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The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.
This presentation describes power electronics thermal management technologies used for on-road EVs. Examples are provided and heat exchangers are described. Advanced cooling technologies developed are NREL to enable increased power density and enable high WBG temperature operation are then presented. The performance (e.g., thermal resistance, pumping power) of the advanced power electronics cooling technologies are compared to the performance of current, on-road technology.
A cooling system for an electrified vehicle includes a first cooling loop for circulating coolant for cooling at least one of power electronics and a motor/generator of the vehicle. The first coolant loop includes a heat exchanger for exchanging heat with the coolant in the first cooling loop. A second cooling loop is provided for circulating coolant for cooling a battery of the vehicle. The second cooling loop includes a coolant chiller connected to a refrigeration system of the vehicle for exchanging heat in the coolant received from the battery with the refrigeration system of the vehicle.
The share of vehicles with fully electric propulsion systems is constantly increasing, and so is their traction drive power. The continuous push to increase power of electric vehicle (EV) traction drives necessitates their efficient cooling to prevent damage to temperature sensitive components of the drive system and achieving higher power outputs in a smaller footprint. With increasing power and power density of electric traction drives, their thermal management is becoming increasingly challenging. This tutorial will provide an overview of thermal management approaches for electric motors and power electronics in EV applications. It will review examples of current industry solutions for power-dense electric motor cooling, power electronics (inverter) cooling, their integration concepts and thermal management system solutions. We'll look at the advantages and challenges of power electronics integration into a single traction drive unit and respective thermal management system concepts. We'll talk about barriers to implementation of a unified thermal management system. The tutorial will also review key aspects of thermal management system design: modeling and simulation using FEA and CFD tools, experimental characterization, and general workflow for thermal management system evaluation.
Additive manufacturing has transformed thermal management by enabling the production of complex, optimized geometries that conventional manufacturing methods cannot achieve. This study investigates the single-phase convective heat transfer performance of gyroid triply periodic minimal surface (TPMS) lattice structures with functional porosity. TPMS structures provide high surface area to volume ratios and are amenable to 3D printing. A gyroid numerical model was created and validated against an existing experimental study with a similar feature size to the investigated geometries. The TPMS structure has a periodic width of 1.6 mm, a length of 10 mm, and a height of 4 mm, with a functional porosity ranging from 0.5 to 0.8, decreasing with distance from the heated surface. Three different flow configurations were examined for an inlet fluid temperature of 70 °C. The inlet velocities range from 0.01 to 1.2 m/s, corresponding to a Reynolds number range of 10–900 with a heat flux of 50 W/cm 2 applied at the base. AmpCool ® AC-110 dielectric fluid (Prandtl number 59.5) was used as the coolant. Thermal performance and friction characteristics were studied for the three flow orientations. The parallel flow configuration was identified as the most efficient for heat removal. A detailed analysis of the numerical results highlights the underlying physics behind the thermal performance differences among the flow configurations.
The poster showcases NREL team's accomplishments in supporting Electric Drive Technologies (EDT) consortium members in a fifth year of a six-year project funded by DOE Vehicle Technologies Office.
The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. The performance (e.g., thermal resistance, pumping power) of the power electronics cooling technologies developed in this project are compared to the performance of current, on-road technology. One of the main challenges to achieving high power densities is associated with packaging high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors).
Heavy-duty PEM fuel cells could be a low-cost, low emission alternative to combustion turbines for re-electrifying hydrogen if used as part of a long duration grid energy storage systems. Many studies expect heavy duty PEM fuel cell production costs to reduce as manufacturing volumes ramp up and their expected durability of 25,000-30,000 hours aligns well with a 30-year life for hydrogen seasonal energy storage plants that would likely operate less than 10% of the year. The labor, material, and equipment costs associated with installing PEM fuel cells and their required balance of plant for stationary applications have not been thoroughly explored, however. This study performs a detailed design and cost analysis of a 100 MW stationary PEM fuel cell power plant, capturing costs such as cooling, power electronics, pipes, valves, fittings, cabling, conduit, concrete foundations, buildings, and land. It employs methods consistent with NLR's solar PV benchmarking cost analysis and annual technology baseline to derive the total installed costs of stationary PEM fuel cell plants that utilize heavy duty PEM fuel cells.
