Minimum dimension dimple analysis. MEMS Reliability Alliance Technical Report 36-02
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MEMS reliability analysis↗
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Establishing Engineering Methods and Criteria Required by Predictive Analysis for Mechanical Reliability of MEMS Structures
The expanding areas of MEMS applications are often characterized by demanding operating conditions or harsh environments for those sensitive devices.
MEMS Reliability Predictive Failure Analysis↗
Reliability Analysis of Brittle Material Structures - Including MEMS(?) - With the CARES/Life Program
Brittle materials are being used, or considered, for a wide variety of high tech applications that operate in harsh environments, including static and rotating turbine parts. thermal protection systems, dental prosthetics, fuel cells, oxygen transport membranes, radomes, and MEMS. Designing components to sustain repeated load without fracturing while using the minimum amount of material requires the use of a probabilistic design methodology. The CARES/Life code provides a general-purpose analysis tool that predicts the probability of failure of a ceramic component as a function of its time in service. For this presentation an interview of the CARES/Life program will be provided. Emphasis will be placed on describing the latest enhancements to the code for reliability analysis with time varying loads and temperatures (fully transient reliability analysis). Also, early efforts in investigating the validity of using Weibull statistics, the basis of the CARES/Life program, to characterize the strength of MEMS structures will be described as as well as the version of CARES/Life for MEMS (CARES/MEMS) being prepared which incorporates single crystal and edge flaw reliability analysis capability. It is hoped this talk will open a dialog for potential collaboration in the area of MEMS testing and life prediction.
Nemeth, Noel N.↗
Unreleased polysilicon beam failure. MEMS Reliability Alliance Technical Report 37-01
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MEMS reliability analysis↗
MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Testing and Analysis
As the design of Micro-Electro-Mechanical System (MEMS) devices matures and their application extends to critical areas, the issues of reliability and long-term survivability become increasingly important. This paper reviews some general approaches to addressing the reliability and qualification of MEMS devices for space applications.
MEMS↗
Development of Probabilistic Life Prediction Methodologies and Testing Strategies for MEMS and CMC's
This effort is to investigate probabilistic life prediction methodologies for ceramic matrix composites and MicroElectroMechanical Systems (MEMS) and to analyze designs that determine stochastic properties of MEMS. For CMC's this includes a brief literature survey regarding lifing methodologies. Also of interest for MEMS is the design of a proper test for the Weibull size effect in thin film (bulge test) specimens. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. A main objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures/Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads. A second set of objectives is to determine the applicability/suitability of the CARES/Life methodology for CMC analysis, what changes would be needed to the methodology and software, and if feasible, run a demonstration problem. Also important is an evaluation of CARES/Life coupled to the ANSYS Probabilistic Design System (PDS) and the potential of coupling transient reliability analysis to the ANSYS PDS.
Jadaan, Osama↗
Development of Probabilistic Life Prediction Methodologies and Testing Strategies for MEMS
This effort is to investigate probabilistic life prediction methodologies for MicroElectroMechanical Systems (MEMS) and to analyze designs that determine stochastic properties of MEMS. This includes completion of a literature survey regarding Weibull size effect in MEMS and strength testing techniques. Also of interest is the design of a proper test for the Weibull size effect in tensile specimens. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. Another potential item of interest is analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structuredlife (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads. Along these lines work may also be performed on transient fatigue life prediction methodologies.
Jadaan, Osama M.↗
Development of Testing Methodologies for the Mechanical Properties of MEMS
This effort is to investigate and design testing strategies to determine the mechanical properties of MicroElectroMechanical Systems (MEMS) as well as investigate the development of a MEMS Probabilistic Design Methodology (PDM). One item of potential interest is the design of a test for the Weibull size effect in pressure membranes. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. However, the primary area of investigation will most likely be analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. This will be a continuation of the previous years work. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads.
