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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2009

Mitigation selection and qualification recommendations for Xilinx Virtex, Virtex-II, and Virtex-4 field programmable gate arrays

This work discusses mitigation selection and qualification techniques for Xilinx reconfigurable field programmable gate arrays (FPGAs). The aim of the paper is to provide readers with a better understanding of the engineering/reliability/project cost relationship that occurs when developing a mitigation strategy for static random access memory (SRAM)-based FPGAs.

Allen, Gregory↗
NASA NTRS2004

Virtex-II Pro SEE Test Methods and Results

The objective of this coarse Single Event Effect (SEE) test is to determine the suitability of the commercial Virtex-II Pro family for use in spaceflight applications. To this end, this test is primarily intended to determine any Singe Event Latchup (SEL) susceptibilities for these devices. Secondly, this test is intended to measure the level of Single Event Upset (SEU) susceptibilities and in a general sense where they occur. The coarse SEE test was performed on a commercial XC2VP7 device, a relatively small single processor version of the Virtex-II Pro. As the XC2VP7 shares the same functional block design and fabrication process with the larger Virtex-II Pro devices, the results of this test should also be applicable to the larger devices. The XC2VP7 device was tested on a commercial Virtex-II Pro development board. The testing was performed at the Cyclotron laboratories at Texas A&M and Michigan State Universities using ions of varying energy levels and fluences.

Petrick, David↗
NASA NTRS2004

Virtex-II Pro SEE Test Methods and Results

The Xilinx Virtex-II Pro is a platform FPGA that embeds multiple microprocessors within the fabric of an SRAM-based reprogrammable FPGA. The variety and quantity of resources provided by this family of devices make them very attractive for spaceflight applications. However, these devices will be susceptible to single event effects (SEE), which must be mitigated. To use the Virtex-II Pro reliably in space applications, these devices must first be tested to determine if they are susceptible to single event latchup (SEL), the degree to which they are susceptible to single event upsets (SEU) and single event transients (SET), and how these effects are manifested in the device. With this information, mitigations schemes can be developed and tested that address the specific susceptiblities of these devices. This initial SEE test uses a commercial off the shelf Virtex-II Pro evaluation board, with a single processor XC2VP7 FPGA. The FPGA on this board is an acid etched device, which can be partially covered with a shield. The shield covers a portion of the logic, routing, and memory resources along with some of the RocketIO transceivers. The processor, along with a large portion of logic, routing, memory, and transceivers are left exposed. This test will be performed at the Cyclotron Laboratories at Texas A&M University and Michigan State University using ions of varying energy levels and fluencies.

Petrick, David↗
NASA NTRS2007

Initial Single Event Effects Testing of the Xilinx Virtex-4 Field Programmable Gate Array

We present initial results for the thin epitaxial Xilinx Virtex-4 Fie ld Programmable Gate Array (FPGA), and compare to previous results ob tained for the Virtex-II and Virtex-II Pro. The data presented was a cquired through a consortium based effort with the common goal of pr oviding the space community with data and mitigation methods for the use of Xilinx FPGAs in space.

single event effects↗
NASA NTRS2008

VIRTEX-4 VQ static SEU Characterization Summary

This report is the result of the combined efforts of members within the Xilinx Radiation Test Consortium (XRTC), sometimes known as the Xilinx SEE Test Consortium. The XRTC is a voluntary association of aerospace entities, including leading aerospace companies, universities and national laboratories, combining resources to characterize reconfigurable FPGAs for aerospace applications. Previous publications of Virtex-4 radiation results are for commercial (non-epitaxial) devices; see, for example, Refs. 1-4. A notable exception is Ref. 5, which presents XRTC upset measurements of storage elements in the PowerPC405s in the XQR4VFX60. This report of upset susceptibility to heavy ions and protons of the static memory elements in the Virtex-4QV family is a direct parallel to the XRTC report on the thin epitaxial devices in the Virtex-2 family released four years ago.

