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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS2011

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗
NASA NTRS2007

NASA-DoD Lead-Free Electronics Project

The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Kessel, Kurt↗
NASA NTRS2008

NASA DOD Lead Free Electronics Project

The primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Kessel, Kurt R.↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

Kessel, Kurt↗
NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

The primary technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with lead-free alloys, (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Kessel, Kurt R.↗
NASA NTRS1999

Accelerated Thermal Cycling and Failure Mechanisms

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.

BGA CSP CBGA thermal cycle solder joint reliabilit↗
NASA NTRS1998

BGAs for High Reliability Applications

Ball Grid Array (BGA) is an important technology for utilizing higher pin counts, without the attendant handling and processing problems of the peripheral leaded packages. They are also robust in processing because of their higher pitch (0.050 inches typical), better lead rigidity, and self-alignment characteristics during reflow processing.

Ball Grid Array (BGA) lead regidity reflow process↗
NASA NTRS1997

Case Studies in Continuous Process Improvement

This study focuses on improving the SMT assembly process in a low-volume, high-reliability environment with emphasis on fine pitch and BGA packages. Before a process improvement is carried out, it is important to evaluate where the process stands in terms of process capability.

SMT BGA process improvement↗
NASA NTRS2005

Reliability of CCGA and PBGA assemblies

Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.

stakes↗
NASA NTRS2002

Continuous pH monitoring in a perfused bioreactor system using an optical pH sensor

Monitoring and regulating the pH of the solution in a bioprocess is one of the key steps in the success of bioreactor operation. An in-line optical pH sensor, based on the optical absorption properties of phenol red present in the medium, was developed and tested in this work for use in NASA space bioreactors based on a rotating wall-perfused vessel system supporting a baby hamster kidney (BHK-21) cell culture. The sensor was tested over three 30-day and one 124-day cell runs. The pH sensor initially was calibrated and then used during the entire cell culture interval. The pH reported by the sensor was compared to that measured by a fiber optically coupled Shimadzu spectrophotometer and a blood gas analyzer. The maximum standard error of prediction for all the four cell runs for development pH sensor against BGA was +/-0.06 pH unit and for the fiber optically coupled Shimadzu spectrophotometer against the blood gas analyzer was +/-0.05 pH unit. The pH sensor system performed well without need of recalibration for 124 days. Copyright 2002 Wiley Periodicals, Inc.

Bioreactors↗
NASA NTRS1997

The Interplay of Surface Mount Solder Joint Quality and Reliability of Low Volume SMAs

Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. JPL has recently completed an extensive study, funded by NASA's code Q, of the interplay between manufacturing defects and reliability of ball grid array (BGA) and surface mount electronic components.

Spacecraft electronics electronic assemblies J-lea↗
NASA NTRS1997

Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays

Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.

ball grid array area array package semi-aqueous cl↗
NASA NTRS1997

Reliability Investigation of Ball Grid Array Assemblies for Space Flight Applications

JPL, in a partnership with an industrial consortium, is currently engaged in the investigation of reliability and quality issues if ball grid array (BGA) packages as they may be applied to space flight electronics. Performing tests to determine the solder joint reliability of assemblies using BGAs under temperature cycling has proved to be a real challenge for test engineers.

Ball grid array printed wiring assemblies reliabil↗
NASA NTRS2008

A Comparative Study of Inspection Techniques for Array Packages

This viewgraph presentation reviews the inspection techniques for Column Grid Array (CGA) packages. The CGA is a method of chip scale packaging using high temperature solder columns to attach part to board. It is becoming more popular over other techniques (i.e. quad flat pack (QFP) or ball grid array (BGA)). However there are environmental stresses and workmanship challenges that require good inspection techniques for these packages.

Mohammed, Jelila↗
NASA NTRS2011

Relaxing USOS Solar Array Constraints for Russian Vehicle Undocking

With the retirement of Space Shuttle cargo delivery capability and the ten year life extension of the International Space Station (ISS) more emphasis is being put on preservation of the service life of ISS critical components. Current restrictions on the United States Orbital Segment (USOS) Solar Array (SA) positioning during Russian Vehicle (RV) departure from ISS nadir and zenith ports cause SA to be positioned in the plume field of Service Module thrusters and lead to degradation of SAs as well as potential damage to Sun tracking Beta Gimbal Assemblies (BGA). These restrictions are imposed because of the single fault tolerant RV Motion Control System (MCS), which does not meet ISS Safety requirements for catastrophic hazards and dictates 16 degree Solar Array Rotary Joint position, which ensures that ISS and RV relative motion post separation, does lead to collision. The purpose of this paper is to describe a methodology and the analysis that was performed to determine relative motion trajectories of the ISS and separating RV for nominal and contingency cases. Analysis was performed in three phases that included ISS free drift prior to Visiting Vehicle separation, ISS and Visiting Vehicle relative motion analysis and clearance analysis. First, the ISS free drift analysis determined the worst case attitude and attitude rate excursions prior to RV separation based on a series of different configurations and mass properties. Next, the relative motion analysis calculated the separation trajectories while varying the initial conditions, such as docking mechanism performance, Visiting Vehicle MCS failure, departure port location, ISS attitude and attitude rates at the time of separation, etc. The analysis employed both orbital mechanics and rigid body rotation calculations while accounting for various atmospheric conditions and gravity gradient effects. The resulting relative motion trajectories were then used to determine the worst case separation envelopes during the clearance analysis. Analytical models were developed individually for each stage and the results were used to build initial conditions for the following stages. In addition to the analysis approach, this paper also discusses the analysis results, showing worst case relative motion envelopes, the recommendations for ISS appendage positioning and the suggested approach for future analyses.

Menkin, Evgeny↗