial resolution. The AC-LGAD technology can achieve fast timing resolution. Latest studies and progress of the EIC silicon vertex and tracking detector conceptual design, performance validations in simulation and ongoing MAPS and AC-LGAD R&D will be shown. Furthermore, schedule and plan of the EIC project detector development will be discussed as well.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
The ladder and readout cables of intermediate silicon strip detector for sPHENIX
A new silicon-strip-type detector was developed for precise charged-particle tracking in the central rapidity region of heavy ion collisions. A new detector and collaboration at the Relativistic Heavy Ion Collider at Brookhaven National Laboratory is sPHENIX, which is a major upgrade of the PHENIX detector. The intermediate tracker (INTT) is part of the advanced tracking system of the sPHENIX detector complex together with a CMOS monolithic-active-pixel-sensor based silicon-pixel vertex detector, a time-projection chamber, and a micromegas-based detector. The INTT detector is barrel shaped and comprises 56 silicon ladders. Two different types of strip sensors of 78 micron pitch and 320 micron thick are mounted on each half of a silicon ladder. Each strip sensor is segmented into 8 × 2 and 5 × 2 blocks with lengths of 16 and 20 mm. Strips are read out with a silicon strip-readout (FPHX) chip. In order to transmit massive data from the FPHX to the down stream readout electronics card (ROC), a series of long and high speed readout cables were developed. This document focuses on the silicon ladder, the readout cables, and the ROC of the INTT. The radiation hardness is studied for some parts of the INTT devices in the last part of this document, since the INTT employed some materials from the technology frontier of the industry whose radiation hardness is not necessarily well known.
43 PARTICLE ACCELERATORS↗
Pixel response characterization of the ARCADIA fully depleted MAPS
Monolithic Active Pixel Sensors (MAPS) achieved widespread use in several scientific applications, thanks to their properties, such as low material budget and high granularity. The ARCADIA INFN project developed a Fully-Depleted MAPS (FD-MAPS), using a modified LFoundry 110 nm CIS process. This work presents the first laboratory characterization of the ARCADIA MD3 prototype. Measurements include threshold uniformity studies using both test-pulse injection and a 55 Fe source, as well as threshold and noise calibration achieved thanks to monochromatic X-ray sources. Ultimately, charge-collection efficiency is evaluated using an infrared laser setup.
Particle tracking detectors↗
Bayesian Optimization of The Relativistic Heavy Ion Collider Luminosity via s * Control
A state-of-the-art jet detector named sPHENIX was proposed, commissioned, and operated at the Rel ativistic Heavy Ion Collider (RHIC) from 2023 to 2025. This detector featured precision tracking and calorime try that enable high-statistics studies of the Quark Gluon Plasma through jet modification, upsilon suppres sion, and open heavy flavor production. The innermost component of the three sPHENIX tracking systems is the Monolithic-Active-Pixel-Sensor-based Vertex Detec tor (MVTX) (Fig. 1), which has an acceptance within | s | < 0.1m of the interaction point (IP).
43 PARTICLE ACCELERATORS↗
Performance of the AstroPix Prototype Module for the Barrel Imaging Calorimeter at the ePIC Detector and in Space-Based Payloads
AstroPix is a high-voltage CMOS (HV-CMOS) monolithic active pixel sensor originally developed to enable precision gamma-ray imaging and spectroscopy in the medium-energy regime (~100 keV–100 MeV) based on the groundwork laid by ATLASpix and MuPix. It features a 500 μm pixel pitch, in-pixel amplification and digitization, and low power consumption (~3-4 mW/cm2), making it scalable for large-area, multilayer telescope detector planes. The detectors have a designed dynamic range of 25 keV to 700 keV. With these features, AstroPix meets the requirements of future space-based high-energy telescopes and the imaging layers of the Barrel Imaging Calorimeter (BIC) in the Electron-Proton/Ion Collider (ePIC) detector at the future Electron-Ion Collider (EIC). For the space-based payload, AstroPix is being integrated into sounding rocket and balloon payloads to demonstrate the technical readiness of the devices. For BIC, AstroPix-based imaging layers interleaved within the lead/scintillating-fiber (Pb/SciFi) sampling calorimeter provide granular shower imaging, enabling key performance features such as electron/pion or gamma/neutral pion separation. As part of the ongoing detector R&D efforts, we have been testing various AstroPix_v3 configurations: the single chip, a quad-chip assembly, a three-layer stack of quad chips, and a 9-chip module that represents the smallest prototype unit of the BIC imaging layer. This presentation will highlight recent performance test results from these AstroPix detector configurations.
Kim, Bobae (ORCID:0000000295396815)↗
Heavy Flavor Physics at the sPHENIX Experiment
The sPHENIX experiment is a state-of-the-art jet and heavy flavor physics detector, which successfully recorded its first Au + Au collision data at 200 GeV at the Relativistic Heavy Ion Collider (RHIC). sPHENIX will provide heavy flavor physics measurements at RHIC, covering an unexplored kinematic region and unprecedented precision, to probe the parton energy loss mechanism, parton transport coefficients in quark–gluon plasma, and the hadronization process under various medium conditions. At the center of sPHENIX, the monolithic active pixel sensor (MAPS)-based VerTeX detector (MVTX) is a high-precision silicon pixel detector. The MVTX provides excellent position resolution and the capability of operating in continuous streaming readout mode, allowing precise vertex determination and recording a large data sample, both of which are particularly crucial for heavy flavor physics measurements. In this work, we will show the general performance of heavy-flavor hadron reconstruction. In addition, we will discuss the commissioning experience with sPHENIX. Finally, we will provide the projection of b-hadron and jet observables and discuss the estimated constraints on theoretical models.
72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
Impact of front-end parameters of the ARCADIA MD3 on charged particle detection
The ARCADIA INFN R&D project developed a Fully Depleted Monolithic Active Pixel Sensor (FD-MAPS) using a customized LFoundry 110 nm CIS process. The first in-beam characterization of the ARCADIA Main Demonstrator 3 (MD3) sensor with 200 $μ$m active thickness has been performed at the Fermilab Test Beam Facility with a 120 GeV proton beam. The Device Under Test (DUT) is tested with a trigger-less telescope composed of two ARCADIA MD3 tracking planes. This early study investigates the effect of the front-end parameters on the tracking performance.
Pantouvakis, C. [Padua U.; INFN, Padua]↗