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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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12 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2016

Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

42 ENGINEERING↗
DOE OSTI2023

Production and testing of the powerboard for ATLAS ITk Strip barrel modules

The upgrade of the ATLAS ITk strips detector for HL-LHC will employ a custom PCB (powerboard) for on-module DC-DC conversion, HV switching, and monitoring. Production of about 14100 of such PCBs with high reliability is a big challenge. In this paper we will present the production procedure and quality control (QC) testing system for the powerboards to be installed on ITk Strip barrel modules. During production, about 150 powerboards will be produced every week. Each powerboard will need to pass QC tests before they are assembled to module. The QC tests include thermal cycling between -35 °C and 40 °C, soak test (continuous running of DC-DC converter at high load at 20 °C), and basic functionality and characterization electrical tests of the low voltage (LV), high voltage (HV), and monitoring functions of the powerboard. A custom QC test system is described, which is based on a reusable PCB (active board) with all testing circuits, a one-time powerboard carrier card, and a Z-turn SoC board which hosts and runs the testing program. The production procedure and QC test system has been tested with 400 powerboards during pre-production, and the system has been proven ready for production with the desired testing program, speed, safety, and cost. Performance and typical failures of powerboards observed during the QC test of pre-production powerboards is also presented.

47 OTHER INSTRUMENTATION↗
DOE OSTI2023

2.5D HI Packaging of the Power Converter using TSV interposer.

Abstract: Advantages of the 2.5D HI (Heterogeneous Integration) electronics packaging of the power electronics compared to PCB packaging will be presented. Current 2.5D packaging effort using TSV (Through Silicon Via) will be presented in terms of fabrication, microstructural analysis, reliability, and thermal simulation.

Chung, Hyunim↗
DOE OSTI2025

Multi-phase Wireless Power Transfer with High Power Density Inductive Coils for Electric Drone Charging

Wireless charging of unmanned ground vehi-cles and aircraft has been proposed to increase charging reliability and security, allow for autonomous functionality, and either reduce battery size or increase continuous flight time. This paper proposes a three-phase Litz wire primary and a two-phase PCB secondary for high secondary-side power density considering misalignment tolerances, surface and volumetric power density, and coil sizing. Elec-tromagnetic 3D finite element analysis (FEA) simulations are conducted to study variation in mutual inductance and coupling coefficient with different secondary coil sizes and number of turns, horizontal and vertical misalignment between the primary and secondary, and a combination of both for a set of designs with the same rated power. Results indicate that receiver coils of reduced size relative to the primary can deliver rated power for increased power density and higher tolerance to misalignment.

Gastineau, Lucas [University of Kentucky]↗
DOE OSTI2024

Modular Coaxial Power Converter for High-Density Integration into Medium-Voltage Cables

This work proposes to combine the functionality benefits of power electronics with the power density benefits of medium-voltage cables to create a streamlined, high-density power electronics solution that seamlessly integrates with medium-voltage cables. Located at the ends of a medium- or high-voltage line, the proposed converter uses a cascade of coaxial power conversion cells to gradually step down the voltage, and excels in high step-down applications. By mimicking the coaxial geometry of medium-voltage cables, the converter preserves the axisymmetric electric field of the cable which, when combined with a solid insulating dielectric, provides a voltage scaling advantage over conventional planar and PCB-based converter solutions. Similar to medium voltage cables, the converter is fully passively cooled. A passive cooling strategy allows for combined installation with existing medium voltage cable systems without the added cost, maintenance needs, infrastructure, and reliability concerns associated with active cooling systems. The scalability of the modular structure in combination with the integration benefits provide a flexible power electronics system that can adapt to the evolving demands of the grid.

coaxial power conversion cells↗
DOE OSTI2025

Innovative Method for Reliable Measurement of PEM Water Electrolyzer Component Resistances

Understanding the sheet resistance of porous electrodes is essential for improving the performance of polymer electrolyte membrane (PEM) water electrolyzers and related technologies. Despite its importance, existing methods often fail to provide reliable and comprehensive data, especially for porous materials with complex morphologies and non‐uniform thicknesses. This study introduces a robust and straightforward method for determining the sheet resistance of porous electrodes using a novel probe concept based on industrial printed circuit board (PCB) technology. This probe measures resistance across ten distances, ranging from 250 µm to 2500 µm, enabling local mapping of resistance. The study focuses on the sheet resistance of key components in PEM water electrolyzers, including the gas diffusion layer (GDL), porous transport layer (PTL), and catalyst layers deposited on a membrane. Additionally, an image‐processing‐based method is presented to obtain the thickness distribution of the studied catalyst layers, facilitating a detailed analysis of the electrical in‐plane resistivity with thickness variations. Overall, this methodology has the potential to expedite material integration and bridge the gap between electrode engineering and single‐cell testing, thereby advancing the development of PEM water electrolyzers.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2018

