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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 361 records · Page 20

A Simple, Revolutionary Approach to Waste Packaging Utilizing Proven Technology - 20201

Historically, removing hazardous waste from gloveboxes involves the use of bags as the primary containment method. This method can prove tedious, repetitive, and time consuming to ensure the process follows all safeguards required to contain the waste and mitigate any breach of containment. Layers of bags, yards of tape, and multiple filters are added to the waste stream in order to transfer the hazardous waste from the glovebox safely into the drum package. Then, finally, it can be shipped and disposed of. The process to cut, tie, and tape each bag for disposal involves manual effort by multiple operators. Following Administrative Safety Controls, good operators are able to safely perform those tasks; but, since the bag is the only confinement layer, incidents can occur. Operators, in some cases, are also at close proximity to this waste which may increase the risk of radiation exposure. Once the waste is transferred out through these bags, it is nearly impossible to remove packaged waste that may contain higher dosage levels, thus increasing drum disposal costs incurred by the facility. Exceeding the allowable radiation levels, and drums not fully filled, both contribute significantly to excess disposal costs. Central Research Laboratories (CRL), based in Red Wing Minnesota, has developed the Waste Drum Transfer System (WDTS) building upon the proven technology and containment of the Rapid Transfer Port (RTP) as an alternate, more efficient method of waste transfer. This solution consists of an RTP Alpha port mounted inside a glovebox and Beta assembly unit composed of a drum liner fitted inside a standard 55 gallon drum. The use of the Beta drum liner bypasses the typical use of bags, sleeves or tape to provide leak tight containment. The process to connect and disconnect a drum from the glovebox is achieved by the self-docking and rotating system controls of the RTP Alpha, all done with only one operator standing in an upright ergonomic position. This system also allows for greater flexibility in available Beta connection options, expanding the overall functionality of the system. This system can be disconnected and reconnected multiple times to maximize volume containment. This will minimize drum disposal costs and reduce the overall volume of waste output by more efficiently filling the drums. Radiation levels inside each drum can be monitored and adjusted more efficiently by operators utilizing the reconnect option. Minimal As Low As Reasonably Achievable (ALARA) levels are also achievable with this system. This paper will show how highly efficient packaging and disposal of hazardous waste can be accomplished in a cost-effective manner utilizing the proven RTP technology. Maximized operator productivity and safety, as well as minimized radiation dose exposure, are all attainable through the system's engineered controls. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Blending Compostable Plastics for Packaging Applications

Non-sustainable packaging materials (polymers) are a large portion of the increasing amount of plastic waste that become environmental pollutants. While many biodegradable or compostable polymers have been developed in recent years, most fail to compete with the non-sustainable polymers dominating the market, due to lack of certain desired properties, such as thermal (high melt temperature) and mechanical (high ductility) performance. For example, the popular compostable polymer polylactic acid (PLLA) has a high melt temperature but is very brittle. Another polymer, poly(d-valerolactone) (PVL) demonstrates great ductility but has a very low melt temperature. By blending PLLA and PVL, there is an opportunity to create a new biodegradable material with synergistic desired properties for packaging applications. In this study, we produce several (9) physical blends of PVL and PLLA with varying compositions of the two polymers while applying three different materials to make them more compatible (compatibilizers). We test the success of compatibilization by scanning electron microscopy (SEM), mechanic testing (strain at break) and differential scanning calorimetry (melting temperature). Overall, we highlight several promising materials with high compatibility and desired thermomechanical properties for sustainable packaging. Ideally, these materials could help mitigate future plastic pollution in Colorado and beyond.

blending↗

Destructive Examination Protocol for 3013-Container-Package Storing Plutonium-Bearing Materials

The 3013-container-package consists of a convenience, inner and outer container and is used for long-term storage of plutonium-bearing materials. A destructive examination (DE) protocol has been developed to examine the container package visually and with microscopic aid to find any corrosion conditions that could result in the loss of the integrity of the container package over its lifetime. The DE protocol contains three main steps: initial container examination, helium (He) leak testing, and detailed imaging and analysis of the inner container closure weld region (ICCWR). The ICCWR has been determined to be bounding, defined as exhibiting worst case conditions for stress corrosion cracking (SCC) of the inner container. To assess SCC in the ICCWR, the inner container lid is cut into quarters and the weld and He-leak testing gasket are removed. Then a citric acid wash is performed to remove adherent chlorides from the ICCWR. The wash is then sent for analysis to determine the concentration of chlorides in the ICCWR. While the analysis for chloride concentration is being performed, the quarter sections are further sectioned into 1/8th subsections by cutting each section in half. These subsections are washed using nitric acid to remove corrosion products. Then each subsection is imaged using a Wide Angle 3-D Measurement System (WAMS). After analysis of microscope images for potential SCC, additional imaging can be performed, including subsurface imaging. After review, a determination is made of whether the container integrity may potentially affect the safe storage of the material.

