Search NASA⌕ Search

SEARCH · Search NASA

Results for “System packages”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Systems Packages for Washington State Building Performance Standard Incentive Program: Phase 1 Analysis

Starting in 2026 Washington State building performance standards will come into effect that require commercial buildings larger than 50,000 sf to meet site energy use intensity targets. To support a state incentive program designed to encourage building owners to start complying early, we characterized the building stock energy use of 11 building types, analyzed 43 energy upgrade measures, and developed seven packages of energy upgrade measures using the ComStock energy analysis tool. Each energy upgrade package included from 4 to 17 energy measures consisting of lighting, HVAC, and envelope upgrades. Package savings were calculated for four priority building types using a sample of 35,000 buildings characterized by four building area bins, three climate zones, and two county types (urban and rural). Of the 28 package and building type combinations analyzed, 17 (61%) met or exceeded program energy savings targets and two packages met targets for all four building types.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
NASA NTRS2001

Protective Fullerene (C60) Packaging System for Microelectromechanical Systems Applications

The invention involves a method for locating the probe of a scanning tunneling micrograph a predetermined distance from its conducting surface, and specifically the deposition of a monolayer of fullerene C 60 onto the conducting plate. The Fullerene C 60 molecule is approximately spherical and a monolayer of fullerene has a thickness of one nanometer. By providing a monolayer of fullerene on the conducting surface and locating the probe on the surface of the monolayer, a distance of one nanometer can be established between the probe tip and the conducting surface.

John D Olivas↗
NASA NTRS2004

Protective Fullerene (C60) Packaging System for Microelectromechanical Systems Applications

The invention involves tunneling tips to their conducting surface, and specifically the deposition of a monolayer of fullerene C 60 onto the conducting plate surface to protect the tunneling tip from contact. The Fullerene C 60 molecule is approximately spherical, and a monolayer of fullerene has a thickness of one nanometer, such that a monolayer thereby establishing the theoretical distance desired between the MEMS tunneling tip and the conducting plate. Exploiting the electrical conductivity of C 60 the tip can be accurately positioned by simply monitoring conductivity between the fullerene and the tunneling tip. By monitoring the Conductivity between the tip and the fullerene layer as the tip is brought in proximity, the surfaces can be brought together without risk of contacting the underlying conducting surface. Once the tunneling tip is positioned at the one nanometer spacing, with only the monolayer of fullerene between the tunneling tip and the conducting plate, the monolayer of C 60 , can be broken down thermally and removed chemically leaving only the tunneling tip and the conducting plate at the ideal tunneling spacing. Alternatively, the properties of fullerene allow the tunneling process to occur directly across the fullerene monolayer.

John D Olivas↗
NASA NTRS1977

System design package for IBM system one: solar heating and domestic hot water

This report is a collation of documents and drawings that describe a prototype solar heating and hot water system using air as the collector fluid and a pebble bed for heat storage. The system was designed for installation into a single family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system was packaged for evaluation of the system with information sufficient to assemble a similar system.

Source record↗
NASA NTRS1978

System Design Package for SIMS Prototype System 3, Solar Heating and Domestic Hot Water

A collation of documents and drawings are presented that describe a prototype solar heating and hot water system using liquid flat plate collectors and a gas or electric furnace energy subsystem. The system was designed for installation into a single-family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system are packaged for evaluation of the system with information sufficient to assemble a similar system.

Source record↗
NASA NTRS1978

System design package for SIMS prototype system 4, solar heating and domestic hot water

The system consisted of a modular designed prepackaged solar unit, containing solar collectors, a rock storage container, blowers, dampers, ducting, air-to-water heat exchanger, DHW preheat tank, piping, and system controls. The system was designed to be installed adjacent to a small single family dwelling. The description, performance specification, subsystem drawings, verification plan/procedure, and hazard analysis of the system were packaged for evaluation.

Source record↗
NASA NTRS2015

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

High temperature↗
NASA NTRS1977

System design package for SIMS prototype system 2, solar hot water

Information necessary to evaluate the design and assembly of a solar hot water system is presented. A prototype system designed for use in a single family dwelling is investigated in terms of the following subsystems: collector, storage, energy transport, and control.

Source record↗
NASA NTRS1980

Installation package for a solar-heating system

Package consists of installation, operation and maintenance manuals for four commercial solar energy subsystems, including flat plate solar collector pebble bed thermal-storage. Manual gives design information, sizing data, specification drawings, and other material for subsystem.

