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Economical laser scanner assembled from commercially available components, modulates and scans focused laser beam over area up to 5.1 by 5.1 cm. Scanner gives resolution comparable to that of conventional television. Device is highly applicable to area of analog and digital storage and retrieval.
The issues are described which are associated with using a laser scanner for visual sensing and the methods developed by the author to address them. A laser scanner is a device that controls the direction of a laser beam by deflecting it through a pair of orthogonal mirrors, the orientations of which are specified by a computer. If a calibrated laser scanner is combined with a calibrated camera, it is possible to perform three dimensional sensing by directing the laser at objects within the field of view of the camera. There are several issues associated with using a laser scanner for three dimensional visual sensing that must be addressed in order to use the laser scanner effectively. First, methods are needed to calibrate the laser scanner and estimate three dimensional points. Second, methods to estimate three dimensional points using a calibrated camera and laser scanner are required. Third, methods are required for locating the laser spot in a cluttered image. Fourth, mathematical models that predict the laser scanner's performance and provide structure for three dimensional data points are necessary. Several methods were developed to address each of these and has evaluated them to determine how and when they should be applied. The theoretical development, implementation, and results when used in a dual arm eighteen degree of freedom robotic system for space assembly is described.
Light-assisted microelectronic advanced laser scanner (LAMEALS) is augmented version of microelectronic advanced laser scanner (MEALS) described in article, "Laser Scanner Tests For Single-Event Upsets", (NPO-18216). Only major difference, steady illumination from helium/neon laser, argon-ion laser, and/or other source(s) combined with pulsed dye-laser illumination of MEALS into single illuminating beam.
A laser scanner computes a range from a laser line to an imaging sensor. The laser line illuminates a detail within an area covered by the imaging sensor, the area having a first dimension and a second dimension. The detail has a dimension perpendicular to the area. A traverse moves a laser emitter coupled to the imaging sensor, at a height above the area. The laser emitter is positioned at an offset along the scan direction with respect to the imaging sensor, and is oriented at a depression angle with respect to the area. The laser emitter projects the laser line along the second dimension of the area at a position where a image frame is acquired. The imaging sensor is sensitive to laser reflections from the detail produced by the laser line. The imaging sensor images the laser reflections from the detail to generate the image frame. A computer having a pipeline structure is connected to the imaging sensor for reception of the image frame, and for computing the range to the detail using height, depression angle and/or offset. The computer displays the range to the area and detail thereon covered by the image frame.
Microelectronic advanced laser scanner (MEALS) is opto/electro/mechanical apparatus for nondestructive testing of integrated memory circuits, logic circuits, and other microelectronic devices. Multipurpose diagnostic system used to determine ultrafast time response, leakage, latchup, and electrical overstress. Used to simulate some of effects of heavy ions accelerated to high energies to determine susceptibility of digital device to single-event upsets.
Two reports describe preliminary theoretical and experimental studies based on method described in "Laser Scanner Tests For Single-Event Upsets" (NPO-18216). Laser-scan and heavy-ion data found correlated within factor of two. Method of testing for single-event upsets intended to overcome disadvantages of, complement, and/or substitute for more-expensive cyclotron-testing method, which does not provide spatial resolution.
As part of the Low Cost Solar Array Program at Jet Propulsion Laboratory, failure analyses have been performed on over 300 photovoltaic modules from thirty different manufacturers and five countries. Because of the volume of work and the variety of module types encountered, it has been necessary to develop non-destructive techniques to rapidly locate the failure sites. This paper will present design details and results obtained with one instrument developed specifically for this purpose, the Solar Cell Laser Scanner (SCLS). The effects of applying a bias current to the modules will also be discussed, based upon experimental observations and computer generated predictions.
Microscopic assembly for alignment of rotary laser focuses on small film area along scan line at oblique angle. Suitable choice of angle and location of optical components project laser beam line as X coordinate reticle. Coordination with horizontal recticle line included microscope facilitates Y coordinate position indexing.
The design, construction, and testing of a laser scanning system is described. The scanner was designed to deliver a scanned beam over a 2.54 cm by 2.54 cm or a 5.08 cm by 5.08 cm format. In order to achieve a scan resolution and rate comparable to that of standard television, an acousto-optic deflector was used for one axis of the scan, and a light deflecting galvanometer for deflection along the other axis. The acoustic optic deflector has the capability of random access scan controlled by a digital computer.
Irregular surfaces mapped and digitized for numerical-control machinery. Fast, accurate laser scanning system measures size and shape of cavity without making any physical contact with cavity and walls. Measurements processed into control signals for numerically controlled machining of tile or block to fit cavity. System generates map of grid points representing cavity and portion of outer surface surrounding cavity. Map data used to control milling machine, which cuts tile or block to fit in cavity.
