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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2000

Accelerated thermal and mechanical testing of CSP assemblies

Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.

Chip Scale Package CSP thermal cycle fatigue solde↗
NASA NTRS1998

Chip Scale Package Implementation Challenges

The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2,000 hours at 100 C and 125 C and thermal cycling test results to 1,700 cycles in the range of -30 to 100 C.

Ghaffarian, Reza↗
NASA NTRS2000

Thermal cycling test results of CSP and RF assemblies

A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

chip scale package CSP thermal cycle solder joint ↗
NASA NTRSDate not supplied

Service Provider Agnostic Adaptive Coding and Modulation System Design

Commercial service providers (CSPs) are increasingly used to provide communications services to near-Earth science and exploration missions. CSPs commonly utilize modems that are designed to implement adaptive coding and modulation (ACM) in unique ways with modems from the same vendor. However, some missions cannot fly a matching vendor modem, either because the vendor only designs modems for terrestrial use, or the mission needs to fly a software defined radio. We present an ACM system design that allows missions to implement ACM on DVB-S2 compliant CSP links without needing to fly a modem from the same vendor the CSP uses. We implement and test our design in an emulated communications testbed. These tests demonstrate that our ACM system design can successfully adapt to link quality changes up to 6.12 dB/second.

Adaptive coding and modulation↗
NASA NTRSDate not supplied

Service Provider Agnostic Adaptive Coding and Modulation System Design

Commercial service providers (CSPs) are increasingly used to provide communications services to near-Earth science and exploration missions. CSPs commonly utilize modems that are designed to implement adaptive coding and modulation (ACM) in unique ways with modems from the same vendor. However, some missions cannot fly a matching vendor modem, either because the vendor only designs modems for terrestrial use, or the mission needs to fly a software defined radio. We present an ACM system design that allows missions to implement ACM on DVB-S2 compliant CSP links without needing to fly a modem from the same vendor the CSP uses. We implement and test our design in an emulated communications testbed. These tests demonstrate that our ACM system design can successfully adapt to link quality changes up to 6.12 dB/second.

Adaptive coding and modulation↗
NASA NTRS2000

Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies. Acceleration induced failure mechanisms varied from conventional surface mount (SM) failures for CSPs. Examples of unrealistic life projections for other CSPs are also presented. The cumulative cycles to failure for ceramic BGA assemblies performed under different conditions, including plots of their two Weibull parameters, are presented. The results are for cycles in the range of -30 C to 100 C, -55 C to 100 C, and -55 C to 125 C. Failure mechanisms as well as cycles to failure for thermal shock and thermal cycling conditions in the range of -55 C to 125 C were compared. Projection to other temperature cycling ranges using a modified Coffin-Manson relationship is also presented.

Ghaffarian, Reza↗
NASA NTRS2001

Effect of thermal cycling ramp rate on CSP assembly reliability

A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.

accelerated thermal cycle chip scale package solde↗
NASA NTRS1998

Chip Scale Package Integrity Assessment by Isothermal Aging

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes. These test vehicles use numerous package types. To understand potential failure mechanisms of the packages, particularly solder ball attachment, the grid CSPs were subjected to environmental exposure. Package I/Os ranged from 40 to nearly 300. This paper presents both as assembled, up to 1, 000 hours of isothermal aging shear test results and photo micrographs, and tensile test results before and after 1,500 cycles in the range of -30/100 C for CSPs. Results will be compared to BGAs with the same the same isothermal aging environmental exposures.