Ekwaro-Osire, Stephen↗
Accounting for Uncertainties in Strengths of SiC MEMS Parts
A methodology has been devised for accounting for uncertainties in the strengths of silicon carbide structural components of microelectromechanical systems (MEMS). The methodology enables prediction of the probabilistic strengths of complexly shaped MEMS parts using data from tests of simple specimens. This methodology is intended to serve as a part of a rational basis for designing SiC MEMS, supplementing methodologies that have been borrowed from the art of designing macroscopic brittle material structures. The need for this or a similar methodology arises as a consequence of the fundamental nature of MEMS and the brittle silicon-based materials of which they are typically fabricated. When tested to fracture, MEMS and structural components thereof show wide part-to-part scatter in strength. The methodology involves the use of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) software in conjunction with the ANSYS Probabilistic Design System (PDS) software to simulate or predict the strength responses of brittle material components while simultaneously accounting for the effects of variability of geometrical features on the strength responses. As such, the methodology involves the use of an extended version of the ANSYS/CARES/PDS software system described in Probabilistic Prediction of Lifetimes of Ceramic Parts (LEW-17682-1/4-1), Software Tech Briefs supplement to NASA Tech Briefs, Vol. 30, No. 9 (September 2006), page 10. The ANSYS PDS software enables the ANSYS finite-element-analysis program to account for uncertainty in the design-and analysis process. The ANSYS PDS software accounts for uncertainty in material properties, dimensions, and loading by assigning probabilistic distributions to user-specified model parameters and performing simulations using various sampling techniques.
Nemeth, Noel↗
MEMS Micro-Valve for Space Applications
We report on the development of a Micro-ElectroMechanical Systems (MEMS) valve that is designed to meet the rigorous performance requirements for a variety of space applications, such as micropropulsion, in-situ chemical analysis of other planets, or micro-fluidics experiments in micro-gravity. These systems often require very small yet reliable silicon valves with extremely low leak rates and long shelf lives. Also, they must survive the perils of space travel, which include unstoppable radiation, monumental shock and vibration forces, as well as extreme variations in temperature. Currently, no commercial MEMS valve meets these requirements. We at JPL are developing a piezoelectric MEMS valve that attempts to address the unique problem of space. We begin with proven configurations that may seem familiar. However, we have implemented some major design innovations that should produce a superior valve. The JPL micro-valve is expected to have an extremely low leak rate, limited susceptibility to particulates, vibration or radiation, as well as a wide operational temperature range.
Chakraborty, I.↗
Simulation of MEMS for the Next Generation Space Telescope
The NASA Goddard Space Flight Center (GSFC) is developing optical micro-electromechanical system (MEMS) components for potential application in Next Generation Space Telescope (NGST) science instruments. In this work, we present an overview of the electro-mechanical simulation of three MEMS components for NGST, which include a reflective micro-mirror array and transmissive microshutter array for aperture control for a near infrared (NIR) multi-object spectrometer and a large aperture MEMS Fabry-Perot tunable filter for a NIR wide field camera. In all cases the device must operate at cryogenic temperatures with low power consumption and low, complementary metal oxide semiconductor (CMOS) compatible, voltages. The goal of our simulation efforts is to adequately predict both the performance and the reliability of the devices during ground handling, launch, and operation to prevent failures late in the development process and during flight. This goal requires detailed modeling and validation of complex electro-thermal-mechanical interactions and very large non-linear deformations, often involving surface contact. Various parameters such as spatial dimensions and device response are often difficult to measure reliably at these small scales. In addition, these devices are fabricated from a wide variety of materials including surface micro-machined aluminum, reactive ion etched (RIE) silicon nitride, and deep reactive ion etched (DRIE) bulk single crystal silicon. The above broad set of conditions combine to be a formidable challenge for space flight qualification analysis. These simulations represent NASA/GSFC's first attempts at implementing a comprehensive strategy to address complex MEMS structures.
Mott, Brent↗
Adaptive filtering and maximum entropy spectra with application to changes in atmospheric angular momentum
The spectral resolution and statistical significance of a harmonic analysis obtained by low-order MEM can be improved by subjecting the data to an adaptive filter. This adaptive filter consists of projecting the data onto the leading temporal empirical orthogonal functions obtained from singular spectrum analysis (SSA). The combined SSA-MEM method is applied both to a synthetic time series and a time series of AAM data. The procedure is very effective when the background noise is white and less so when the background noise is red. The latter case obtains in the AAM data. Nevertheless, reliable evidence for intraseasonal and interannual oscillations in AAM is detected. The interannual periods include a quasi-biennial one and an LF one, of 5 years, both related to the El Nino/Southern Oscillation. In the intraseasonal band, separate oscillations of about 48.5 and 51 days are ascertained.
