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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 289 records · Page 16

Device- and System-Level Thermal Packaging for Electric-Drive Technologies (Final Technical Report)

Final Technical ReportThis project aimed to research, develop, and test electric traction drive system technology for use in vehicle applications that are capable of meeting the targets set by the Department of Energy Vehicle Technologies Office. The project is categorized into three major thrusts: Bonding interfaces for packaging, thermal management of electric vehicle (EV) power inverters, and electric motor thermal management. Device- and System-Level Thermal Packaging for Electric-Drive Technologies project aimed to develop, analyze, and validate transformative approaches in thermal management and packaging for power electronics and electric motor systems, with the ultimate goal of enhancing power density, efficiency, and reliability in electrified transportation platforms.

33 ADVANCED PROPULSION SYSTEMS↗

ORNL Package Testing Program Software Quality Assurance Plan

The Oak Ridge National Laboratory (ORNL) Package Testing Program (PTP) uses commercial off-the-shelf (COTS) software in performing data collection of thermal test results for package designs that contain radioactive materials. Specifically, this software is used to collect temperature data from the furnace, packages, and ambient air to prepare and execute the thermal test specified in 10 CFR 71.73, “Thermal Test.” This software quality assurance (SQA) plan sets forth the guidelines, standards, and procedures that shall be used to provide SQA for PTP software applications. This is a living document that will be maintained for the lifecycle of the PTP program. The SQA plan follows the requirements set forth in ORNL Standards Based Management System (SBMS): Information Technology; Subject Area: Software Quality Assurance. When applicable to the requirements as described in ORNL SBMS, Software Quality Assurance, the software shall be listed in the ORNL Software Registration System (SRS). Exemptions to this SBMS are COTS and firmware that are not modified; spreadsheet applications and personal productivity tools that do not have a utility or safety application, research applications, legacy software, system software, vendor-supplied software used to interface with the vendor’s services, software used within the organization to facilitate processing or management of information, and software developed for applications not specific to the US Department of Energy (DOE).

97 MATHEMATICS AND COMPUTING↗

2.5D HI Packaging of the Power Converter using TSV interposer.

Abstract: Advantages of the 2.5D HI (Heterogeneous Integration) electronics packaging of the power electronics compared to PCB packaging will be presented. Current 2.5D packaging effort using TSV (Through Silicon Via) will be presented in terms of fabrication, microstructural analysis, reliability, and thermal simulation.

Chung, Hyunim↗

Ion Traps and Packaging for Heterogenous Integration - Chimera

Microfabricated surface ion traps and silicon-based photonics are critical technologies for scaling quantum systems. Current ion trap architectures face scalability and integration challenges due to limitations in optical access, fabrication techniques, and material compatibility. State-of-the-art quantum computers and atomic clocks are investigating monolithic integration, which necessitates custom traps for each ion species and has not overcome the integration hurdles presented by merging these technologies. The Chimera (Ion Traps and Packaging for Heterogeneous Integration) project proposes a novel approach utilizing heterogeneous integration (HI) of ion traps and photonic circuits. This separation of components allows for flexibility in ion trap design and reduces fabrication compromises. The Chimera project specifically designed an ion trap to interface vertically with a separately fabricated waveguide chip and demonstrates the first steps to integrating them at the packaging level. The ion trap features a large area of removed silicon, allowing the photonics chip outputs closer to the ion trap, improving alignment and packaging processes. The alignment must be accurate to < 1 µm to ensure that the light from the waveguide can overlap with the trapping region. This fine alignment must also be maintained through an ultra-high vacuum bake, a critical step in preparing an ion trap experiment. By combining separate chips, we demonstrate a new path for scaling trapped ion technology that is less reliant on monolithic integration. We successfully fabricated a trap with a large area of oxide removed, resulting in a region thinned to about 40 µm, a key milestone toward successful integration.

42 ENGINEERING↗

Mechanical Loads on Spent Nuclear Fuel in the General 30 cm Package Drop Scenario

