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CSP is an emerging technology with significant potential growth in stacking. Many of the stacking techniques for conventional packages could be implemented for CSP once materials, process, and system development for finer features are developed.
Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes. These test vehicles use numerous package types. To understand potential failure mechanisms of the packages, particularly solder ball attachment, the grid CSPs were subjected to environmental exposure. Package I/Os ranged from 40 to nearly 300. This paper presents both as assembled, up to 1, 000 hours of isothermal aging shear test results and photo micrographs, and tensile test results before and after 1,500 cycles in the range of -30/100 C for CSPs. Results will be compared to BGAs with the same the same isothermal aging environmental exposures.
Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.
Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.
Research on the CHREC Space Processor (CSP) takes a multifaceted hybrid approach to embedded space computing. Working closely with the NASA Goddard SpaceCube team, researchers at the National Science Foundation (NSF) Center for High-Performance Reconfigurable Computing (CHREC) at the University of Florida and Brigham Young University are developing hybrid space computers that feature an innovative combination of three technologies: commercial-off-the-shelf (COTS) devices, radiation-hardened (RadHard) devices, and fault-tolerant computing. Modern COTS processors provide the utmost in performance and energy-efficiency but are susceptible to ionizing radiation in space, whereas RadHard processors are virtually immune to this radiation but are more expensive, larger, less energy-efficient, and generations behind in speed and functionality. By featuring COTS devices to perform the critical data processing, supported by simpler RadHard devices that monitor and manage the COTS devices, and augmented with novel uses of fault-tolerant hardware, software, information, and networking within and between COTS devices, the resulting system can maximize performance and reliability while minimizing energy consumption and cost. NASA Goddard has adopted the CSP concept and technology with plans underway to feature flight-ready CSP boards on two upcoming space missions.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications.
This research addresses a cost barrier towards achieving a solar thermal collector system with an installed cost of $75/sq m and meet the Department of Energy's (DOE's) performance targets for optical errors, operations during windy conditions and lifetime. Current concentrators can cost as much as 40-50% of the total installed costs for a CSP plant. In order to reduce the costs from current $200-$250/sq m, it is important to focus on the overall system. The reflector surface is a key cost driver, and our film-based polymer reflector will help significantly in achieving DOE's cost target of $75/sq m. The ease of manufacturability, installation and replacement make this technology a compelling one to develop. This technology can be easily modified for a variety of CSP options including heliostats, parabolic dishes and parabolic troughs.
In this paper, the assembly process flow, solder paste for different stencil design, manufacturing defects, X-ray inspection results, and ultrasonic characterizations are reported.
The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2,000 hours at 100 C and 125 C and thermal cycling test results to 1,700 cycles in the range of -30 to 100 C.
Although the expression of CSP is widely used by industry from suppliers to users, its implied definition had evolved as the technology has matured. There are "expert definition"- package that is up to 1.5 time die- or "interim definition". CSPs are miniature new packages that industry is starting to implement and there are many unresolved technical issues associated with their implementation. For example, in early 1997, packages with 1 mm pitch and lower were the dominant CSPs, whereas in early 1998 packages with 0.8 mm and lower became the norm for CSPs. Other changes included the use of flip chip die rather than wire bond in CSP. Nonetheless the emerging CSPs are competing with bare die assemblies and are becoming the package of choice for size reduction applications. These packages provide the benefits of small size and performance of the bare die or flip chip, with the advantage of standard die packages. The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. This talk will cover specifically the experience of our consortium on technology implementation challenges, including design and build of both standard and microvia boards, assembly of two types of test vehicles, and the most current environmental thermal cycling test results.
The capabilities of the atmospheric modeling and sensor simulation (AMASS) system were studied in order to enhance them. This system is used in processing atmospheric measurements which are utilized in the evaluation of sensor performance, conducting design-concept simulation studies, and also in the modeling of the physical and dynamical nature of atmospheric processes. The study tasks proposed in order to both enhance the AMASS system utilization and to integrate the AMASS system with other existing equipment to facilitate the analysis of data for modeling and image processing are enumerated. The following array processors were evaluated for anticipated effectiveness and/or improvements in throughput by attachment of the device to the P-e: (1) Floating Point Systems AP-120B; (2) Floating Point Systems 5000; (3) CSP, Inc. MAP-400; (4) Analogic AP500; (5) Numerix MARS-432; and (6) Star Technologies, Inc. ST-100.