This paper discusses design tradeoffs and thermal modeling explored in cooling strategies for an aircraft propulsion electric motor with additively manufactured coils and distributed power electronics integrated with heat pipes. Design tradeoffs include heat pipe Qmax performance related to inclination, condenser configuration, coolant type, coolant flow path complexity, and ease of access to modular power electronics. Three cooling strategies were selected and realized into CAD models. These models were further evaluated using 3D thermal FEA and optimization tools to explore cooling geometry details that include fin thickness, spacing and count with the objective to minimize fin mass under a set of constraints. Lastly, motorette test data is presented comparing air versus liquid cooling of heat pipes.
The presentation represents a report of accomplishments during FY 2022 and is prepared for 2022 DOE VTO Annual Merit Review. The project goal is facilitation of achieving DOE 2025 target of 33 kW/L system power density for an electric traction drive through support of other EDT consortium members in design and development of thermal management systems for their respective integrated drive concepts. Namely, identifying pathways enabling high-performance, compact, and reliable integrated electric drives. Specific objectives are: 1) Research and evaluation of motor-integrated power electronics packaging technologies and thermal management approaches. 2) Development of thermal management system and its sub-components to enable integrated electric drive DOE power density targets in collaboration with project partners. 3) Supporting activities of DOE's Electric Drive Technologies (EDT) consortium members, Oak Ridge National Laboratory (ORNL) and University of Wisconsin research teams in thermal management component design and thermal modeling of their integrated traction drives. 4) Identifying candidate driveline fluids suitable for direct cooling of traction-drive components and high-voltage power electronics and evaluate their convective cooling performance.
Single-phase cooling using microchannel heat sinks (MCHS) has become a popular approach for overcoming the thermal challenges associated with high-powered microelectronic devices. Thermal management is one of the largest barriers to higher power densities in electronics and frequently limits overall device performance. The implementation of forced convective cooling via single-phase liquid cooling in MCHS reduces the thermal resistance resulting in lower device temperatures at high-power conditions, which can decrease the package size and extend the lifespan of devices. The goal of the work described in this article was to investigate practical cooling solutions for laser diode bars. This study examined the effectiveness of a copper tungsten (CuW) microchannel heat sink paired with a dielectric coolant (FC3283) for dissipating both discrete and uniform heat fluxes up to 600 W/cm2 across a 0.25-cm2 surface area through a numerical and experimental study. CuW was chosen as the MCHS material because it is thermal expansion matched to GaAs, which is a common laser diode substrate. FC3283 serves as a dielectric coolant that is compatible with power electronics cooling. The microchannels utilized in this work were approximately $365$ $μ$ m deep and $100$ $μ$ m wide resulting in a hydraulic diameter of $160$ $μ$ m. The study investigated the cooling performance across a variety of applied power loads and flow rates to determine optimal effectiveness. The resulting thermal resistance ranged from 0.15 cm2 K/W at the highest flow rate to 0.26 cm2 K/W at the lowest flow rate. Further, the resulting thermal performance from this study demonstrates the importance of considering discrete heat sources separately from uniform heat sources and proved that the unique combination of CuW microchannels with FC3283 can be a promising cooling option toward future advancements of laser diode bars and other high-power microelectronics.