The U.S. Department of Energy Office of Nuclear Energy (DOE-NE) Spent Fuel and Waste Science & Technology (SFWST) research program is guided by the high-level goal of closing prioritized knowledge gaps related to spent nuclear fuel (SNF) storage and transportation, which are summarized by Saltzstein et al. (2020). One of the high-priority knowledge gaps is the identification and quantification of mechanical loads that are expected to affect SNF during normal conditions of transportation and storage to inform the range of physical SNF test programs. This report uses modeling and analysis methods to estimate the mechanical loads on spent nuclear fuel (SNF) in the general 30 cm package drop scenario. The drop scenario assumes impact limiters are in place in the transportation configuration and the impact surface is perfectly rigid. The goal of this analysis is to consider the universe of potential mechanical loading conditions that can happen to SNF and present the results in a manner that is useful for materials testing, decision making, and regulatory rule making purposes. This study uses validated finite element models and methods to perform a broad parametric study of key variables that can affect the mechanical loads on SNF during a hypothetical package free drop scenario. Physical drop test data from a cask and fuel assembly drop test campaign is the basis for model validation. Additionally, the results of the parametric study are used to inform a damage model, which uses multiple nonlinear regression to estimate the relationships between input variables and output response. The parametric finite element analyses consider thousands of input variable combinations, while the damage model estimates millions of combinations. The breadth of this study provides confidence that the potential range of mechanical loads that SNF might experience during the general 30 cm package drop scenario are characterized well enough to consider this knowledge gap closed. While this report documents the overall peak values calculated in this study, the 95 th percentile values, the histograms, and the observed trends are equally important. This study covered a large range of SNF temperatures, room temperature to 300°C, and burnups, 10 GWd/MTU to 62 GWd/MTU. Each temperature and burnup combination has a different cladding yield strain, so it is more meaningful to summarize the calculated cladding strain response as its factor of safety, which is defined relative to the yield strain. The factor of safety is calculated as the yield strain divided by the peak cladding strain. A factor of safety greater than unity indicates that the cladding remains below yield, whereas a value less than unity is indicative of plastic deformation. In all cases of this study a safety factor over 1.0 was calculated, although in the most limiting case at 300°C the safety factor was only 1.01, which suggests that yielding could occur when additional loads like rod internal pressure are included. When the temperature is restricted to 200°C the limiting safety factor increases to 1.28, which has significant margin to accommodate internal pressure and potential local cladding defects that could cause a local stress concentration. An important trend in the calculated fuel rod mechanical loads is that the 2 nd highest loaded fuel rod in an assembly tends to be significantly lower than the highest loaded rod. The implication is that even if one rod in an assembly experiences a failure the loads would have to be significantly higher to cause two or more rods to fail.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Novel multi-channel skipper-CCD packages for dark matter searches

The next generation of skipper Charge Coupled Device (skipper-CCD) experiments for rare-event searches will bring new challenges for the packaging and read-out of the detectors. Scaling the active mass and simultaneously reducing the experimental backgrounds in two orders of magnitude will require a novel high-density Silicon-based package, that must be massively produced and stored. In this work, we present the design, first production, and testing of multi-channel Silicon packages with photon shielding, along with the outlook for the next steps toward producing 1500 wafers that will add up to a 10 kg skipper-CCD detector.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Energy Efficiency Package for Tenant Fit-Out: Laboratory Testing and Validation of Energy Savings and Indoor Environmental Quality

Approximately 40% of the total U.S. office floor space of 1.5 billion sq.m (16 billion sq.ft.) is leased space occupied by tenants. Tenant fit-out presents a key opportunity to incorporate energy efficiency within the real estate business cycle. We designed a package of energy efficiency measures tailored to the scope of a tenant fit-out. This tenant fit-out package (TFP) includes advanced lighting and heating, ventilating and air-conditioning (HVAC) controls as core measures, with ceiling fans, automated shading, and plug load controls as additional optional measures. We conducted laboratory testing of six configurations of the package to evaluate energy savings, indoor environmental quality, and identify installation, commissioning, and operational issues. Combined savings for HVAC, lighting, and plug loads ranged from 33–40%. Lighting savings ranged from 69–83%, and HVAC savings from 20–40%. The laboratory testing also revealed some minor but tractable challenges with installation and commissioning of HVAC controls. Overall, the results demonstrate that significant savings can be realized in existing office buildings by incorporating relatively low-risk, proven measures at the time of a tenant fit-out.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Systematic and objective evaluation of Earth system models: PCMDI Metrics Package (PMP) version 3