Different aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
Improved channeled-substrate-planar (CSP) lasers that emit at wavelengths between 860 and 880 nm grown by liquid-phase epitaxy (LPE). Exhibit record high output powers and efficiencies, attained without sacrifice of desirable characteristics of lasers. In fabrication, second reverse-bias p/n junction incorporated to reduce required current. By incorporating two reverse-bias junctions in CSP structure, one doubly confines current. Lasers used eventually as sources of light in intersatellite communications systems and, specifically, NASA Advanced Communications Technology Satellite (ACTS) System.
Index-guided channeled-substrate-planar (CSP) AlGaAs diode lasers are being developed for reliable, high-power operation for use as sources in spaceborne optical communications systems. Although most work on this AlGaAs structure has been aimed at optimizing performance at output wavelengths less than 8400 A, emission in the 8700 A regime is also of interest. In particular, such wavelengths are required for use in the direct detection laser transceiver to be incorporated into NASA's advanced communications technology satellite, in order to avoid absorption of the light by the atmosphere when communicating with ground-based terminals. Lowest order spatial mode and substantially single longitudinal mode output has been observed in 0.87-micron CSP devices in excess of 50 mW cw and 100 mW 50 percent duty-cycle, with rms phase-front aberrations measured to be about lambda/40.
The conference presents papers on optical communications in space, diode laser transmitters, lasercom link transmission characteristics, lasercom systems and technologies, high frequency optical components, and optically controlled phased array antennas. Particular attention is given to a deep space optical communications development program, 0.87-micron CSP diode lasers for spaceborne communications, performance measurements of a diode laser optical communications link with Q = 4 PPM signaling, the optical communications link design for the tracking and data acquisition system, and a cost-performance model for ground-based optical communications receiving telescopes. Other topics include optoelectronic componentry for the direct transmission of microwave signals over optical fiber, applications of monolithic detectors, and optical control considerations for phased array antennas.
Advances in nanosat subsystems over the past decade have taken the CubeSat standard from a communication-limited educational tool to a powerful platform enabling space research. The potential for autonomous operations may greatly increase the capability of downlinking even larger data sets. This is enabled through miniaturization of software-defined radio/cognitive communication solutions and a rapidly growing number of ground stations and satellite network crosslinks. The TechEdSat-n orbital flight series is currently demonstrating experiments using cognitive communication concepts including User Initiated Service (UIS) and High-rate Delay Tolerant Networks (HDTN), which show a significant step toward improved capability. At the core of this is the use of the Iridium L-band Short Burst Data (SBD) modems, pioneered by TES-n for space applications. SBD enables unique rapid command, control, and scheduling to initiate the UIS and HDTN protocols. This occurs by performing GPS-assisted on-orbit ephemeris determination, enabling negotiation with high bandwidth ground assets to repeatedly downlink over a specific commercial or government-owned ground station. The technique is RF band-agnostic and may be extended to higher bandwidth stations and SDRs. This may also include free-space optical communication, through both laser and omnidirectional LEDs, which can provide an attractive protocol for downlinking very large datasets over far fewer ground stations. In addition, this may be extended to lunar applications for such future concepts as LunaNet, whereby scheduling and cognitive technologies can assist in greatly improving Earth downlink capabilities with ground stations which will see greater competition for usage. Lastly, the NASA Communication Service Program (CSP), intended to eventually replace the NASA Tracking and Data Relay Satellite System (TDRSS) will also demonstrate the feasibility of commercially-provided satellite communication capabilities. All of these combined advances, including large advances in on-board computation on small platforms, will result in more remarkable data processing capability – yielding even more as of yet unknown discoveries.