A scanning optoelectronic instrument generates the digital equivalent of a threedimensional (X,Y,Z) map of a surface that spans an area with resolution on the order of 0.005 in. ( 0.125mm). Originally intended for characterizing surface flaws (e.g., pits) on space-shuttle thermal-insulation tiles, the instrument could just as well be used for similar purposes in other settings in which there are requirements to inspect the surfaces of many objects. While many commercial instruments can perform this surface-inspection function, the present instrument offers a unique combination of capabilities not available in commercial instruments. This instrument utilizes a laser triangulation method that has been described previously in NASA Tech Briefs in connection with simpler related instruments used for different purposes. The instrument includes a sensor head comprising a monochrome electronic camera and two lasers. The camera is a high-resolution
Individual ''fingerprint'' signals are produced when system photoexcites chips. ''Fingerprints'' are analyzed for characteristics associated with defects, including many not visible to the naked eye. Electromagnetic radiation photogenerates free electrons and holes in semiconductor chip. These carriers produce electrical signals at terminals. Signals vary depending on what defects are present.
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Scanners using solid-state devices compact, consume little power, and have no moving parts. Integrated electro-optical laser scanner, in conjunction with external lens, points outgoing beam of light in any number of different directions, depending on number of upper electrodes. Offers beam-deflection angles larger than those of acousto-optic scanners. Proposed for such diverse applications as nonimpact laser printing, color imaging, ranging, barcode reading, and robotic vision.
Real-time tracking of multiple targets and three dimensional object features was demonstrated using a laser range scanner. The prototype was immune to ambient illumination and sun interference. Tracking error feedback was simultaneously obtained from individual targets, global predicted target position, and the human operator. A more complete study of calibration parameters and temperature variations on the scanner is needed to determine the exact performance of the sensor. Lissajous patterns used in three-dimensional real-time tracking prove helpful given their high resolution. The photogrammetry-based Advanced Space Vision System (ASVS) is discussed in combination with the laser range scanner.
Report describes experimental study of use of microelectronic advanced laser scanner (MEALS) to cause single-event upsets (SEUs) in integrated logic circuits. Basic concepts of SEU testing by use of MEALS described in "Laser Scanner Tests for Single-Event Upsets" (NPO-18216), "Single-Event-Upset Laser Scanner With Optical Bias" (NPO-18217), and "More About Laser Scanner Tests for Single-Event Upsets" (NPO-18494). Study part of continuing effort to study SEU effects of ionizing radiation on such circuits and to use MEALS as relatively inexpensive SEU-prescreening laboratory apparatus serving as alternative to heavy-ion acclerator.
The ongoing vision research at the Center for Intelligent Robotic Systems for Space Exploration (CIRSSE) is directed toward identifying and addressing the relevant issues involved in applying visual sensing to space assembly tasks. A considerable amount of effort has been devoted to passive sensing techniques such as using multiple cameras to identify objects in a scene. To compliment the capabilities of the passive visual system in the CIRSSE robotics testbed, research is being conducted in active sensing techniques. This report is description of the research associated with the testbed's laser scanner and its application as an active sensing device. The report is comprised of five major topics. First is a brief description of the CIRSSE visual system and a summary of the active sensing research that has been conducted up to this point. Second, some of the methods currently used to calibrate CIRSSE's laser scanner are described as well as an appraisal of the effectiveness of these methods. Third, is a discussion of how the laser scanner can be employed in concert with a camera to provide a three dimensional point estimation capability. Fourth, there is a description of methods that can be used to detect the presence of the laser beam in a cluttered camera image. Finally, there is a summary of the current state of this research and a description of research planned for the future.
Integrated subsystem health diagnostics is an area where major improvements have been identified for potential implementation into the design of new reusable launch vehicles (RLVs) in order to reduce life cycle costs, to increase safety margins, and to improve mission reliability. This talk summarizes a joint effort between NASA Ames and industry partners to develop rapid non-contact diagnostic tools for health and performance monitoring of thermal protection systems (TPS) on future RLVs. The specific goals for TPS health monitoring are to increase the speed and reliability of TPS inspections for improved operability at lower cost. The technology being developed includes a 3-D laser scanner for examining the exterior surface of the TPS, and a subsurface microsensor suite for monitoring the health and performance of the TPS. The sensor suite consists of passive overlimit sensors and sensors for continuous parameter monitoring in flight. The sensors are integrated with radio-frequency identification (RFID) microchips to enable wireless communication of-the sensor data to an external reader that may be a hand-held scanner or a large portal. Prototypes of the laser system and both types of subsurface sensors have been developed. The laser scanner was tested on Shuttle Orbiter Columbia and was able to dimension surface chips and holes on a variety of TPS materials. The temperature-overlimit microsensor has a diameter under 0.05 inch (suitable for placement in gaps between ceramic TPS tiles) and can withstand 700 F for 15 minutes.