Thermal simulation of the EIC HSR interconnect module - RF fingers

Abstract

The Electron Ion Collider (EIC) Hadron Storage Ring (HSR) will reuse most of the existing superconducting magnets from the RHIC storage ring. However, the existing beam vacuum chamber and stripline BPMs will not be compatible with the planned EIC hadron bunches that will have a 3x higher intensity and be 10x shorter, and some operational scenarios with large radial offsets of the beam in the vacuum chamber. To address these challenges, a copper coated beam screen will be implemented, the existing RHIC stripline BPMs will be shielded and an interconnect module design, including new BPM will be installed adjacent to the existing BPMs. A thermal analysis of the new arc BPM interconnect housing has been conducted to assess the heating caused by beam induced resistive wall heating and electron cloud heating. An analysis of the BPM module has been made and reported separately. This report will focus on the other side of the interconnect module, containing the RF fingers.