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At least 55 records · Page 3

On-Orbit, Immuno-Based, Label-Free White Blood Cell Counting System with Microelectromechanical Sensor Technology (OILWBCS-MEMS)

Aurora Flight Sciences, in partnership with Draper Laboratory, has developed a miniaturized system to count white blood cells in microgravity environments. The system uses MEMS technology to simultaneously count total white blood cells, the five white blood cell differential subgroups, and various lymphocyte subtypes. The OILWBCS-MEMS detection technology works by immobilizing an array of white blood cell-specific antibodies on small, gold-coated membranes. When blood flows across the membranes, specific cells' surface protein antigens bind to their corresponding antibodies. This binding can be measured and correlated to cell counts. In Phase I, the partners demonstrated surface chemistry sensitivity and specificity for total white blood cells and two lymphocyte subtypes. In Phase II, a functional prototype demonstrated end-to-end operation. This rugged, miniaturized device requires minimal blood sample preparation and will be useful for both space flight and terrestrial applications.

Edmonds, Jessica↗

Vacuum Packaging of MEMS With Multiple Internal Seal Rings

A proposed method of design and fabrication of vacuum-packaged microelectromechanical systems (MEMS) and of individual microelectromechanical devices involves the use of multiple internal seal rings (MISRs) in conjunction with vias (through holes plated with metal for electrical contacts). The proposed method is compatible with mass production in a wafer-level fabrication process, in which the dozens of MEMS or individual microelectromechanical devices on a typical wafer are simultaneously vacuum packaged by bonding a capping wafer before the devices are singulated (cut apart by use of a dicing saw). In addition to being compatible with mass production, the proposed method would eliminate the need for some complex and expensive production steps and would yield more reliable vacuum seals. Conventionally, each MEMS or individual microelectromechanical device is fabricated as one of many identical units on a device wafer. Vacuum packaging is accomplished by bonding the device wafer to a capping wafer with metal seal rings (one ring surrounding each unit) that have been formed on the capping wafer. The electrical leads of each unit are laid out on what would otherwise be a flat surface of the device wafer, against which the seal ring is to be pressed for sealing. The resulting pattern of metal lines and their insulating oxide coverings presents a very rough and uneven surface, upon which it is difficult to pattern the sealing metal. Consequently, the seal is prone to leakage unless additional costly and complex planarization steps are performed before patterning the seal ring and bonding the wafers.

Hayworth, Ken↗

Hand-Held Units for Short-Range Wireless Biotelemetry

Special-purpose hand-held radiotransceiver units have been proposed as means of short-range radio powering and interrogation of surgically implanted microelectromechanical sensors and actuators. These units are based partly on the same principles as those of the units described in "Printed Multi- Turn Loop Antennas for RF Biotelemetry" (LEW-17879-1), NASA Tech Briefs, Vol. 31, No. 6 (June 2007), page 48. Like the previously reported units, these units would make it unnecessary to have wire connections between the implanted devices and the external equipment used to activate and interrogate them. Like a unit of the previously reported type, a unit of the type now proposed would include a printed-circuit antenna on a dielectric substrate. The antenna circuitry would include integrated surface-mount inductors for impedance tuning. Circuits for processing the signals transmitted and received by the antenna would be included on the substrate. During operation, the unit would be positioned near (but not in electrical contact with) a human subject, in proximity to a microelectromechanical sensor or actuator that has been surgically implanted in the subject. It has been demonstrated that significant electromagnetic coupling with an implanted device could be established at a distance of as much as 4 in. (.10 cm). During operation in the interrogation mode, the antenna of the unit would receive a radio telemetry signal transmitted by the surgically implanted device. The antenna substrate would have dimensions of approximately 3.25 by 3.75 inches (approximately 8.3 by 9.5 cm). The substrate would have a thickness of the order of 30 mils (of the order of a somewhat less than a millimeter). The substrate would be made of low-radiofrequency- loss dielectric material that could be, for example, fused quartz, alumina, or any of a number of commercially available radio-frequency dielectric composite materials. The antenna conductors would typically be made of copper or a combination of chromium and gold. The choice of metal and the thickness of the metal layer(s) would depend on the choice of substrate material. For example, on a quartz or alumina substrate, one would typically use a layer of chromium 150 A thick and a layer of gold 2 m thick. The proposed units and the implanted devices that they would interrogate or activate would be inherently safe to use. They would operate at low radiated-power levels for short interrogation times (typically, milliseconds). Hence, there would be little local heating of tissues surrounding the implanted devices and little absorption of radio energy by such sensitive body parts as the eyes and the brain. Because the implanted devices would not depend on battery power and would be activated only during short interrogation intervals and would otherwise be in the goff h state most of the time, the useful lifetimes of the implanted devices would be greater than those of comparable battery-powered implanted devices. The compactness of the hand-held transceiver units would facilitate transport and storage and would facilitate self-diagnosis by patients able to handle the units while away from medical facilities.