Systematic, routine, and comprehensive evaluation of Earth system models (ESMs) facilitates benchmarking improvement across model generations and identifying the strengths and weaknesses of different model configurations. By gauging the consistency between models and observations, this endeavor is becoming increasingly necessary to objectively synthesize the thousands of simulations contributed to the Coupled Model Intercomparison Project (CMIP) to date. The Program for Climate Model Diagnosis and Intercomparison (PCMDI) Metrics Package (PMP) is an open-source Python software package that provides quick-look objective comparisons of ESMs with one another and with observations. The comparisons include metrics of large- to global-scale climatologies, tropical inter-annual and intra-seasonal variability modes such as the El Niño–Southern Oscillation (ENSO) and Madden–Julian Oscillation (MJO), extratropical modes of variability, regional monsoons, cloud radiative feedbacks, and high-frequency characteristics of simulated precipitation, including its extremes. The PMP comparison results are produced using all model simulations contributed to CMIP6 and earlier CMIP phases. An important objective of the PMP is to document the performance of ESMs participating in the recent phases of CMIP, together with providing version-controlled information for all datasets, software packages, and analysis codes being used in the evaluation process. Among other purposes, this also enables modeling groups to assess performance changes during the ESM development cycle in the context of the error distribution of the multi-model ensemble. Quantitative model evaluation provided by the PMP can assist modelers in their development priorities. In this paper, we provide an overview of the PMP, including its latest capabilities, and discuss its future direction.

54 ENVIRONMENTAL SCIENCES↗

Packaging of electronic modules

Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.

Katzin, L.↗

Apollo experience report: Thermal design of Apollo lunar surface experiments package

The evolution of the thermal design of the Apollo lunar surface experiments package central station from the basic concept to the final flight hardware is discussed, including results of development, prototype, and qualification tests that were used to verify that the flight hardware would operate adequately on the lunar surface. In addition, brief discussions of the thermal design of experiments included in the experiments package are presented. The flight thermal performance is compared with analytical results and thermal-vacuum test results, and design modifications for future lunar surface experiment packages are presented.

Harris, R. S., Jr.↗

Flat conductor cable for electrical packaging

Flat conductor cable (FCC) is relatively new, highly promising means for electrical packaging and system integration. FCC offers numerous desirable traits (weight, volume and cost savings, flexibility, high reliability, predictable and repeatable electrical characteristics) which make it extremely attractive as a packaging medium. FCC, today, finds wide application in everything from integration of lunar equipment to the packaging of electronics in nuclear submarines. Described are cable construction and means of termination, applicable specifications and standards, and total FCC systems. A list of additional sources of data is also included for more intensive study.

Angele, W.↗

Toroidal equipment packaging

For optimal packaging of equipment in shallow-cone vehicle toroidal packaging sets center of gravity of equipment forward. Packages are supported on rings within probe structure to provide low center of gravity. System permits interchanging of units for balance control, so minimum of lateral ballast is required.

Jones, W. J.↗

Space shuttle/food system. Volume 2, Appendix C: Food cooling techniques analysis. Appendix D: Package and stowage: Alternate concepts analysis

The relative penalties associated with various techniques for providing an onboard cold environment for storage of perishable food items, and for the development of packaging and vehicle stowage parameters were investigated in terms of the overall food system design analysis of space shuttle. The degrees of capability for maintaining both a 40 F to 45 F refrigerated temperature and a 0 F and 20 F frozen environment were assessed for the following cooling techniques: (1) phase change (heat sink) concept; (2) thermoelectric concept; (3) vapor cycle concept; and (4) expendable ammonia concept. The parameters considered in the analysis were weight, volume, and spacecraft power restrictions. Data were also produced for packaging and vehicle stowage parameters which are compatible with vehicle weight and volume specifications. Certain assumptions were made for food packaging sizes based on previously generated space shuttle menus. The results of the study are shown, along with the range of meal choices considered.

Source record↗

Dual shear plate power processor packaging design

The use of solar electric propulsion (SEP) for spacecraft primary propulsion imposes an extreme range of operational and environmental design requirements associated with the diversity of missions for which solar electric primary propulsion is advantageous. One SEP element which is particularly sensitive to these environmental extremes is the power processor unit (PPU) which powers and controls the electric ion thruster. An improved power processor thermal-mechanical packaging approach, referred to as dual shear plate packaging, has been designed to accommodate these different requirements with minimum change to the power processor design. Details of this packaging design are presented together with test results obtained from thermal-vacuum and structural-vibration tests conducted with prototype hardware.

Franzon, A. O.↗

Packaging printed circuit boards: A production application of interactive graphics

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Perrill, W. A.↗

WOLF contouring and plotting package

Tasks ranging from quick simple plot (which requires only one call to package) to highly sophisticated plots (including motion picture plots) easily generated with basic knowledge of FORTRAN and plot commands. Designers preparing software system that requires plotted output will find this package offers many advantages over standard hardware support packages available.

Masaki, G. T.↗

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages, phase 2

Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided.

Perkins, K. L.↗

Moisture penetration in microcircuit packages

Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.

Licari, J. J.↗