DOE OSTI · 1891969
High-throughput Bend Strengths of Polysilicon MEMS Components.
Abstract
Abstract not provided.
Keep this discovery
Explore connections, maps & timelines
DELRIO, FRANK, Boyce, Brad, Friedman, Lawrence, Cook, Robert. 2021-10-01. High-throughput Bend Strengths of Polysilicon MEMS Components.. https://doi.org/10.2172/1891969
Cite the original work for its findings. Save a collection to share your selection of sources.