We developed an Extreme Heat Flux Micro-cooler (EHFµ-C) capable of removing heat flux of ~1 kW/cm 2 with a small temperature rise ~10°C. This represents greater than 10× reduction in thermal resistance compared to the state-of-the-art single-phase cooling technologies (~0.5 cm 2 -°C/W) that greatly increases the efficiency, resulting in improved performance and reliability for microprocessors and power electronics. The EHFµ-Cooler utilizes liquid wicking (no pump) and thin-film evaporation in a 30 µm thick wick porous microstructure such as copper inverse opal (CIO), silicon and AlN pin fins along with a 3D manifold (copper wiremesh and silicon) with liquid routing and vapor extraction channels achieving an unprecedented vapor quality ~ >0.9. The proposed EHFµ-Cooler significantly reduces device temperature, resulting in 25-50% improvement in reliability and device performance. Based on very conservative estimates, the total energy saving for data centers due to improved performance can be 6 billion kWh/year (>$300M). Better cooling, leading to more efficient, higher performance and more reliable power electronics, would save the nation 3 Quad of primary energy in 2030. Just for automotive application, a 10% increase in fuel efficiency for SiC-based power electronics equates to >20 million gallons of fuel savings annually. The proposed EHFµ-Cooler technology ensures the United States maintains its technological lead in high-performance computing and high-power electronics, while at the same time improving the energy efficiency, and as a result reducing energy-related emissions such as greenhouse gases.
This work highlights an integrated thermal management solution for the outer-rotor motor (ORM) drive. The integrated ORM drive utilizes water-ethylene glycol coolant for power electronics and stator cooling. Air cooling is used for rotor laminations, magnets and outer-rotor structures, and the rotor shaft. To fully understand the performance of the integrated ORM drive and thermal management coupling effects, a full drive conjugate heat transfer model has been developed to investigate coupled cooling performance of various components of the ORM drive. Various motor rotational speeds, power output scenarios, and cooling options for the integrated ORM drive have been investigated. The model estimates the operating window for the ORM drive while keeping component operating temperatures below prescribed limits. The model also highlights the importance of windage losses at higher rotational speeds for this ORM design, which involves higher rotor surface area per unit width of the rotor. Different designs are also investigated, particularly focusing on rotor cooling with air either naturally induced by rotor spin or forced airflow with the help of a blower, to circumvent challenges imposed by higher windage losses. The work highlights motor rotational speed limitations and the need for potential liquid cooling options for desired rotor performance at higher rotational speeds. Liquid cooling for the rotor may even become more critical for nonuniform rotor-stator gaps, leading to even higher and uneven windage losses across the full circumference of the motor, consequentially, more heating for the rotor.
This paper discusses power electronics developed under the ARPA-E GAMOW program to support nuclear fusion power production. The goal of this project was to develop and assess the potential for wide-bandgap (WBG) semiconductor devices in power electronics to enable high-efficiency and high-voltage solid-state systems for fusion plasma generation, heating, and control. The power electronics use an architecture in which multiple high-power boards can be combined to produce megawatt-level power, where using multiple boards provides high reliability. Two main areas of power electronics boards are developed in this project for fusion plasma heating and control applications: (1) pulse generation and control and (2) radiofrequency generation. The first area is for boards capable of driving high-voltage millisecond pulses at high duty cycles. The envisioned application of these pulses is in plasma control of magnetohydrodynamic instabilities, plasma position, and edge-localized modes. Pulse-width modulation allows for the implementation of a wide variety of linear and nonlinear control systems. The boards developed for this project could actuate control coils based on digital input signals and can be parallelized to provide megawatts of output power. The design of the pulse generator is a low-side load switch. A load switch was designed and constructed that utilized 2-kV-rated field-effect transistor (FET)-based cascodes developed by Qorvo under this project to perform initial testing of these cascodes. The second area is being implemented using class E amplifiers with WBG devices and a reactance steering network to handle inductive or capacitive plasma loads. Applications include ion cyclotron resonance heating (ICRH) and high-harmonic fast-wave (HHFW) heating. A class E reactance steering network is demonstrated in modeling and experiment with a resistive-inductive load that models an inductively-coupled plasma. Power combining of boards with class E reactance steering networks is also simulated and demonstrated experimentally, to enable scaling up to high power. Modeling of high-power-density cooling and remaining useful life is conducted to enable reliable, effectively cooled high-power electronics for fusion applications.