field programmable gate array (FPGA)↗
NASA NTRS2009

Virtex-4VQ dynamic and mitigated single event upset characterization summary

This report is the result of funding by the NASA Electronic Parts and Packaging Program (NEPP) and the combined efforts of members within the Xilinx Radiation Test Consortium (XRTC), sometimes known as the Xilinx Single Event Effects (SEE) Test Consortium. The XRTC is a voluntary association of aerospace entities, including leading aerospace companies, universitie and national laboratories, combining resources to characterize reconfigurable, field programmable gate arrays (FPGAs) for aerospace applications. Previous publications of Virtex-4 radiation results are for commercial (non-epitaxial) devices; see, for example, Refs. 1–5. A notable exception is Ref. 6, which presents XRTC upset measurements of storage elements in the PowerPC405s in the XQR4VFX60. This work represents a continuation of the efforts reported in the “Virtex-4QV Static SEU Characterization Summary” [7]. The contents of this report describe various Single Event Functional Interrupt (SEFI) and Single Event Upset (SEU) modes seen while dynamically exercising the clocked resources within Virtex-4 devices and the corresponding mitigation techniques related to the aforementioned observed SEFI modes.

Allen, Gregory↗
NASA NTRS2003

A Genetic Representation for Evolutionary Fault Recovery in Virtex FPGAs

Most evolutionary approaches to fault recovery in FPGAs focus on evolving alternative logic configurations as opposed to evolving the intra-cell routing. Since the majority of transistors in a typical FPGA are dedicated to interconnect, nearly 80% according to one estimate, evolutionary fault-recovery systems should benefit hy accommodating routing. In this paper, we propose an evolutionary fault-recovery system employing a genetic representation that takes into account both logic and routing configurations. Experiments were run using a software model of the Xilinx Virtex FPGA. We report that using four Virtex combinational logic blocks, we were able to evolve a 100% accurate quadrature decoder finite state machine in the presence of a stuck-at-zero fault.

Lohn, Jason↗
NASA NTRS2005

Virtex-II Pro PowerPC SEE Characterization Test Methods and Results

The Xilinx Vix-11 Pro is a platform FPGA that embeds multiple microprocessors within the fabric of an SRAM-based reprogrammable FPGA. The variety and quantity of resources provided by this family of devices make them very attractive for spaceflight applications. However,these devices will be susceptible to single event effects (SEE), which must be mitigated. Observations from prior testing of the Xilinx Virtex-II Pro suggest that the PowerPC core has significant vulnerability to SEES. However, these initial tests were not designed to exclusively target the functionality of the PowerPC, therefore making it difficult to distinguish processor upsets from fabric upsets. The main focus of this paper involves detailed SEE testing of the embedded PowerPC core. Due to the complexity of the PowerPC, various custom test applications, both static and dynamic, will be designed to isolate each Unit of the processor. Collective analysis of the test results will provide insight into the exact upset mechanism of the PowerPC. With this information, mitigations schemes can be developed and tested that address the specific susceptibilities of these devices. The test bed will be the Xilinx SEE Consortium Virtex-II Pro test board, which allows for configuration scrubbing, design triplication, and ease of data collection. Testing will be performed at the Indiana University Cyclotron Facility using protons of varying energy levels and fluencies. This paper will present the detailed test approach along with the results.

Petrick, David↗
NASA NTRS2003

Mitigating Upsets in SRAM-Based FPGAs from the Xilinx Virtex 2 Family

Static random access memory (SRAM) upset rates in field programmable gate arrays (FPGAs) from the Xilinx Virtex 2 family have been tested for radiation effects on configuration memory, block RAM and the power-on-reset (POR) and SelectMAP single event functional interrupts (SEFIs). Dynamic testing has shown the effectiveness and value of Triple Module Redundancy (TMR) and partial reconfiguration when used in conjunction. Continuing dynamic testing for more complex designs and other Virtex 2 capabilities (i.e., I/O standards, digital clock managers (DCM), etc.) is scheduled.

