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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 181 records · Page 10
All sourcesNASA NTRSDOE OSTI
NASA NTRS1971

Advanced microelectronics research for space applications, phase 2

Negative-resistance circuits with possible space flight applications are discussed. The basic design approach is to use impedance rotation, i.e., the conversion from capacitance to negative resistance, and from resistance to inductance by the phase shift of the transistor current gain at high frequencies. The subjects discussed in detail are the following: hybrid fabrication of VHF and UHF negative-resistance stages with lumped passive elements; formulation of measurement techniques to characterize transistors and to extend the frequency of negative-resistance transistor amplifiers to higher microwave frequencies; and derivation of transistor characteristics required to increase the frequency range of negative-resistance transistor stages.

Gaertner, W. W.↗
NASA NTRS1972

Investigation of mounting discrete chip components for hybrid microelectronic applications.

In the assembly of hybrid microcircuits, passive and active discrete chip components are attached by epoxy cements and by solders. This study was initiated to determine the integrity of such attachments. Alumina substrates were subjected to a group of thermal and mechanical test environments defined by test methods in MIL-STD-883. Lot samples of substrates with assembly variations were subjected to separately applied testing and to serial testing. These test methods were applied sequentially to the same lot of substrates. Epoxy cements were generally satisfactory with respect to separate tests, although sequential tests severely degraded epoxy bond strengths of all types. Bond strengths to unglazed substrates were slightly superior to those of the same components on glazed types. Solder joints were vulnerable to catastrophic failure in several environments, especially temperature cycling and thermal shock. Vibration and impact shock also produced solder joint failures.

Caruso, S. V.↗
NASA NTRS1974

Semiconductor measurement technology: Microelectronic ultrasonic bonding

Information for making high quality ultrasonic wire bonds is presented as well as data to provide a basic understanding of the ultrasonic systems used. The work emphasizes problems and methods of solving them. The required measurement equipment is first introduced. This is followed by procedures and techniques used in setting up a bonding machine, and then various machine- or operator-induced reliability problems are discussed. The characterization of the ultrasonic system and its problems are followed by in-process bonding studies and work on the ultrasonic bonding (welding) mechanism. The report concludes with a discussion of various effects of bond geometry and wire metallurgical characteristics. Where appropriate, the latest, most accurate value of a particular measurement has been substituted for an earlier reported one.

Harman, G. G.↗
NASA NTRS1975

Microelectronic fabrication of superconducting devices and circuits

It is expected that thin-film superconductors can be used as detectors or sources of infrared and microwave radiation, as magnetometers, as voltage standards, and for voltage and current measurements, for electronic signal processing, and in digital circuitry.

Kirschman, R. K.↗
NASA NTRS1975

Quality control of microelectronic wire bonds

Report evaluates ultrasonic bonding of small-diameter aluminum wire joined to ceramic substrates metalized with thin-film and thick-film gold. Quick testing technique for nondestructive location of poor wire bonds is also presented.

Thiel, R. A.↗
NASA NTRS1975

Investigation of discrete component chip mounting technology for hybrid microelectronic circuits

The use of polymer adhesives for high reliability microcircuit applications is a radical deviation from past practices in electronic packaging. Bonding studies were performed using two gold-filled conductive adhesives, 10/90 tin/lead solder and Indalloy no. 7 solder. Various types of discrete components were mounted on ceramic substrates using both thick-film and thin-film metallization. Electrical and mechanical testing were performed on the samples before and after environmental exposure to MIL-STD-883 screening tests.

Caruso, S. V.↗
NASA NTRS1975

Microelectronic bioinstrumentation systems

The possibility of using RF fields to power biologically implanted transmitters used in biomedical experiments was investigated. This approach would be especially useful when animal subjects are strapped in chairs or confined in cages. A telemetry system using an external source of energy has the additional advantage of not being limited in operation by battery lifetime and can therefore operate for virtually infinite lengths of time. A description of a system based on this principle is given. Progress in the development of battery-driven transmitters is also reported, including an ingestible temperature telemetry system and a resistance-to-pulse frequency convertor for implantable temperature telemetry systems.

Ko, W. H.↗
NASA NTRS1975

Contamination Control in Hybrid Microelectronic Modules. Part 1: Identification of Critical Process and Contaminants

Various hybrid processing steps, handling procedures, and materials are examined in an attempt to identify sources of contamination and to propose methods for the control of these contaminants. It is found that package sealing, assembly, and rework are especially susceptible to contamination. Moisture and loose particles are identified as the worst contaminants. The points at which contaminants are most likely to enter the hybrid package are also identified, and both general and specific methods for their detection and control are developed. In general, the most effective controls for contaminants are: clean working areas, visual inspection at each step of the process, and effective cleaning at critical process steps. Specific methods suggested include the detection of loose particles by a precap visual inspection, by preseal and post-seal electrical testing, and by a particle impact noise test. Moisture is best controlled by sealing all packages in a clean, dry, inert atmosphere after a thorough bake-out of all parts.

Himmel, R. P.↗
NASA NTRS1975

Contamination control in hybrid microelectronic modules. Part 2: Selection and evaluation of coating materials

The selection, test, and evaluation of organic coating materials for contamination control in hybrid circuits is reported. The coatings were evaluated to determine their suitability for use as a conformal coating over the hybrid microcircuit (including chips and wire bonds) inside a hermetically sealed package. Evaluations included ease of coating application and repair and effect on thin film and thick film resistors, beam leads, wire bonds, transistor chips, and capacitor chips. The coatings were also tested for such properties as insulation resistance, voltage breakdown strength, and capability of immobilizing loose particles inside the packages. The selected coatings were found to be electrically, mechanically, and chemically compatible with all components and materials normally used in hybrid microcircuits.

Himmel, R. P.↗
NASA NTRS1975

Contamination control in hybrid microelectronic modules. Part 3: Specifications for coating material and process controls

Resin systems for coating hybrids prior to hermetic sealing are described. The resin systems are a flexible silicone junction resin system and a flexible cycloaliphatic epoxy resin system. The coatings are intended for application to the hybrid after all the chips have been assembled and wire bonded, but prior to hermetic sealing of the package. The purpose of the coating is to control particulate contamination by immobilizing particles and by passivating the hybrid. Recommended process controls for the purpose of minimizing contamination in hybrid microcircuit packages are given. Emphasis is placed on those critical hybrid processing steps in which contamination is most likely to occur.

Himmel, R. P.↗