Boiling heat transfer plays a crucial role in a wide range of applications, such as power generation, refrigeration, electronics cooling, and pharmaceutics. Among the various factors that influence boiling heat transfer, the dynamics of vapor bubble nucleation, growth, and departure from the heated surface stand out as particularly important. An emerging phenomenon that can promote the departure of bubbles smaller than the Fritz diameter is coalescence-induced departure. If the dynamics of this process are fully understood, then surfaces can be engineered to promote faster bubble departure and substantially increase the performance of boiling heat transfer. Further, this work expands on published results by presenting a detailed numerical analysis of bubble coalescence and departure for a range of initial bubble diameters and size ratios between coalescing bubbles. Analysis of the results is focused on explaining how the release of surface energy and bubble surface dynamics lead to bubble departure, as well as fundamentally distinguishing capillary–inertial jumping and buoyant–inertial departure mechanisms across different bubble sizes and size ratios. The results show that both the initial sizes of the coalescing bubbles and the ratio between their sizes can determine whether the merged bubble will leave the surface through capillary–inertial jumping or buoyant departure. Below a certain bubble size, the release of surface energy by the merger is not sufficient to propel the merged bubble from the surface.
The project team completed work to expand upon American Axle & Manufacturing’s (AAM) baseline technology and develop a high-speed, AC induction electric drive unit (EDU) with total direct-oil-cooling and integrated power electronics. The project accelerated advancements in EDU technology by allowing AAM to build upon the progress made in developing the underlying baseline technologies. The following seven improvements to AAM’s baseline technology were implemented in this research and development program: 1) Increased speed (30k RPM) AC induction motor, 2) Silver-sintering of discrete silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFET) to heat sinks, 3) Electrically insulated rotor bars, 4) Optimized lamination steel, 5) EDU-integrated 650VDC inverter package, 6) Over-molded stator with molded liners, and 7) 650VDC power-dense stator design. The successful development of the technology resulted in a meaningful cost reduction for EDU systems in the market. Coupled with falling battery system costs, lower EDU costs will likely accelerate the market acceptance and related production scaling of battery electric vehicles. The objective of this project was to research, develop, and test a Heavy Rare Earth (HRE)-free 3-In-1 electric drive unit (EDU) that has class leading power density and cost. The key technologies to be developed were anticipated to meet or exceed the Department of Energy (DOE) targets of a cost ≤ $\$$7/kilowatt (kW), power density ≥ 12 kW/liter, and operating voltage ≥ 600 VDC.
With the rapid growth of Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs), much more rigorous design targets have been set for automotive power electronics, including high power density, high reliability, and low cost. Novel power module and inverter technologies based on wide bandgap (WEG) semiconductors have been developed to meet these design targets, while providing optimal power semiconductor operating temperature and promising thermomechanical performance. Compared with conventional cooling techniques which are normally applied only on one side of power module, double-side cooling approach is now believed to be the solution to enable high power density and low thermal resistance of WEG semiconductor-based power electronics. In this work, we develop a three-phase power module that is double-sided cooled using dielectric fluid jet impingement. In each phase, four silicon carbide (SiC) power semiconductors are bonded to copper busbars without electrical insulation layers. A finite element analysis (FEA) model is created for thermal and thermomechanical analysis. Based on FEA modeling results, we select particular dimensions for a parametric study to optimize thermal and mechanical performance. Using a multi-objective genetic algorithm (MOGA)-based optimization method, we have minimized the maximum junction temperature and thermal stresses within the power module. The multiphysics co-optimization approach has enabled an efficient design process of power modules with greatly reduced computational cost, as compared to conventional processes that rely on exhaustive numerical simulations and iterations.
This study investigates three mounting methods—clamping, soldering, and a hybrid clamping–soldering approach—for cryogenically cooled thin diamond crystals crucial to stable operation of X-ray Free Electron Laser (XFEL) systems. While clamping methods exhibit temperature resilience and flexibility, meticulous design is required to prevent stress-induced warping and reduce thermal contact area. Soldering methods offer reliable mechanical and thermal bonding but encounter challenges due to the coefficient of thermal expansion mismatch at cryogenic temperatures. The hybrid method, integrating clamping and soldering with strain relief cuts, effectively mitigates overall distortion caused by mounting and XFEL thermal loads. These findings offer a novel mounting solution for high-performance x-ray optics in XFEL research and applications, ensuring stability and optimal functionality in cryogenic conditions.