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Results for “Parametric processes”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 199 records · Page 11

Diode step stress program for JANTX1N5615

The effect of power/temperature step stress when applied to the switching diode JANTX1N5615 manufactured by Semtech and Micro semiconductor was examined. A total of 48 samples from each manufacturer were submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests after completing the prior power/temperature step stress point. Results are presented.

Source record↗

Diode step stress program for JANTX1N1202A

Power/temperature step stress was applied to the switching diode JANTX1N1202A manufactured by General Electric and International Rectifier. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests after completing the prior power/temperature step stress point. Results are given.

Source record↗

Transistor step stress program for JANTX2N2060

The effect of power/temperature step stress when applied to the dual transistor JANTX2N2060 manufactured by Raytheon and Motorola is reported. A total of 48 samples from each manufacturer were submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests after completing the prior power/temperature step stress point. Results are given.

Source record↗

Diode step stress program for JANTX1N3893

Data for the purpose of evaluating the effect of power/temperature step stress on the diode JANTX1N3893 manufactured by Siemens and Motorola is presented. A total of 48 samples from each manufacturer were submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.

Source record↗

Diode step stress testing program for JANTX1N3016B

The effect of power/temperature step stress when applied to a variety the zener diode JANTX2N3016B manufactured by Siemens and Motorola is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.

Source record↗

Diode step stress testing program for JANTX1N3031B

The effect of power/temperature step stress when applied to the zener diode JANTX1N3031B manufactured by Siemens and Motorola is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.

Source record↗

Diode step stress testing program for JANTX1N5618

The effect of power/temperature step stress when applied to the switching diode JANTX1N5618 manufactured by Semtech and Micro Semiconductor is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.

Source record↗

Transistor step stress testing program for JANTX2N2369A

The effect is reported of power/temperature step stress when applied to the transistor JANTX2N2369A manufactured by Raytheon and National Semiconductor. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. The power/thermal stress tests are described, and failure analyses are presented.

Source record↗

Transistor step stress program for JANTX2N2945A

Data compiled for the purpose of evaluating the effect of power/temperature step stress when applied to the transistor JANTX2N2945A manufactured by Raytheon and Teledyne is presented. A total of 48 samples from each manufacturer was divided equally (16 per group) into three groups and submitted to the processes outlined. In addition, two control units were maintained for verification of the electrical parametric testing.

Source record↗

Transister step stress testing program for JANTX2N3811

The effect was studied of power/temperature step stress when applied to the dual transistor JANTX2N3811 manufactured by Motorola and National Semiconductor. A total of 48 samples from Motorola and 47 from National Semiconductor was submitted to the processes. In addition, two control sample units were maintained for verification of the electrical parametric testing. The tests for determining power/temperature stresses are described, and test results are discussed. Failure analyses for power stress, and temperature stress are presented.

Source record↗

Parameter dependence of equilibrium charging potentials

Equilibrium surface potentials for slab configurations (representative e.g. of a large solar power satellite) are determined under extensive parametric variations of materials, solar exposure and substorm characteristics. The dependence of the charging process for dielectric surfaces on the various material response characteristics is described. The results are used as a guide to the material selection and design of large space systems to minimize dielectric breakdowns and reduce parasitic leakage currents on SPS.

Suh, P. K.↗

Parametric Cost Deployment

Parametric cost analysis is a mathematical approach to estimating cost. Parametric cost analysis uses non-cost parameters, such as quality characteristics, to estimate the cost to bring forth, sustain, and retire a product. This paper reviews parametric cost analysis and shows how it can be used within the cost deployment process.

Dean, Edwin B.↗

Parametric Analysis of Life Support Systems for Future Space Exploration Missions

The National Aeronautics and Space Administration is in a process of evaluating future targets for space exploration. In order to maintain the welfare of a crew during future missions, a suite of life support technology is responsible for oxygen and water generation, carbon dioxide control, the removal of trace concentrations of organic contaminants, processing and recovery of water, and the storage and reclamation of solid waste. For each particular life support subsystem, a variety competing technologies either exist or are under aggressive development efforts. Each individual technology has strengths and weaknesses with regard to launch mass, power and cooling requirements, volume of hardware and consumables, and crew time requirements for operation. However, from a system level perspective, the favorability of each life support architecture is better assessed when the sub-system technologies are analyzed in aggregate. In order to evaluate each specific life support system architecture, the measure of equivalent system mass (ESM) was employed to benchmark system favorability. Moreover, the results discussed herein will be from the context of loop-closure with respect to the air, water, and waste sub-systems. Specifically, closure relates to the amount of consumables mass that crosses the boundary of the vehicle over the lifetime of a mission. As will be demonstrated in this manuscript, the optimal level of loop closure is heavily dependent upon mission requirements such as duration and the level of extra-vehicular activity (EVA) performed. Sub-system level trades were also considered as a function of mission duration to assess when increased loop closure is practical. Although many additional factors will likely merit consideration in designing life support systems for future missions, the ESM results described herein provide a context for future architecture design decisions toward a flexible path program.