container↗

A Simple Approach for the Synthesis of Cellulose Nanofiber Reinforced Chitosan/PVP Bio Nanocomposite Film for Packaging

The development of chitosan-based food packaging film has been increasing due to its wider availability, biodegradability, low-cost, and renewability. The purpose of this study was to develop cellulose nanofibers (CNFs) reinforced Chitosan/PVP(CHP) green bio nanocomposite film by solvent casting method with enhanced barrier and mechanical property. CNFs of dimension 9–11 nm and 100–200 nm were extracted from jute fibers by directly treating it with HNO{sub 3}–NaNO{sub 2} mixture. Bio nanocomposite films were synthesized with various concentrations of CNFs and evaluated using SEM, TGA/DTG and XRD to analyze the morphology, thermal behavior and crystallinity of bio nanocomposite films. SEM analysis revealed the uniform dispersion of CNFs in CHP matrix. Thermal stability of prepared bio nanocomposite films was improved with the loading of 5 wt% of cellulose nanofibers. ATR(FT-IR) spectra shows physical interaction between all the components of bio nanocomposite film. The bio nanocomposite films were also characterized for physical property like thickness, mechanical testing and barrier properties. The addition of CNFs significantly enhanced the mechanical property of bio nanocomposite films. Furthermore, water and oxygen transmission rate of bio nanocomposite film decreased with the increase in CNFs concentration. Overall the performed studies confirmed, the use of CNFs in polymer matrix makes it possible to produce a flexible, transparent, thermally stable bio nanocomposite film with enhanced mechanical and barrier properties for food packaging applications.

36 MATERIALS SCIENCE↗

Cracking the code of multi-layer films to promote circularity in single-use plastic packaging

Multi-layer film packaging (MLF) revolutionized food preservation by combining diverse material layers to optimize barrier properties, mechanical strength, and shelf-life. These materials are essential for transporting perishables across various climates and allow for access to fresh goods in “food deserts”, but they pose significant recycling challenges due to their structural complexity. This perspective examines key structure-property relationships governing barrier performance and highlights innovations in material design. We explore how machine learning can predict performance metrics and propose recyclable alternatives, integrating data-driven approaches with material science insights. By challenging the status quo of MLF design, we advocate for circularity in food packaging, inspiring innovation at the intersection of sustainability, material science, and artificial intelligence.

36 MATERIALS SCIENCE↗

Polyhydroxybutyrate laminated trilayer films with enhanced barrier and mechanical properties for active food packaging

Polysaccharides such as starch and chitosan have been explored for sustainable food packaging films. However, their inherent hydrophilicity and brittleness cause poor water vapor barrier performance and limited mechanical properties. To address these issues, starch was first functionalized with acetoacetate groups and subsequently blended with chitosan. Dynamic cross-linking occurred between the acetoacetate groups and the primary amine groups of chitosan, forming vinylogous urethane linkages that reduced the water solubility of the films while preserving high mechanical strength. With 30 wt% of glycerol as a plasticizer, the resulting films showed a tensile strength of up to 24.68 MPa and an elongation at break of up to 83.96%. To improve the barrier properties, poly(3-hydroxybutyrate) (PHB), plasticized with 5-15 wt% epoxidized vegetable oil, was laminated on top of the chitosan/modified starch films, resulting in a significantly reduced water vapor transmission rate (WVTR) of 66%. Additional components, such as food colors like β-carotene were incorporated into this layer to make UV-protective films. A third layer of PHB without active additives was then coated to further reduce WVTR by 99%. Therefore, this multilayer lamination strategy effectively enhanced the barrier and mechanical properties of the polysaccharide-based packaging films.

Active packaging↗

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

In a power module the parasitic inductance limits the dynamic high-frequency performance, and the area of the cooling surfaces limits the power capability. This paper presents a new 3D power electronic design methodology based on the concept of mutual inductance cancellation and multi-sided heat transfer. New 3D prismatic packaging concepts are proposed for Wide Band Gap (WBG) power devices, where the devices can be mounted at acute angles to adjacent interconnects or other devices. Discussion is given on electrical and thermal path optimization in a 3D space. To validate the 3D prismatic packaging methodology, a 1200V/50A SiC half-bridge power module is fabricated and tested for electrical and thermal performance and results are compared with simulations. The power density calculated for the module is 12 kW/in3 (including heatsink) and shows a 31.3% inductance reduction compared to a 2D planar module. Finally, design guidance suggested for utilizing prismatic structures is provided, together with suggested future work in the area. This paper presents the first reported true 3D power module.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE SNF Packaging Demonstration Project: Worktable and Canister Loading Sleeve Design [Slides]

