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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Single-Event Effects (SEE) testing was conducted on the AMD Ryzen 3 1200 microprocessor. Testing was conducted at Massachusetts General Hospital's (MGH) Francis H. Burr Proton Therapy Center on June 2nd, 2019.
Single-Event Effects (SEE) testing was conducted on the AMD Ryzen 3 2200G microprocessor with integrated graphics. Testing was conducted at Massachusetts General Hospital's (MGH) Francis H. Burr Proton Therapy Center on June 2nd, 2019.
Single-Event Effects (SEE) testing was conducted on the nVidia Jetson TX2 System on Chip (SOC). Testing was conducted at Massachusetts General Hospital's (MGH) Francis H. Burr Proton Therapy Center on June 2nd, 2019.
Different aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.
A 472 dimpled ball grid array (D-BGA) package has not been used in past space flight environments, therefore it was necessary to develop a process that would yield robust and reliable solder joints. The process developing assembly, inspection and rework techniques, were verified by conducting environmental tests. Since the 472 D-BGA packages passed the above environmental tests within the specifications, the process was successfully developed for space flight electronics.
The Jet Propulsion Laboratory (JPL) is currently assessing the use of Ball Grid Arrays (BGAs) for National Aeronautics and Space Administration (NASA) spaceflight applications. This work is being funded through NASA Headquarters, Code Q. The objectives are to demonstrate the robustness, quality and reliability of BGAs technology, and to assist in the solicited industrial, academic and other related consortia to work together to leverage the related efforts into a synergistic effort. Initial results of these activities will be summarized and presented in this paper.
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Diffenent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included understanding assembly reliability behavior of conventional surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
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This paper reports the results of an experiment that utilized the JPL's area array consortium test vehicle design, containing a myriad of mixed technology components with an OSP finish. The details of the reliability study are presented in this paper.
Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. More than 400 test vehicles were assembled using ceramic and plastic ball grid arrays (BGAs), LCCs, J-leads, and gull wing components.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
(view graphs) QA Proactive Approach, SM Package Trends, Introduction on Ball Grid Array, Environmental Test.
Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.
Inspection results along with SEM and optical cross-sectional photos revealing damage and failure mechanisms will also be presented.