High Density Chip Interconnect Technology Using High Density Glass Interposers

Demands for high density and high speed interconnect solutions are not satisfied by current technology offerings. Platforms such as printed circuit boards (PCBs), ceramic substrates and silicon interposers don’t provide the small form factor nor the I/O density to support 5G or 1Tbps gigabit ethernet solutions. Current solutions also don’t support die to die assembly with integrated tiled solutions for wide area and fanout solutions for lager data and signal processing. A solution with through vias provides an order of magnitude or smaller density supporting much higher density attach and assembly By fabricating a very fine pitch metal filled through glass via solution it’s possible to deliver the necessary improvements in performance, reliability, even higher data speed rates with smaller area and much denser geometries. There are a number of opportunities across a wide variety of industries for through glass interposers as they become the replacement for printed circuit boards (PCBs) and ceramic substrates. The broad array of opportunities include renewable energy, medical electronics (ME), defense electronics (DE)/space and consumer electronics (CE), but likely will impact every industry and market segment. Compared to PCBs, through glass via (TGV) solutions provide the next generation platform for semiconductor assembly improvements. The ability to generate lines, spaces, trenches and vias similar to wafer level geometries delivers wired solutions one to two orders of magnitude smaller than traditional organic PCB and ceramic substrate offerings. Higher density connections also include the thru vias that connect multiple metal layers, fanout. It’s possible to deliver filled metal vias that are 20um diameter with much tighter pitch than can be offered with PCB. Our goal is to provide 20um diameter and smaller via, 50um and smaller pitch, and aspect ratios at 25:1 and greater with hermetically metal filled vias. The goal of CVI is to replace or eliminate PCBs, ceramic substrate and through silicon vias (TSV) providing a glass interposer with metal filled, fiber plugged and/or optional wireless interconnectivity. The end plan is to deliver a glass substrate platform that provides improved electrical performance, versatility, inertness, and much improved cost and cycle time (development, drawing, and delivery) to performance in the form of small millimeter sized substrates or full 8” wafer substrates. Glass delivers an improvement over silicon thru vias (TSV) in the number of processing steps, cost, reliability and cycle time. In addition to metal plugged vias, our glass interposers are capable of fiber and antennae solutions providing two additional very high density and ultra-high speed data transfer capabilities.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Impact of Synthesis and Aging on Titanium Carbide MXenes for Printed Microsystems

This work investigates the long-term electrical stability of Ti3C2Tx MXene Inks under accelerated aging conditions. Inks were synthesized from commercial MAX-Phase precursors, drop-cast onto custom PCB’s and monitored automated in-situ measurements. Samples aged at 85°C/85% RH, 85°C/0% RH and ambient conditions revealed distinct degradation trends. Wet aged inks showed rapid resistance increased while etched formulations exhibited long term stability. These findings highlight the influence of synthesis stage and environmental exposure on MXene Inks reliability, offering critical insights for printed MEMS and sensor applications. Ongoing measurements extend the aging timeline beyond prior studies, marking the longest evaluation under accelerated aging conditions to date.

Aging↗
DOE OSTI2022

The level-1 trigger for the SuperCDMS experiment at SNOLAB

The SuperCDMS SNOLAB dark matter search experiment aims to be sensitive to energy depositions down to Script O(1 eV). This imposes requirements on the resolution, signal efficiency, and noise rejection of the trigger system. To accomplish this, the SuperCDMS level-1 trigger system is implemented in an FPGA on a custom PCB. A time-domain optimal filter algorithm realized as a finite impulse response filter provides a baseline resolution of 0.38 times the standard deviation of the noise, σn, and a 99.9% trigger efficiency for signal amplitudes of 1.1 σ n in typical noise conditions. Embedded in a modular architecture, flexible trigger logic enables reliable triggering and vetoing in a dead-time-free manner for a variety of purposes and run conditions. The trigger architecture and performance are detailed in this article.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2018

A Prototype Dual Robot System to Perform Ultrasonic and Visual Inspection for the Bottom of Double-Shell Tanks - 18624