This presentation is a briefing for summer interns and others outside the project, to give them a summary of ongoing design activities. The DOE SNF Packaging Demonstration Project is an effort to develop and demonstrate the designs, technology, processes, and regulatory framework for packaging DOE-managed spent nuclear fuel (SNF) for road ready dry storage (RRDS). The project is to remotely load and seal two types of DOE-managed SNF from the CPP-603 facility into DOE Standard Canisters, place the sealed DOE Standard Canisters into commercial vendor over-canisters (equivalent to commercial MPCs), seal and place the over-canisters into commercial vendor storage overpacks, and place the storage system (over-canister and storage overpack) onto the CPP-2707 cask pad.

42 ENGINEERING↗

Organic Direct-Bonded-Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging

Silicon carbide (SiC) power devices are playing ever- growing roles in high-power-density power electronics converters by offering benefits such as high voltage rating, fast transients, and high thermal performance. Organic direct-bonded copper (ODBC)-based packaging, due to its ductility and ease of han- dling, allows the possibility of a more flexible layout design that may better tap the potential of SiC benefits. In this work, an ODBC-based prototyping routine is developed that accelerates the iterations of packaging layout design with low cost. The properties of ODBC and its handling are briefly introduced, and tools and fabrication steps are explained. Following this routine, a 1.2-kV SiC half-bridge power module is designed and fabricated with the focus on sub-nanohenry ultra-low loop inductance. Simulation and experimental validation are also conducted.

25 ENERGY STORAGE↗

Fuel Assembly and Irradiation Parametric Study for Extended-Enrichment and High-Burnup Light-Water Reactor Spent Nuclear Fuel in Dry Storage Casks and Transportation Packages

There is an increased interest in operating commercial light-water reactors (LWRs) in the United States with improved economics that would result from longer fuel cycle lengths, fewer and shorter refueling outages, and fewer fuel assemblies requiring storage at the back end of the fuel cycle. To support this, fuel discharge burnups, as well as initial 235 U enrichments, must be higher than those used in current commercial LWRs. The typical upper limit considered for assembly average burnup in this report is 75 gigawatt-days (GWd) per metric ton of uranium (MTU), as opposed to the current typical upper bound of approximately 62 GWd/MTU. The upper limit considered for initial 235 U enrichment is 8 weight percent (8 wt %), as opposed to the current regulatory limit of 5 wt %. The enrichment range from 5 to 8 wt % is referred to in this report as extended enrichment . To investigate the effect of high burnup and extended enrichment conditions on dose rates and burnup credit for dry storage casks and transportation packages, a fuel assembly and irradiation parametric study was performed. The conclusions from this study will assist U.S. Nuclear Regulatory Commission staff in reviewing applications for dry storage casks and transportation packages that contain high-burnup and extended enrichment fuel.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Plan for the Development and Application of a Risk Assessment Approach for Transportation Package Approval of a Transportable Nuclear Power Plant for Maritime Shipment (Rev. 1)

This plan proposes a strategy for licensing a transportable nuclear power plant, containing its unirradiated and irradiated fuel, as a transportation package for maritime transport using a probabilistic risk assessment framework in order to meet the regulatory requirements of 10 CFR Part 71. It is anticipated that initially, the deterministic transportation package licensing approach will be challenging due to the functional requirements of the transportable nuclear power plant. As such, a partial exemption request from the U.S. Nuclear Regulatory Commission coupled with applied compensatory measures are anticipated in support of providing equivalent safety to the public, worker, and environment. A plan is outlined as to how this would be demonstrated and a pathway is primarily outlined using the accompanying low accident rates which in turn support very low probabilities of release for a maritime application. Wherever possible, the proposed plan is supported by actual accident (casualty) data. Additional supporting information regarding a highway transportation probabilistic risk assessment in support of the Project Pele demonstration reactor that is currently under development is also referenced and discussed.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

A Review of Chip Scale Package Assembled Reliability

NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies.

Chip Scale Packaging Microspacecraft↗

Packaging for Spacecraft and Its Commercial Implications

This paper discusses aspects of electronic packaging which are critical to MEMS devices and in particular, of extreme importance to packaging devices which are intended for use aboard spacecraft.

Microeletromechanical electronic packaging MEMS↗

(abstract) Electronic Packaging for Microspacecraft Applications

The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

technology multichip modules wafer scale integrati↗