Parameter optimization of linear microelectronic networks and systems
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Huelsman, L. P.↗
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Electrical properties of epoxies used in hybrid microelectronics
The electrical properties and basic characteristics of the structure of conductive epoxies were studied. The results of the experimental work performed to measure the electrical properties of epoxies are presented.
Stout, C. W.↗
Application of microelectronic technology to general aviation flight control
This paper presents several different methods that can be used to determine the aircraft orientation (attitude) without direct measurement. The methods combine state estimation techniques with measurements from solid state pressure sensors, accelerometers, and magnetometers to determine the aircraft state. The paper demonstrates how the estimation algorithms were validated and compared using flight test data, and it presents results of performance sensitivity analyses of sensor error, modeling inaccuracies, and wind disturbance effects on the attitude estimation errors. If implemented, the methods presented could make it possible to eliminate directional and vertical gyros and to change from many isolated sensors to an integrated, small, reliable sensing package for determining the aircraft state.
Sorensen, J. A.↗
Overview of the tri-service hybrid microelectronics MM and T programs
It was stated that the Army has aggressively pursued new hybrid techniques more than either the Navy or Air Force. It has 30 ongoing hybrid projects in various stages of contracting and execution, while the Navy has 6 and Air Force 2. The Army is programming for 8 hybrid projects in fiscal year 1979, the Navy for 5 and Air Force none. In terms of dollars, the Army's fiscal year 1979 program is worth $2.25 million, and the Navy is expected to spend about $1.7 million.
Mcburney, C. E.↗
The role of applications engineering in hybrid microelectronics
Hybrid microcircuits were examined in regard to their place in the electronic packaging spectrum. The problem of why hybrids are not as widely used as they should be is addressed as the primary concern.
Jones, C. E.↗
Innovations in microelectronics and solid state at North Carolina Agricultural and Technical State University
Research in the following areas is described: (1) Characterization and applications of metallic oxide devices; (2) Electronic properties and energy conversion in organic amorphous semiconductors; (3) Material growth and characterization directed toward improving 3-5 heterojunction solar cells.
Williams, L., Jr.↗
Automatic visual inspection system for microelectronics
A system for automatically inspecting an integrated circuit was developed. A device for shining a scanning narrow light beam at an integrated circuit to be inspected and another light beam at an accepted integrated circuit was included. A pair of photodetectors that receive light reflected from these integrated circuits, and a comparing system compares the outputs of the photodetectors.
Micka, E. Z.↗
Design, processing and testing of LSI arrays hybrid microelectronics task
Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed.
Himmel, R. P.↗
Design, processing and testing of LSI arrays: Hybrid microelectronics task
Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.
Himmel, R. P.↗
An introduction to the BANNING design automation system for shuttle microelectronic hardware development
The BANNING MOS design system is presented. It complements rather than supplant the normal design activities associated with the design and fabrication of low-power digital electronic equipment. BANNING is user-oriented and requires no programming experience to use effectively. It provides the user a simulation capability to aid in his circuit design and it eliminates most of the manual operations involved in the layout and artwork generation of integrated circuits. An example of its operation is given and some additional background reading is provided.
Mcgrady, W. J.↗
Solid state microelectronics tolerant to radiation and high temperature
The 300 C electronics technology based on JFET thick film hybrids was tested up to 10 to the 9th power rad gamma (Si) and 10 to the 15th power neutrons/sq cm. Circuits and individual components from this technology all survived this total dose although some devices required 1 hour of annealing at 200 or 300 C to regain functionality. This technology used with real time annealing should function to levels greater than 10 to the 10th power rad gamma and 10 to the 16th power n/sq cm.