Source record↗
DOE OSTI2021

The Polar System Analysis Package (Ver. 1 Specifications)

The Polar System Analysis Package (POLeSTAr) is a modern data fusion tool being designed to benchmark,evaluate and compare the polar physics and biogeochemistry of Earth System Models (ESMs). It is being written in Python to make use of libraries including Xarray, Matplotlib, SciPy, NumPy and PyTorch within algorithms developed specifically for polar system modeling. Initial POLeSTAr algorithms will be adapted from the MATLAB Ridgepack package that was designed to analyze the Model for Prediction Across Scales (MPAS) sea ice component of the Energy Exascale Earth System Model (E3SM) and sea ice model CICE within the Community Earth System Model (CESM).

97 MATHEMATICS AND COMPUTING↗
NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗
NASA NTRS2016

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗
NASA NTRS1979

System design package for a solar heating and cooling system installed at Akron, Ohio

Information used to evaluate the design of a solar heating, cooling, and domestic hot water system is given. A conventional heat pump provides summer cooling items as the design data brochure, system performance specification, system hazard analysis, spare parts list, and detailed design drawings. A solar system is installed in a single-family dwelling at Akron, Ohio, and at Duffield, Virginia.

Source record↗
NASA NTRS1993

Review and analysis of dense linear system solver package for distributed memory machines

A dense linear system solver package recently developed at the University of Texas at Austin for distributed memory machine (e.g. Intel Paragon) has been reviewed and analyzed. The package contains about 45 software routines, some written in FORTRAN, and some in C-language, and forms the basis for parallel/distributed solutions of systems of linear equations encountered in many problems of scientific and engineering nature. The package, being studied by the Computer Applications Branch of the Analysis and Computation Division, may provide a significant computational resource for NASA scientists and engineers in parallel/distributed computing. Since the package is new and not well tested or documented, many of its underlying concepts and implementations were unclear; our task was to review, analyze, and critique the package as a step in the process that will enable scientists and engineers to apply it to the solution of their problems. All routines in the package were reviewed and analyzed. Underlying theory or concepts which exist in the form of published papers or technical reports, or memos, were either obtained from the author, or from the scientific literature; and general algorithms, explanations, examples, and critiques have been provided to explain the workings of these programs. Wherever the things were still unclear, communications were made with the developer (author), either by telephone or by electronic mail, to understand the workings of the routines. Whenever possible, tests were made to verify the concepts and logic employed in their implementations. A detailed report is being separately documented to explain the workings of these routines.

Narang, H. N.↗
DOE OSTI2020

Fabrication Lessons Learned of Transportation Packaging from the Perspective of a Design Authority - 20322

This paper presents lessons learned regarding fabricating packaging systems from the perspective of a design authority (DA). Capturing and implementing lessons learned is critical for an organization to reduce systematic project risk and thereby promote the likelihood of project success. This paper defines the design authority as the organization responsible for technical design, resolving technical design issues, quality assurance program, and maintenance of the packaging system license. A package system is defined as the packaging, its contents, and auxiliary equipment. Packages are certified by the NRC under 10 CFR 71[1] for transportation by ground. The following lessons learned subjects are presented in the paper: quality assurance, interpretation of drawing dimensional requirements, execution of manufacturing processes, hardware dimensional inspection, and leakage rate testing. All discrepancies presented in this paper have been resolved as described in the appropriate final data package. All described package systems are in compliance with their Safety Analysis Report (SAR) and certificate of conformance requirements. The intent of this paper is to identify opportunities for improving the outcome of future projects and to mitigate fabrication challenges proactively. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗
NASA NTRS1979

Solar heating system final design package

The system is composed of a warm air collector, a logic control unit and a universal switching and transport unit. The collector was originally conceived and designed as an integrated roof/wall system and therefore provides a dual function in the structure. The collector serves both as a solar energy conversion system and as a structural weather resistant skin. The control unit provides totally automatic control over the operation of the system. It receives input data from sensor probes in collectors, storage and living space. The logic was designed so as to make maximum use of solar energy and minimize use of conventional energy. The transport and switching unit is a high-efficiency air-handling system equipped with gear motor valves that respond to outputs from the control system. The fan unit was designed for maximum durability and efficiency in operation, and has permanently lubricated ball bearings and excellent air-handling efficiency.

Source record↗
NASA NTRS1980

Solar-heating system design package

Report describes solar heating system composed of warm-air solar collector, logic control unit, and switching and transport unit, that meets government standards for installation in residential dwellings. Text describes system operation and performance specifications complemented by comprehensive set of subcomponent design drawings.

Source record↗
NASA NTRS1991

Design And Analysis Of Linear Control Systems

Package of five computer programs developed to assist in design and analysis of linear control systems by use of root-locus and frequency-response methods. Package written in FORTRAN (BODE, TPEAK) and BASIC (LOCUS, KTUNE, and POLYROOT).

Jamison, John W.↗