The National Aeronautics and Space Administration (NASA) Space Communications and Navigation (SCaN) Program is continuing to forge a path toward programmatic and operational transformation enabling commercialization of communications and navigation services to the greatest extent possible for near Earth users. National Space Policy is driving government agencies to incorporate commercial offerings and services to the maximum extent possible. As such, NASA has no plans to build or deploy Tracking and Data Relay Satellites, but will seek to fill NASA mission space-relay capability needs using commercial satellite communications (SATCOM) providers and services. The goal is to support an approach that is both flexible to commercial service constructs and provides continuity of support with current assets as long as required. Progress toward commercialization is advancing in two key areas: (1) awards have been made for demonstrations of SATCOM services, and (2) development of wideband and multilingual user terminals has advanced to the flight demonstration phase. The Communications Services Project (CSP) at Glenn Research Center (GRC), has awarded Funded Space Act Agreements (FSAA) to six industry vendors. Inmarsat Government Inc., Kuiper Government Solutions (KGS) LLC, SES Government Solutions, Space Exploration Technologies, Telesat U.S. Services LLC, and Viasat Incorporated received a combined $278.5 million to complete technology development and in-space demonstrations over the next several years. The end-to-end service capabilities being targeted are based on existing NASA mission operational needs. Accordingly, each company has proposed a technical approach to lower costs, increase flexibility, and improve performance for a broad range of missions. In the current market, industry vendors operate at a range of different frequencies and use variable, sometime proprietary, coding and modulations schemes. As NASA strives for a network comprised of services provided by multiple distinct suppliers, interoperability is a fitting solution to unify the network. Wideband and multi-lingual user terminals are being developed to bridge differences in industry services. Building on ground demonstrations completed in 2021, the Johns Hopkins Applied Physics Lab (APL) will be flight testing a multi-lingual wideband terminal (payload) and demonstrating connectivity to both government and commercial relay services. This paper provides a discussion of the progress toward NASA’s commercial space communications goals and consideration of key challenges and next steps.
The National Aeronautics and Space Administration (NASA) Space Communications and Navigation (SCaN) Program is continuing to forge a path toward programmatic and operational transformation enabling commercialization of communications and navigation services to the greatest extent possible for near Earth users. U.S. National Space Policy is driving government agencies to incorporate commercial offerings and services to the maximum extent possible. As such, NASA has no plans to build or deploy additional Tracking and Data Relay Satellites (TDRS), but will seek to fill NASA mission space-relay capability needs using commercial satellite communications (SATCOM) providers and services. The goal is to support an approach that is both flexible to commercial service constructs and provides continuity of support with current assets as long as required. Progress toward commercial services is advancing in two key areas: (1) awards have been made for demonstrations of SATCOM services, and (2) development of wideband and multilingual user terminals has advanced to the flight demonstration phase. The Communications Services Project (CSP) at Glenn Research Center (GRC), has awarded Funded Space Act Agreements (FSAA) to six industry vendors. Inmarsat Government Inc., Kuiper Government Solutions (KGS) LLC, SES Government Solutions, Space Exploration Technologies, Telesat U.S. Services LLC, and Viasat Incorporated will receive a combined $278.5 million to complete technology development and in-space demonstrations over the next several years. The end-to-end service capabilities being targeted are based on existing NASA mission operational needs. Accordingly, each company has proposed a technical approach to lower costs, increase flexibility, and improve performance for a broad range of missions. In the current market, industry vendors operate at a range of different frequencies and use variable, sometimes proprietary, coding and modulations schemes. As NASA strives for a network comprised of services provided by multiple distinct suppliers, interoperability is a fitting solution to unify the network. Wideband and multi-lingual user terminals are being developed to bridge differences in industry services. Building on ground demonstrations completed in 2021, the Johns Hopkins Applied Physics Lab (APL) will be flight testing a multi-lingual wideband terminal (payload) and demonstrating connectivity to both government and commercial relay services. This paper provides a discussion of the progress toward NASA’s commercial space communications goals and consideration of key challenges and next steps.