SEE testing↗
NASA NTRS2012

High-Speed, Multi-Channel Serial ADC LVDS Interface for Xilinx Virtex-5 FPGA

Analog-to-digital converters (ADCs) are used in scientific and communications instruments on all spacecraft. As data rates get higher, and as the transition is made from parallel ADC designs to high-speed, serial, low-voltage differential signaling (LVDS) designs, the need will arise to interface these in field programmable gate arrays (FPGAs). As Xilinx has released the radiation-hardened version of the Virtex-5, this will likely be used in future missions. High-speed serial ADCs send data at very high rates. A de-serializer instantiated in the fabric of the FPGA could not keep up with these high data rates. The Virtex-5 contains primitives designed specifically for high-speed, source-synchronous de-serialization, but as supported by Xilinx, can only support bitwidths of 10. Supporting bit-widths of 12 or more requires the use of the primitives in an undocumented configuration, a non-trivial task. A new SystemVerilog design was written that is simpler and uses fewer hardware resources than the reference design described in Xilinx Application Note XAPP866. It has been shown to work in a Xilinx XC5VSX24OT connected to a MAXIM MAX1438 12-bit ADC using a 50-MHz sample clock. The design can be replicated in the FPGA for multiple ADCs (four instantiations were used for a total of 28 channels).

Taylor, Gregory H.↗
NASA NTRS2002

Single event upset susceptibility testing of the Xilinx Virtex II FPGA

Heavy ion testing of the Xilinx Virtex IZ was conducted on the configuration, block RAM and user flip flop cells to determine their single event upset susceptibility using LETs of 1.2 to 60 MeVcm^2/mg. A software program specifically designed to count errors in the FPGA is used to reveal L1/e values and single-event-functional interrupt failures.

FPGA Xilinx Virtex static test single event upset↗
NASA NTRS2002

Single event upset suspectibility testing of the Xilinx Virtex II FPGA

Heavy ion testing of the Xilinx Virtex II was conducted on the configuration, block RAM and user flip flop cells to determine their static single-event upset susceptibility using LETs of 1.2 to 60 MeVcm^2/mg. A software program specifically designed to count errors in the FPGA was used to reveal L1/e, values (the LET at which the cross section is l/e times the saturation cross-section) and single-event functional-interrupt failures.

FPGA Virtex II SEU↗
NASA NTRS2014

Xilinx Virtex-5QV (V5QV) Independent SEU Data

This is an independent study to determine the single event destructive and transient susceptibility of the Xilinx Virtex-5QV (SIRF) device. A framework for evaluating complex digital systems targeted for harsh radiation environments such as space is presented.

Field Programmable Gate Array (FPGA)↗
NASA NTRS2004

IBM powerPC 405 SEU mitigation using processor voting techniques in Xilinx Virtex-I1 pro FPGA

Not until recently, Xilinx has developed a new field programmable gate array (FPGA) device family, Virtex-I1 Pro. In this single device, not only dies it have density logic cells (3K to125K), gigabit connectivity, on chip memory, digital clock management, but also it can have up to four IBM PowerPC 405 Processor hard cores, running up to 400MHz and 633 Mbps. To utilize this cutting edge device in space applications, a few Single Event Upset (SEU) mitigation techniques need to be implemented to a design for the device. At Jet Propulsion Laboratory (JPL), we have successfully demonstrated the feasibility of running multiple processors running in a lock step fashion to accomplish SEU mitigation and fault tolerance.

single event upset (SEU)↗
NASA NTRS2015

Thermal Interface Materials Selection and Application Guidelines: In Perspective of Xilinx Virtex-5QV Thermal Management

The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.

Suh, Jong-ook↗
NASA NTRS2016

Virtex-5 CN Package Daisy Chain Evaluation Test Report

The board-level temperature cycling reliability of Xilinx Virtex-5 (V5) CN package was investigated. V5s were temperature cycled under two conditions, 0 to +100 C (0/100) and -55 to +100 C (-55/100). During the 0/100 test, no part out of 8 parts failed up to 6586 cycles. During the -55/100 test, one part out of 8 parts failed at 1236 cycle, and there were no additional failures up to 1705 cycles. The failure mode of the part that failed at 1236 cycles indicated that most likely the failure was not a solder fatigue failure, and therefore no obvious solder fatigue failure was observed throughout the tests.

Suh, Jong-ook↗