Penland, Cecile↗
Validation of Landsat-7 ETM+ MEM Thermal Improvement in Thermal Vacuum Tests and in Flight Due to Lower Louver Set Points
The Enhanced Thematic Mapper Plus (ETM+) Main Electronics Module (MEM) power supply heat sink temperature is critical to the Landsat-7 mission. It is strongly dependent on the thermal louver design. A lower power supply heat sink temperature increases the reliability of the MEM, and reduces the risk of over heating and thermal shut-down. After the power supply failures in ETM+ instrument thermal vacuum tests #1 and #2, the author performed detailed thermal analyses of the MEM, and proposed to reduce the louver set-points by 7C. At the 1998 Intersociety Energy Conversion Engineering Conference (IECEC), the author presented a paper that included results of thermal analysis of the MEM. It showed that a 70C reduction of the louver set points could reduce the maximum power supply heat sink temperature in thermal vacuum test and in flight to below 20"C in the cooler outgas mode and in the nominal imaging mode, and has no significant impact on the standby heater duty cycle. It also showed that the effect of Earth infrared and albedo on the power supply heat sink temperature is small. The louver set point reduction was implemented in June 1998, just prior to ETM+ thermal vacuum test #3. Results of the thermal vacuum tests, and temperature data in flight validate the MEM thermal performance improvement due to the 70C reduction of the louver set points.
Choi, Michael K.↗
Temperature Variation Analysis of the STIM300 Inertial Measurement Unit
A key navigation instrument found on most autonomous and semi-autonomous platforms is the inertial measurement unit (IMU). This type of sensor is a combination of microelectromechanical systems (MEMS) that provide inertial information to the navigation system. Typical MEMS hardware include a gyroscope and an accelerometer (for rates and accelerations, respectively) within a single platform. The Near Earth Asteroid (NEA) Scout mission, slated to launch in October of 2018 (Author’s note: NEA Scout ultimately launch on November 16, 2022), carries an on-board IMU from Sensonor. This particular model has yet to see spaceflight, and questions about its on-orbit reliability remain. Dynamic tests were produced in the summer of 2016 by a visiting faculty member from Arkansas Tech University, Daniel Bullock. During these experiments, concerns about the noise characteristics of the sensor were raised, specifically relating to how temperature fluctuations affected the unit. It was found that the IMU took an extended period of time before reaching an internal steady state temperature. These tests often displayed large temperature variations, making the calculation of noise characteristics, such as bias drift, difficult to attribute entirely to noise. Static and dynamic tests were re-performed under more stringent constraints on temperature. Tests reported herein conclude that the IMU is adequately capable of providing inertial information for the NEA Scout mission.
Ivan Rodrigues Bertaska↗
Eccentric loading of microtensile specimens
Ceramic materials have a lower density than most metals and are capable of performing at extremely high temperatures. The utility of these materials is obvious; however, the fracture strength of brittle materials is not easily predicted and often varies greatly. Characteristically, brittle materials lack ductility and do not yield as other materials. Ceramics materials are naturally populated with microscopic cracks due to fabrication techniques. Upon application of a load, stress concentration occurs at the root of these cracks and fracture will eventually occur at some not easily predicted strength. In order to use ceramics in any application some design methodology must exist from which a component can be placed into service. This design methodology is CARES/LIFE (Ceramics Analysis and Reliability Evaluation of Structures) which has been developed and refined at NASA over the last several decades. The CARES/LIFE computer program predicts the probability of failure of a ceramic component over its service life. CARES combines finite element results from a commercial FE (finite element) package such as ANSYS and experimental results to compute the abovementioned probability of failure. Over the course of several tests CARES has had great success in predicting the life of various ceramic components and has been used throughout industry. The latest challenge is to verify that CARES is valid for MEMS (Micro-Electro Mechanical Systems). To investigate a series of microtensile specimens were fractured in the laboratory. From this data, material parameters were determined and used to predict a distribution of strength for other specimens that exhibit a known stress concentration. If the prediction matches the experimental results then these parameters can be applied to a desired component outside of the laboratory. During testing nearly half of the tensile Specimens fractured at a location that was not expected and hence not captured in the FE model. It has been my duty to investigate the nature of this phenomenon in hopes of finding a better correlation between theory and empirical results. To investigate I built complete FE models of all of the tensile specimens using ANSYS. It is suspected that some misalignment naturally occurs during testing and thus additional bending stresses are present in the specimens. I modeled this eccentric loading and ran several FE trials using ANSYS/PDS (a probabilistic design system in ANSYS). My objective this summer has been familiarize myself with the CARES/LIFE program in hopes of using it in conjunction with ANSYS to help verify that CARES is applicable to MEMS-scale (greater that 1 micron, less than 1 millimeter) components.