Draper, B. L.↗
Standards for Epoxies Used in Microelectronics
Improved qualification standards and test procedures for epoxy adhesives used in assembly of high-reliability hybrid microcircuits listed in new report. Objective of standards to resolve problems in areas of outgassing, bond shear strength, corrosivity, volume resistivity, ionic impurities, electrical stability, and frequency of qualification testing. pp
Caruso, S. V.↗
Nuclear fragmentation studies for microelectronic application
A formalism for target fragment transport is presented with application to energy loss spectra in thin silicon devices. Predicted results are compared to experiments with the surface barrier detectors of McNulty et al. The intranuclear cascade nuclear reaction model does not predict the McNulty experimental data for the highest energy events. A semiempirical nuclear cross section gives an adequate explanation of McNulty's experiments. Application of the formalism to specific electronic devices is discussed.
Ngo, Duc M.↗
Diamondlike carbon applications in infrared optics and microelectronics
The use of diamondlike carbon (DLC) as a protective coating in harsh environments is addressed. There are three topics presented. The first is a description of the preparation of DLC on seven different infrared transmitting materials, and the possibility of using DLC as an antireflecting coating at commonly used wavelengths. DLC doesn't bond easily to all materials, and special techniques for bonding are presented. The second topic deals with how well DLC will protect a substrate from moisture penetration. This is an important aspect in numerous uses of DLC, including both infrared optics and integrated circuits. The third topic is the effect of particulate impact on film performance and integrity.
Woollam, John A.↗
Field-emitter arrays for vacuum microelectronics
An ongoing program on microfabricated field-emitter arrays has produced a gated field-emitter tip structure with submicrometer dimensions and techniques for fabricating emitter arrays with tip packaging densities of up to 1.5 x 10 exp 7 tips/sq cm. Arrays have been fabricated over areas varying from a few micrometers up to 13 cm in diameter. Very small overall emitter size, materials selection, and rigorous emitter-tip processing procedures have contributed to reducing the potential required for field emission to tens of volts. Emission current densities of up to 100 A/sq cm have been achieved with small arrays of tips, and 100-mA total emission is commonly produced with arrays 1 mm in diameter containing 10,000 tips. Transconductances of 5.0 micro-S per tip have been demonstrated, indicating that 50 S/sq cm should be achievable with tip densities of 10 exp 7 tips/sq cm. Details of the cathode arrays and a variety of performance characteristics are discussed.
Spindt, C. A.↗
CRRES microelectronic test chip
The JPL CRRES chip was designed and fabricated in 1985 and included in the CRRES MEP. MOSFET Matrix results show the effect of shielding on radiation-induced MOSFET threshold voltage shifts and channel mobility degradation. Shielded (middle board) MOSFETs have a threshold-voltage damage factor that is approximately three orders of magnitude smaller than would be estimated from Co-60 ground tests. Unshielded (outer board) MOSFETs have a threshold-voltage damage factor that would be estimated from Co-60 ground tests. Temperature swings as large as 23 C with a 22.5 orbit periodicity affected the MOSFET data and were removed from the data in order to reveal the radiation effects. This experiment demonstrated the feasibility of characterizing MOSFETs in a matrix, thus reducing the complexity and mass of the experiment.
Lin, Y.-S.↗
Microelectronic Chips For Radiation-Dose Tests
Custom-made single-chip complementary metal-oxide semiconductor (CMOS) integrated circuit designed to reveal effects of ionizing radiation on itself and similar integrated circuits. Potential terrestrial use: safety-oriented monitoring of ionizing radiation at nuclear powerplants, nuclear-waste sites, and the like.
Buehler, Martin G.↗
Piezoresistive sensors for measurement of thermally-induced stresses in microelectronics
The general theory of conduction in a piezoresistive material subjected to temperature change is derived and the basic equations needed to design and apply test chips for thermal stress measurement are established. A general expression is obtained for the resistance changes which occur in an arbitrarily oriented 1D filamentary conductor subjected to general 3D stress states and arbitrary temperature changes. The derived formula is valid for crystals such as silicon which have cubic symmetry and diamond lattice structures. Basic equations are presented for the resistance changes experienced by stressed in-plane resistors fabricated on (100) silicon wafers. The established theory is applied to a simple two-element sensor rosette. A test chip containing this rosette configuration is designed and fabricated, and a suitable calibration system is constructed.
Suhling, J. C.↗