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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1973

Performance comparison of a lobed-daisy mixer nozzle with a convergent nozzle at subsonic speeds

An investigation to determine the performance, in terms of thrust minus nozzle axial force, of a lobed-daisy mixer nozzle has been conducted in a 16-foot transonic tunnel at static conditions and at Mach numbers from 0.40 to 0.90 at angles of attack from 4 minus to 8. Jet-total-pressure ratio was varied from about 1.2 to 2.0. The performance of a reference convergent nozzle with a similar nozzle throat area and length was used as a base line to evaluate the performance of the lobed-daisy mixer nozzle. The results of this investigation indicate that with no external airflow (Mach number M of 0), and at values of jet-total-pressure ratio between 1.2 and 2.0, the static thrust exerted by the lobed-daisy mixer nozzle is less than that of the convergent nozzle by about 10 percent of ideal gross thrust. About 3.4 percent of the thrust loss was attributed to an unintentional internal area expansion in the fan passage.

Maiden, D. L.↗
NASA NTRS2018

2.5/3D Daisy Chain Reliability Evaluation

The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.

Ghaffarian, Reza↗
NASA NTRS1988

DAISY-DAMP: A distributed AI system for the dynamic allocation and management of power

One of the critical parameters that must be addressed when designing a loosely coupled Distributed AI SYstem (DAISY) has to do with the degree to which authority is centralized or decentralized. The decision to implement the Dynamic Allocation and Management of Power (DAMP) system as a network of cooperating agents mandated this study. The DAISY-DAMP problem is described; the component agents of the system are characterized; and the communication protocols system elucidated. The motivations and advantages in designing the system with authority decentralized is discussed. Progress in the area of Speech Act theory is proposed as playing a role in constructing decentralized systems.

Hall, Steven B.↗
NASA NTRS2005

Auto-Routable, Configurable, Daisy Chainable Data Acquisition System

A method and apparatus for an acquisition system includes a plurality of sensor input signal lines. At least one of the plurality of sensor input signal lines operatively connects to at least one of a plurality of amplifier circuits. At least one of the plurality of amplifier circuits operatively connects to at least one of a plurality of filter circuits.

Shuler, Robert L.↗
NASA NTRS2016

Virtex-5 CN Package Daisy Chain Evaluation Test Report

The board-level temperature cycling reliability of Xilinx Virtex-5 (V5) CN package was investigated. V5s were temperature cycled under two conditions, 0 to +100 C (0/100) and -55 to +100 C (-55/100). During the 0/100 test, no part out of 8 parts failed up to 6586 cycles. During the -55/100 test, one part out of 8 parts failed at 1236 cycle, and there were no additional failures up to 1705 cycles. The failure mode of the part that failed at 1236 cycles indicated that most likely the failure was not a solder fatigue failure, and therefore no obvious solder fatigue failure was observed throughout the tests.

Suh, Jong-ook↗
NASA NTRS2011

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

Ramesham, Rajeshuni↗
NASA NTRS2017

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗
NASA NTRS1972

Externally blown flap impingement noise.

An investigation of externally blown flap impingement noise was conducted using a full-scale turbofan engine and aircraft wing. The noise produced with a daisy nozzle installed on the engine exhaust system was greater than that produced by a conical nozzle at the same thrust. The daisy nozzle caused the jet velocity to decay about 35 percent at the flap. The presence of the wing next to the conical nozzle increased the noise, as did increasing the flap deflection. Compared with the conical nozzle, the daisy nozzle produced slightly less noise at a flap deflection of 60 deg but produced more noise at the lower flap deflections tested.

Putnam, T. W.↗
NASA NTRS2008

Column Grid Array Rework for High Reliability

Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

high reliability↗
NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗
NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗
NASA NTRS1973

Pressures and temperatures on the lower surfaces of an externally blown flap system during full-scale ground tests

Full-scale ground tests of an externally blown flap system were made using the wing of an F-111B airplane and a CF700 engine. Pressure and temperature distributions were determined on the undersurface of the wing, vane, and flap for two engine exhaust nozzles (conical and daisy) at several engine power levels and engine/wing positions. The test were made with no airflow over the wing. The wing sweep angle was fixed at e6 deg; and the angle of incidence between the engine and the wing was fixed at 3 deg; and the flap was in the retracted, deflected 35 deg, and deflected 60 deg positions. The pressure load obtained by integrating the local pressures on the undersurface of the flap, F sub p was approximately three times greater at the 60 deg flap position than at the 35 deg flap position. At the 60 deg flap position, F sub p was between 40 percent and 55 percent of the engine thrust over the measured range of thrust. More than 90 percent of F sub p was contained within plus or minus 20 percent of the flap span centered around the engine exhaust centerline with both nozzle configurations. Maximum temperatures recorded on the flaps were 218 C (424 F) and 180 C (356 F) for the conical and daisy nozzles, repectively,

