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For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).
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Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Diffenent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included understanding assembly reliability behavior of conventional surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Different aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.