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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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88 records · Page 5

FPGA NEPP : FY09 summary report

This report documents the activities and results of the fiscal year 2009 (FY09) funding for the NASA Electronic Parts and Packaging (NEPP) program for re-programmable field programmable gate arrays (FPGAs). The FY09 task was divided into three efforts: 1. Device physics-based design modifications 2. Contention study of Xilinx Virtex-4 3. IDDQ study of Actel A54SX The FY09 NEPP FPGA study was organized into these three sections in recognition of the continued and increasing importance of FPGAs to NASA. FPGAs represent the state of the art in electronic components with millions and millions of transistors integrated into a single device. Modern NASA spacecraft design has dozens and dozens of FPGAs implemented onboard. FPGAs are used in critical command and data handling, instrument control and monitoring, and communications protocols, to name just a few. The reliability of FPGAs is fundamental to mission success for NASA.

Sheldon, Douglas↗

Physics of failure analysis of Xilinx Flip Chip CCGA packages: effects of mission environments on properties of LP2 underfill and ATI lid adhesive materials

The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

Suh, Jong-ook↗

High-Rate Ka-Band Modulator for the NISAR Mission

In order to meet ever-increasing data return requirements, more satellites are using the near-Earth Ka-band (25.5 – 27.0 GHz) to achieve higher downlink rates. The paper discusses the Universal Space Transponder - Ka-band Modulator (UST-KaM) developed at the NASA Jet Propulsion Laboratory for the NASA-ISRO SAR (NISAR) mission, which is capable of transmitting up to 1.74 Gbps with 7/8 LDPC encoding. The UST-KaM utilizes OQPSK with both baseband and RF filtering to contain the 1 Gsps transmission spectrum within the 1.5 GHz Ka-band, even with the use of an external, saturated amplifier. Due to the high data rates involved, several technical hurdles were overcome in both the digital and RF designs. The UST-KaM is a software defined radio with two digital circuit board assemblies: a low speed housekeeper board for commanding and telemetry, and a high-rate signal processing board known as the Signal Processing Module (SPM). The SPM receives data from the spacecraft via a SERDES interface at up to 2 Gbps, processes and encodes the data using a Xilinx Virtex-5 FPGA, and produces 1 Gsps OQPSK I and Q waveforms via synchronized, multiplexed DACs. The RF Electronics in the UST-KaM employ a heterodyne architecture in which the I/Q digital waveforms are filtered and then up-converted using a sub-harmonic IQ mixer. The LO of the converter, which is included in the exciter assembly, is at 13.125GHz, and the RF output is a 26.25GHz carrier which is modulated with the OQPSK waveforms. The output of the mixer is then filtered using low loss quartz thinfilm edge coupled Chebyshev filters and amplified through a series of low gain Ka-Band amplifiers. The exciter assembly also has a 2GHz, low-phase-noise, PLL synthesizer to supply the clock to the DACs for the high rate digital waveforms.

Spurgers, Carl↗

SEE and TID extension testing of the Xilinx XQR18V04 4Mbit radiation hardened configuration PROM

The XQR18V04 was evaluated for single event upset rates using proton and heavy ions. The PROM was demonstrated to be immune to latch-up, as well as to static upset in the flash memory cells, to an LET > 125 MeV/mg/cmz (effective). The PROM was also tested in a dynamic mode, which revealed three distinct error modes: Read Bit Errors, Address Errors, and a Single Event Functional Interrupt (SEW which affected the data output drivers. Saturation cross-sections, and onset thresholds, for these errorinodes were measured at the heavy ion facility at Texas A&M University, and the proton facility at UC Davis. Additional testing was performed at UC Davis and the Cobalt 60 source at McClellan Air Force Base to examine the effect to TID life as a function of power biasing. The PROM demonstrated a 100% improvement in total TID life with an 84% percent decrease in device usage.

FPGA Virtex II SEU↗

Implementing Legacy-C Algorithms in FPGA Co-Processors for Performance Accelerated Smart Payloads

Accurate, on-board classification of instrument data is used to increase science return by autonomously identifying regions of interest for priority transmission or generating summary products to conserve transmission bandwidth. Due to on-board processing constraints, such classification has been limited to using the simplest functions on a small subset of the full instrument data. FPGA co-processor designs for SVM1 classifiers will lead to significant improvement in on-board classification capability and accuracy.

co-processor↗

Infusion of New Technology into the QML System

QML stands for the Qualified Manufacturer List. It is maintained by DLA-Land and Maritime (formerly known as the Defense Supply Center Columbus, DSCC). This talk will address how we are bringing new technology products into the QML system. The focus will be on microcircuit parts used in space application. A new effort championed by NASA will be described. NASA EEE Parts Assurance Group (NEPAG) is making every effort to strengthen the MIL system and thereby support the space flight projects

Class Y↗

Single Event Effects in FPGA Devices 2014-2015

This presentation provides an overview of single event effects in FPGA devices 2014-2015 including commercial Xilinx V5 heavy ion accelerated testing, Xilinx Kintex-7 heavy ion accelerated testing. Mitigation study, and investigation of various types of triple modular redundancy (TMR) for commercial SRAM based FPGAs.

Single event upset (SEU)↗

Single Event Effects in FPGA Devices 2015-2016

This presentation provides an overview of single event effects in FPGA devices 2015-2016 including commercial Xilinx V5 heavy ion accelerated testing, Xilinx Kintex-7 heavy ion accelerated testing, mitigation study, and investigation of various types of triple modular redundancy (TMR) for commercial SRAM based FPGAs.

Xilinx V5↗

Single Event Effects in FPGA Devices 2015-2016

This presentation provides an overview of single event effects in FPGA devices 2015-2016 including commercial Xilinx V5 heavy ion accelerated testing, Xilinx Kintex-7 heavy ion accelerated testing. Mitigation study, and investigation of various types of triple modular redundancy (TMR) for commercial SRAM based FPGAs.

Single Event Upset (SEU) Testing↗