Hughes, D. L.↗
NASA NTRS1972

Survey of wing and flap lower-surface temperatures and pressures during full-scale ground tests of an externally blown flap system

Full-scale ground tests of an externally blown flap system were made using the wing of an F-111B airplane and a CF700 engine. Pressure and temperature distributions were determined on the undersurface of the wing, vane, and flap for two engine exhaust nozzles (conical and daisy) at several engine power and engine/wing positions. The tests were made with no airflow over the wing. The leading-edge wing sweep angle was fixed at 26 deg, the angle of incidence between the engine and the wing was fixed at 3 deg, and the tests were conducted with the flap retracted, extended and deflected 35 deg, and extended and deflected 60 deg. The integrated local pressures on the undersurface of the flap produced loads approximately three times as great at the 60 deg flap position as at the 35 deg flap position. With both nozzle configurations, more than 90 percent of the integrated pressure loads were contained within plus or minus 20 percent of the flap span centered around the engine exhaust centerline. The maximum temperature recorded on the flaps was 218 C (424 F) for the conical nozzle and 180 C (356 F) for the daisy nozzle.

Hughes, D. L.↗
NASA NTRS1972

Externally blown flap impingement noise

Tests of the noise produced by the impingement of the jet exhaust on the wing and flap for an externally blown flap system were conducted with a CF700 turbofan engine and an F-111B wing panel. The noise produced with a daisy nozzle installed on the engine was greater than that produced by a conical nozzle at the same thrust. The presence of the wing next to the test nozzles increased the noise, as did increasing the flap deflection angle. Compared with the conical nozzle, the daisy nozzle produced slightly less noise at a flap deflection of 60 deg but produced more noise at the lower flap deflections tested. Tests showed that the single-slotted flap deflected 60 deg, produced less noise than the double-slotted flaps. Also, maintaining the maximum distance between the exit nozzle and flap system resulted in a minor reduction in noise.

Lasagna, P. L.↗
NASA NTRS1983

A system for intelligent teleoperation research

The Automation Technology Branch of NASA Langley Research Center is developing a research capability in the field of artificial intelligence, particularly as applicable in teleoperator/robotics development for remote space operations. As a testbed for experimentation in these areas, a system concept has been developed and is being implemented. This system termed DAISIE (Distributed Artificially Intelligent System for Interacting with the Environment), interfaces the key processes of perception, reasoning, and manipulation by linking hardware sensors and manipulators to a modular artificial intelligence (AI) software system in a hierarchical control structure. Verification experiments have been performed: one experiment used a blocksworld database and planner embedded in the DAISIE system to intelligently manipulate a simple physical environment; the other experiment implemented a joint-space collision avoidance algorithm. Continued system development is planned.

Orlando, N. E.↗
NASA NTRS1989

Flexible structure control experiments using a real-time workstation for computer-aided control engineering

A Real-Time Workstation for Computer-Aided Control Engineering has been developed jointly by the Communications Research Centre (CRC) and Ruhr-Universitaet Bochum (RUB), West Germany. The system is presently used for the development and experimental verification of control techniques for large space systems with significant structural flexibility. The Real-Time Workstation essentially is an implementation of RUB's extensive Computer-Aided Control Engineering package KEDDC on an INTEL micro-computer running under the RMS real-time operating system. The portable system supports system identification, analysis, control design and simulation, as well as the immediate implementation and test of control systems. The Real-Time Workstation is currently being used by CRC to study control/structure interaction on a ground-based structure called DAISY, whose design was inspired by a reflector antenna. DAISY emulates the dynamics of a large flexible spacecraft with the following characteristics: rigid body modes, many clustered vibration modes with low frequencies and extremely low damping. The Real-Time Workstation was found to be a very powerful tool for experimental studies, supporting control design and simulation, and conducting and evaluating tests withn one integrated environment.

Stieber, Michael E.↗