Swickrath, Michael J.↗

Degradation of Leakage Currents and Reliability Prediction for Tantalum Capacitors

Two types of failures in solid tantalum capacitors, catastrophic and parametric, and their mechanisms are described. Analysis of voltage and temperature reliability acceleration factors reported in literature shows a wide spread of results and requires more investigation. In this work, leakage currents in two types of chip tantalum capacitors were monitored during highly accelerated life testing (HALT) at different temperatures and voltages. Distributions of degradation rates were approximated using a general log-linear Weibull model and yielded voltage acceleration constants B = 9.8 +/- 0.5 and 5.5. The activation energies were Ea = 1.65 eV and 1.42 eV. The model allows for conservative estimations of times to failure and was validated by long-term life test data. Parametric degradation and failures are reversible and can be annealed at high temperatures. The process is attributed to migration of charged oxygen vacancies that reduce the barrier height at the MnO2/Ta2O5 interface and increase injection of electrons from the MnO2 cathode. Analysis showed that the activation energy of the vacancies' migration is ~ 1.1 eV.

acceleration factors↗

Retrieval of Forest Canopy Parameters for OTTER Using an Optimized Technique

An inversion algorithm based on a nonlinear optimization technique is used to retrieve a subset of forest canopy parameters that can be used in ecosystem modeling. The inversion algorithm uses a parametric model derived from a discrete component forest scattering model which includes all major scattering contributions to radar backscatter. The parametric model, however, is derived for cases where only one mechanism dominates the scattering process, in this case, branch layer volume scattering.The inversion algorithm is shown to be a useful tool in the quantative monitoring of canopy moisture status, as well as a building block of its future versions which will include a more comprehensive set of forest scattering parameters as unknowns.

forest↗

CFD and Thermodynamic Model Predictions of No-Vent Tank Filling in Microgravity

Cryogenic Fluid Management (CFM) of propellant fluids under low gravity conditions present an important challenge in the pursuit of NASA’s future long-duration space missions. Success of these missions relies to a large extent on the ability to store and transfer the cryogenic liquid fuels efficiently and safely. To this end, the Zero-Boil-Off Tank Filling and Transfer Experiment (ZBOT-FT) undertaken by University of Bremen in collaboration with Case Western Reserve University aims at studying two phase flow tank-to-tank transfer operations in microgravity using a simulant fluid, Perfluoro-n-pentane (PNP). As part of this effort, in this work, we present a system level homogeneous thermodynamic model and a two-phase Computational Fluid Dynamics (CFD) model of a no-vent cylindrical tank filling in microgravity. Both 2D axisymmetric and 3D parametric simulations case studies are performed to show the detailed physics of the filling process and the evolution of tank pressure for filling flow rates between 1.0 and 1.65 mL/s. A zero-dimensional homogeneous thermodynamic model is also developed to predict the final steady state tank pressure analytically. Comparison of the 2D and 3D CFD predictions of final pressures to the steady state thermodynamic results displays very good agreement. However, it is shown that the 2D axisymmetric model predicts a maxima in tank pressure before reaching steady state. It is indicted that this pressure maxima is caused by the constraints inherent in the axisymmetric model and is absent in the 3D and thermodynamic pressure predictions.

Two Phase Flow↗

Computational investigation on the combined effect of pore attributes on strain concentrators in metal additively manufactured materials

Metal additive manufacturing provides a pathway for creating highly optimized components. However, porosity continues to be a prevalent issue for fatigue performance despite best efforts in optimizing process parameters and postprocessing techniques. This work uses finite element analysis to conduct a parametric study to link various pore attributes (i.e., aspect ratio, orientation, and location) to strain concentration factors (SCF) under elastic/plastic deformation during uniaxial loading. Keyhole and lack-of-fusion pores are idealized by prolate and oblate ellipsoids, respectively. Each simulation of the parametric study assumes a single isolated pore in a Ti-6Al-4V material, modeled with J2-plasticity. A reduced-order model is developed to relate pore attributes to SCF, and then used to quantify the variability in SCF for a given experimentally characterized probability distribution of pore attributes. This reduced-order model can be used in a production environment to provide a first-order evaluation to rapidly screen sub-optimally performing components.

Additive Manufacturing↗

A first scramjet study

A variety of related scramjet engine topics are examined. The flow is assumed to be 1-D, the gas is thermally and calorically perfect, and focus is on low hypersonic Mach numbers. The thrust and lift of an exposed half nozzle, which is used on the aerospace plane, is evaluated as well as a fully confined nozzle. A rough estimate of the drag of an aerospace plane is provided. Thermal effects and shock waves are next discussed. A parametric scramjet model is then presented based on the influence coefficient method, which evaluates the dominant scramjet processes. The independent parameters are the ratio of specific heats, a nondimensional heat addition parameter, and four Mach numbers. The total thrust generated by the combustor and nozzle is shown to be independent of the heat release distribution and the combustor exit Mach number, providing thermal choking is avoided. An operating condition for the combustor is found that maximizes the thrust. An alternative condition is explored when this optimum is no longer realistic. This condition provides a favorable pressure gradient and a reasonable area ratio for the combustor. Parametric results based on the model is provided.

Emanuel, George↗