Miranda, Felix A.↗

Neuro-Prosthetic Implants With Adjustable Electrode Arrays

Brushlike arrays of electrodes packaged with application-specific integrated circuits (ASICs) are undergoing development for use as electronic implants especially as neuro-prosthetic devices that might be implanted in brains to detect weak electrical signals generated by neurons. These implants partly resemble the ones reported in Integrated Electrode Arrays for Neuro-Prosthetic Implants (NPO-21198), NASA Tech Briefs, Vol. 27, No. 2 (February 2003), page 48. The basic idea underlying both the present and previously reported implants is that the electrodes would pick up signals from neurons and the ASICs would amplify and otherwise preprocess the signals for monitoring by external equipment. The figure presents a simplified and partly schematic view of an implant according to the present concept. Whereas the electrodes in an implant according to the previously reported concept would be microscopic wires, the electrodes according to the present concept are in the form of microscopic needles. An even more important difference would be that, unlike the previously reported concept, the present concept calls for the inclusion of microelectromechanical actuators for adjusting the depth of penetration of the electrodes into brain tissue. The prototype implant now under construction includes an array of 100 electrodes and corresponding array of electrode contact pads formed on opposite faces of a plate fabricated by techniques that are established in the art of microelectromechanical systems (MEMS). A mixed-signal ASIC under construction at the time of reporting the information for this article will include 100 analog amplifier channels (one amplifier per electrode). On one face of the mixed-signal ASIC there will be a solder-bump/micro-pad array that will have the same pitch as that of the electrode array, and that will be used to make the electrical and mechanical connections between the electrode array and the ASIC. Once the electrode array and the ASIC are soldered together, the remaining empty space between them will be filled with a biocompatible epoxy, the remaining exposed portions of the ASIC will be covered with micromachined plates for protection against corrosive bodily fluids, and then the ASIC and its covering micromachined plates will be coated with parylene

Whitacre, Jay↗

Improved Method of Manufacturing SiC Devices

The phrase, "common-layered architecture for semiconductor silicon carbide" ("CLASSiC") denotes a method of batch fabrication of microelectromechanical and semiconductor devices from bulk silicon carbide. CLASSiC is the latest in a series of related methods developed in recent years in continuing efforts to standardize SiC-fabrication processes. CLASSiC encompasses both institutional and technological innovations that can be exploited separately or in combination to make the manufacture of SiC devices more economical. Examples of such devices are piezoresistive pressure sensors, strain gauges, vibration sensors, and turbulence-intensity sensors for use in harsh environments (e.g., high-temperature, high-pressure, corrosive atmospheres). The institutional innovation is to manufacture devices for different customers (individuals, companies, and/or other entities) simultaneously in the same batch. This innovation is based on utilization of the capability for fabrication, on the same substrate, of multiple SiC devices having different functionalities (see figure). Multiple customers can purchase shares of the area on the same substrate, each customer s share being apportioned according to the customer s production-volume requirement. This makes it possible for multiple customers to share costs in a common foundry, so that the capital equipment cost per customer in the inherently low-volume SiC-product market can be reduced significantly. One of the technological innovations is a five-mask process that is based on an established set of process design rules. The rules provide for standardization of the fabrication process, yet are flexible enough to enable multiple customers to lay out masks for their portions of the SiC substrate to provide for simultaneous batch fabrication of their various devices. In a related prior method, denoted multi-user fabrication in silicon carbide (MUSiC), the fabrication process is based largely on surface micromachining of poly SiC. However, in MUSiC one cannot exploit the superior sensing, thermomechanical, and electrical properties of single-crystal 6H-SiC or 4H-SiC. As a complement to MUSiC, the CLASSiC five-mask process can be utilized to fabricate multiple devices in bulk single-crystal SiC of any polytype. The five-mask process makes fabrication less complex because it eliminates the need for large-area deposition and removal of sacrificial material. Other innovations in CLASSiC pertain to selective etching of indium tin oxide and aluminum in connection with multilayer metallization. One major characteristic of bulk micromachined microelectromechanical devices is the presence of three-dimensional (3D) structures. Any 3D recesses that already exist at a given step in a fabrication process usually make it difficult to apply a planar coat of photoresist for metallization and other subsequent process steps. To overcome this difficulty, the CLASSiC process includes a reversal of part of the conventional flow: Metallization is performed before the recesses are etched.

Okojie, Robert S.↗

Distributed Attitude Control and Maneuvering for Deep Space SmallSats

The aim of the Distributed Attitude Control and Maneuvering for Deep Space SmallSats project is to advance a multi-purpose, deep space mission-enabling technology for low-power attitude and thermal control of small satellites to a flight demonstration technology readiness level (TRL). The film-evaporation microelectromechanical systems tunable array (FEMTA) small satellite technology combines innovative microelectromechanical systems (MEMS) microfabrication and microscale effects in fluid surface tension to produce a thermally actuated capillary valve. Using water as the propellant, the FEMTA thruster can generate finely controllable thrust at a thrust to power ratio of about 200 microNewton per Watt (W).

thermal control↗

Reliability Issues of COTS MEMS Packaging

During the last decade, research and development of microelectromechanical systems (MEMS) has shown a significant promise for a variety of commercial applications including automobile and medical purposes.