Trapp, Mark A.↗
Reconfigurable Antennas for High Data Rate Multi-beam Communication Systems
High-speed (2-100 Mb/sec) wireless data communication - whether land- or satellite-based - faces a major challenge: high error rates caused by interference and unpredictable environments. A planar antenna system that can be reconfigured to respond to changing conditions has the potential to dramatically improve data throughput and system reliability. Moreover, new planar antenna designs that reduce array size, weight, and cost can have a significant impact on terrestrial and satellite communication system performance. This research developed new individually-reconfigurable planar antenna array elements that can be adjusted to provide multiple beams while providing increased scan angles and higher aperture efficiency than traditional diffraction-limited arrays. These new elements are microstrip spiral antennas with specialized tuning mechanisms that provide adjustable radiation patterns. We anticipate that these new elements can be used in both large and small arrays for inter-satellite communication as well as tracking of multiple mobile surface-based units. Our work has developed both theoretical descriptions as well as experimental prototypes of the antennas in both single element and array embodiments. The technical summary of the results of this work is divided into six sections: A. Cavity model for analysis and design of pattern reconfigurable antennas; B. Performance of antenna in array configurations for broadside and endfire operation; C. Performance of antenna in array configurations for beam scanning operation; D. Simulation of antennas in infinite phased arrays; E. Demonstration of antenna with commercially-available RF MEMS switches; F. Design of antenna MEMS switch combinations for direct simultaneous fabrication.
Bernhard, Jennifer T.↗
Fabrication of a novel gigabit/second free-space optical interconnect - photodetector characterization and testing and system development
The time when computing power is limited by the copper wire inherent in the computer system and not the speed of the microprocessor is rapidly approaching. With constant advances in computer technology, many researchers believe that in only a few years, optical interconnects will begin to replace copper wires in your Central Processing Unit (CPU). On a more macroscopic scale, the telecommunications industry has already made the switch to optical data transmission as, to date, fiber optic technology is the only reasonable method of reliable, long range data transmission. Within the span of a decade, we will see optical technologies move from the macroscopic world of the telecommunications industry to the microscopic world of the computer chip. Already, the communications industry is marketing commercially available optical links to connect two personal computers, thereby eliminating the need for standard and comparatively slow wired and wireless Ethernet transfers and greatly increasing the distance the computers can be separated. As processing demands continue to increase, the realm of optical communications will continue to move closer to the microprocessor and quite possibly onto the microprocessor itself. A day may come when copper connections are used only to supply power, not transfer data. This summer s work marks some of the beginning stages of a 5 to 10 year, long-term research project to create and study a free-space, 1 Gigabit/sec optical interconnect. The research will result in a novel fabricated, chip-to-chip interconnect consisting of a Vertical Cavity Surface Emitting Laser (VCSEL) Diode linked through free space to a Metal- Semiconductor-Metal (MSM) Photodetector with the possible integration of microlenses for signal focusing and Micro-Electromechanical Systems (MEMS) devices for optical signal steering. The advantages, disadvantages, and practicality of incorporating flip-chip mounting technologies will also be addressed. My work began with the design and construction of a test setup for the experiment and then appropriate characterization of the test system. Specifically, I am involved in the characterization of a commercially available 1550nm wavelength, 5mW diode laser and a study of its modulation bandwidth. Commercially produced photodetectors as well as the incorporation of microwave technology, in the form of RF input and output, are used in the characterization procedure. The next stage involves the use of a probe station and network analyzer to characterize and test a series of photodetectors fabricated on a 2 inch, Indium Gallium Arsenide (InGaAs) wafer in the Branch s microlithography lab. Other project responsibilities include, but are not limited to the incorporation of a transimpedance amplifier to the photodetector circuit; a study of VCSEL technology; bit error rate analysis of an optical interconnect system; and analysis of free space divergence of the VCSEL, optical path length of the interconnect; and any other pertinent optical properties of the one gigabit per second interconnect for fabrication and testing.
Savich, Gregory R.↗