Up to this point, ultrasonic inspection-based condition data has only been available for double-shell tank (DST) sidewalls because direct inspection access to the primary tank bottom is limited to vent duct channels in an insulating refractory pad that the primary tank rests on. Probe access through the air slot would provide the opportunity to get information about the condition of the bottom of the primary tank, but it is a challenge to deploy a crawling robot that is capable of performing nondestructive ultrasonic and visual inspection through confined air slots. As such, a conceptual prototype of a deployable inspection robot system to enable ultrasonic and visual inspection for DST base through ventilation ducts was designed and fabricated. This prototype dual robot system consisting of the AnnulusBot and the MouseBot can be integrated with nondestructive evaluation (NDE) sensors to inspect and examine the physical properties of the underside of DSTs to enable status assessment. The AnnulusBot was designed to carry the MouseBot and to be deployed to the annulus space through a riser. To deploy the MouseBot to every ventilation channel in the annulus, the arm consisting of a boom and a forearm was used to place the MouseBot on the underside of the tank. The AnnulusBot used segmented wheels enable to traverse pipes and other potential obstacles. The cable management system utilized motorized wheels to feed the cable into the ventilation channel. This would reduce the amount of work that the MouseBot would have to do during inspection. This feeding mechanism would also be used to retrieve the MouseBot at the end of its inspection. Additionally, if the MouseBot fails, this mechanism would be used for retrieval. Once deployed, the MouseBot navigates to the center of the tank via the air ventilation channel beneath the inner shell (the primary tank) while inspecting the space. The MouseBot is then retrieved from the channel by a combination of its own drive power and the AnnulusBot retracting the attached umbilical cord. Compare with the AnnulusBot, the physical dimensional limitations of the MouseBot were a greater challenge. As the surface state of the concrete of the air channels could have variable texture, and may contain debris, it was decided not to travel along this surface. The ceiling of these channels is carbon steel and can be utilized throughout the channel. To use this travel surface, magnetic wheels were employed. A foreseeable problem with the use of magnets on this surface, is that they would preclude the use of eddy currents sensors. However, other technologies like ultrasonic technology sensors should be unaffected. Laboratory scale test was performed on a mock-up single wedge of the refractory pad to evaluate maneuverability of the MouseBot. The electronic components for the prototype would work in the ranges of 150-185 deg. F (65.6-85 deg. C). Both the AnnulusBot and MouseBot will be subject to constant radiation. All major printed circuit board (PCB) microcontroller components were designed to be situated outside of the annulus space and inside the main control panel to avoid radiation-induced failure. As future work, electronic components including the Arduinos that used Atmel commercial microcontrollers will be replaced with the high temperature rated Atmel microcontrollers so that the robots can be operated reliably at ambient temperatures up to 200 deg. F (93.3 deg. C). In addition, the robots will be service life tested to evaluate performance at elevated temperature and under gamma irradiation. (authors)

42 ENGINEERING↗
DOE OSTI2021

A Compact 50kW High Power Density, Hybrid 3-Level Paralleled T-type Inverter for More Electric Aircraft Applications

The demand for high performing, lightweight, reliable inverters, increased the scope of wide bandgap and high-switching frequency based solutions. To achieve such high efficiency inverters, it is vital to focus on the system level design considerations to maximize the benefits of these advanced technologies. This paper presents an improved design based on considerations to further reap the benefits of choosing the right inverter topology; increased capabilities through paralleling devices, with reduced total number of switches; and designing a planarized inverter with PCB based busbar. Appropriate thermal analysis and heatsink design has aided in increased system power density along with the overall efficiency. Demonstration of a 50kW 3-phase 3-level paralleled T-type SiC inverter operating at 40kHz switching frequency for aircraft applications is shown to evaluate the benefits of proposed design methodology. Here, the prototype achieves a high power density of 11kW/L.

42 ENGINEERING↗
DOE OSTI2022

Optimizing Sensor Count and Placement to Detect Bond Wire Lift-Offs and Surface Defects in High-Power IGBT Modules Using Low-Cost Piezo-Electric Resonators

This manuscript presents the most recent results and findings to identify bond wire lift-offs and surface defects in high-power isolated gate bipolar junction transistor (IGBT) modules. The authors of this manuscript formerly proposed a low-cost, piezoelectric resonator-based measurement unit to detect bond wire related degradation in larger IGBT modules. Since high-power IGBT modules are expensive, it was apparent that evaluating our proposed method by inducing controlled damage to fresh (new) IGBTs may not be cost-effective especially when multiple sets of data need to be captured by inducing damage to different levels. In order to overcome this limitation, IGBT bond wires have been mimicked using a 3D printed enclosure, a PCB, and copper wires with dimensions very closely resembling a real IGBT. Using this method, multiple test devices can be built at the cost of a real IGBT, and the proposed technique could be fine-tuned without damaging expensive, real IGBTs. Our recent findings can be used to determine real IGBT degradation and bond wire lift-offs using only two sensors, as opposed to six transducers used in the first iteration of the setup. In addition to optimizing the sensor count, we have also identified the best possible locations of these sensors by attempting multiple placements inside the IGBT casing.

condition monitoring↗