Microelectromechanical systems MEMS reliability IC↗

Measuring the Thickness and Elastic Properties of Electroactive Thin-Film Polymers Using Platewave Dispersion Data

Electroactive thin-film polymers are candidate sensors and actuators materials. They are also finding significant potential in muscle mechanisms and microelectromechanical systems (MEMS). In these applications, polymer thin films of thickness varying between 20 and 300 micrometers are utilized. The authors are currently studying the potential use of platewave dispersion curve measurements as an effective gauging tool for electroactive thin-film polymers.

sensors actuators film thickness measurements piez↗

Advancements in MEMS Materials and Processing Technology

From achievements in display imaging to air bag deployment, microelectromechanical systems are becoming more commonplace in everyday life. With an abundance of opportunities for innovative R&D in the field, the research trends are not only directed toward novel sensor and actuator development, but also toward further miniaturization, specifically achieving micro- and nanoscaled intergrated systems.

MEMS Materials Microelectromechanical↗

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗

Low Power, Wide Dynamic Range Carbon Nanotube Vacuum Gauges

This slide presentation presents carbon nanotube vacuum pressure sensor gauges that operate at low power and exhibit a wide-dynamic range based on microelectromechanical systems (MEMS) technology. The fabrication facility, and the formation process are shown. Pressure sensitivity was found to increase rapidly as the bias power was increased. In addition, by etching part of the thermal SiO2 beneath the tubes and minimizing heat conduction through the substrate, pressure sensitivity was extended toward lower pressures. Results are compared to a conventional thin film meander resistor, which was fabricated and whose pressure response was also measured for comparative purposes.

JEOL E-beam aligner↗

MEMS AO for Planet Finding

This slide presentation reviews a method for planet finding using microelectromechanical systems (MEMS) Adaptive Optics (AO). The use of a deformable mirror (DM) is described as a part of the instrument that was designed with a nulling interferometer. The strategy that is used is described in detail.

calibration interferometer↗

MEMS reliability assurance guidelines for space applications

This guideline was developed as an aid to help in the understanding of Microelectromechanical Systems (MEMS) reliability and to facilitate the insertion of this technology into high reliability applications. Modeled after the GaAs MMIC Reliability Assurance Guideline for Space Applications by Kayali, et al., is was felt that a guideline would be more advantageous to people than a strict specification.

microelectromechanical↗

Deciphering electrocatalysts with multimodal operando approaches

Here, the electrocatalytic processes of a copper catalyst during nitrate electroreduction are unveiled by correlated operando microscopy and spectroscopy. Catalysts are vital to the modern chemical industry, yet their development has largely relied on trial-and-error approaches. Optimizing catalysts requires a fundamental understanding of their structure–chemical property behaviour under operational conditions. However, operando characterization remains challenging, especially for reactions occurring in the complex and dynamic liquid environments of electrochemical systems. Over the past decade, the rapid development of in situ and operando environmental transmission electron microscopy (ETEM) and microelectromechanical system (MEMS)-based closed-cell holders, enabling environmental studies within the vacuum environment of transmission electron microscopy (TEM), has substantively advanced understanding of heterogeneous catalysis, notably for gas-phase reactions. In situ ETEM enables the direct observation of the catalyst evolution in terms of structure, morphology and chemical state at the nano-to-atomic scale, providing insights into their correlation with catalytic performance.

36 MATERIALS SCIENCE↗

Extraordinary frequency stabilization by resonant nonlinear mode coupling

Here, we show that a self-sustained oscillator with a frequency-selective element operating with two nonlinearly coupled modes can achieve a level of frequency stability well beyond that available using single-mode operation. The system of interest consists of a self-sustained oscillator based on a nonlinear primary mode that is coupled via an internal resonance to a passive secondary mode. Analysis of a generic model for this resonance with both additive and multiplicative noises reveals that the stability improvements accrue from two sources: (i) nonlinear frequency veering in the primary mode, a classical analogue to quantum-level repulsion, that eliminates amplitude-to-frequency noise conversion; and (ii) phase cleaning of the oscillator through an intrinsic phase constraint arising from synchronization of the modes. This latter effect can significantly reduce the effects of intrinsic frequency fluctuations of the primary mode, which are not accessible by any known strategy using single-mode operation. The theoretical predictions are supported by experimental measurements of a microelectromechanical systems-based oscillator that demonstrate a reduction in oscillator line width of several orders of magnitude. This approach offers a means of optimizing frequency stability in self-sustained oscillators, which has direct implications for applications in timekeeping and sensing.

36 MATERIALS SCIENCE↗