Ghaffarian, Reza↗
NASA NTRS2009

Proceedings of the First NASA Formal Methods Symposium

Topics covered include: Model Checking - My 27-Year Quest to Overcome the State Explosion Problem; Applying Formal Methods to NASA Projects: Transition from Research to Practice; TLA+: Whence, Wherefore, and Whither; Formal Methods Applications in Air Transportation; Theorem Proving in Intel Hardware Design; Building a Formal Model of a Human-Interactive System: Insights into the Integration of Formal Methods and Human Factors Engineering; Model Checking for Autonomic Systems Specified with ASSL; A Game-Theoretic Approach to Branching Time Abstract-Check-Refine Process; Software Model Checking Without Source Code; Generalized Abstract Symbolic Summaries; A Comparative Study of Randomized Constraint Solvers for Random-Symbolic Testing; Component-Oriented Behavior Extraction for Autonomic System Design; Automated Verification of Design Patterns with LePUS3; A Module Language for Typing by Contracts; From Goal-Oriented Requirements to Event-B Specifications; Introduction of Virtualization Technology to Multi-Process Model Checking; Comparing Techniques for Certified Static Analysis; Towards a Framework for Generating Tests to Satisfy Complex Code Coverage in Java Pathfinder; jFuzz: A Concolic Whitebox Fuzzer for Java; Machine-Checkable Timed CSP; Stochastic Formal Correctness of Numerical Algorithms; Deductive Verification of Cryptographic Software; Coloured Petri Net Refinement Specification and Correctness Proof with Coq; Modeling Guidelines for Code Generation in the Railway Signaling Context; Tactical Synthesis Of Efficient Global Search Algorithms; Towards Co-Engineering Communicating Autonomous Cyber-Physical Systems; and Formal Methods for Automated Diagnosis of Autosub 6000.

Denney, Ewen↗
NASA NTRS1999

Chip Scale Package Integrity Assessment by Isothermal Aging

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.

chipscale↗
NASA NTRS1988

AlGaAs heterojunction lasers

The characterization of 8300 A lasers was broadened, especially in the area of beam quality. Modulation rates up to 2 Gbit/sec at output powers of 20 mW were observed, waveform fidelity was fully adequate for low BER data transmission, and wavefront measurements showed that phase aberrations were less than lamda/50. Also, individually addressable arrays of up to ten contiguous diode lasers were fabricated and tested. Each laser operates at powers up to 30 mW CW in single spatial mode. Shifting the operating wavelength of the basic CSP laser from 8300 A to 8650 A was accomplished by the addition of Si to the active region. Output power has reached 100 mW single mode, with excellent far field wave front properties. Operating life is currently approx. 1000 hrs at 35 mW CW. In addition, laser reliability, for operation at both 8300 A and 8650 A, has profited significantly from several developments in the processing procedures.

Goldstein, B.↗
NASA NTRS1988

Safety research of insulating materials of cable for nuclear power generating station

The polymers PE, EPR, PVC, Neoprene, CSP, CLPE, EP and other similar substances are frequently used as insulation and protective covering for cables used in nuclear power generating stations. In order to test these materials for flame retardation, environmental resistance, and cable specifications, they were given the cable normal test, flame test, chemical tests, and subjected to design analysis and loss of coolant accident tests. Material was collected on spark tests and actual experience standards were established through these contributions and technology was accumulated.

Lee, C. K.↗
NASA NTRS1999

Accelerated Thermal Cycling and Failure Mechanisms

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.

BGA CSP CBGA thermal cycle solder joint reliabilit↗
NASA NTRS1989

Single mode wavelength control of modulated AlGaAs lasers with external and internal etalon feedback

Single mode lasing without mode hops has been obtained for VSIS and CSP laser diodes with an external etalon attached to the laser's front facet for up to an 8 C range CW and a 4 C range pulsed, with .07 nm/C tuning. Tests of thin tapered-thickness (TTT) laser diodes show CW and pulsed single mode lasing over 10 C and 2 C ranges, respectively, with .08 nm/C tuning. An analysis of the TTT structure reveals the equivalent of an internal etalon. The time-resolved pulsed behavior for both types of lasers show single mode lasing within the proper temperature ranges with minor modes present only early in the optical pulse, if at all. The external etalon produces noticeable interference fringes in the farfield pattern, while those of the TTT lasers are smooth. Ongoing CW lifetest results indicate stability to within one longitudinal mode after a few hundred hours of operation, along with at least several thousand hours lifetime.

Maynard, William L.↗