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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Single event effect data is presented on the Analog Devices AD7984. The recent heavy-ion test results showcase application-specific results for the commercial part in its intended application.
Testing was done to characterize the Texas Instruments Operational Amplifiers OPA691 single event effects (SEE) response. The primary SEE concerns for this device are single event latchup (SEL) and single event transients (SETs). Testing focused on determining susceptibility to SEL and characterizing the SET response. Testing occurred on November 11, 2022.
Testing was done to characterize the Texas Instruments Operational Amplifiers OPA842 single event effects (SEE) response. The primary SEE concerns for this device are single event latchup (SEL) and single event transients (SETs). Testing focused on determining susceptibility to SEL and characterizing the SET response. Testing occurred on November 11, 2022.
This study was undertaken to determine the single event effect (SEE) susceptibility of two different MOSFET components. Heavy-ion testing was conducted at the Lawrence Berkeley National Laboratory (LBNL) Berkeley Accelerator Space Effects (BASE) Facility 88” Cyclotron. Its purpose was to evaluate these devices as candidates for use on Goddard Modular SmallSat Architecture (GMSA) adapter board for the GTOSat project.
This study was undertaken to determine the destructive single event effect and degradation susceptibility of the IXTA96P085T P-Channel -85V MOSFET from IXYS. The device was monitored for destructive single event effects and degradation during exposure to a heavy ion beam at the Berkeley Accelerator Space Effects (BASE) Facility at the Lawrence Berkeley National Laboratory (LBNL). Gate and drain currents were measured during irradiation and a basic set of electrical characterizations was performed following each fluence exposure to assess heavy ion induced damage. The test date was April 10, 2024. This characterization is application specific.
An experimental aerodynamic investigation was conducted to determine the interference effects of a wind tunnel support system. The test article was a 0.015 scale model of the space shuttle orbiter. The primary objective of the test was to determine the extent that aerodynamic simulation of the space shuttle orbiter is affected by base mounting the model, without nozzles, on a straight sting. Two support systems were tested. The characteristics of the support systems are described. Data from the tests are presented in the form of graphs and tables.
This study was undertaken to determine the destructive single event effect and degradation susceptibility of the 80SCL060SCS Schottky diode. The device was monitored for destructive events and degradation in the reverse bias current during exposure to a heavy ion beam at Texas A&M University's K500 Cyclotron.
This study was to determine the destructive single-event effect (SEE) susceptibility of the DS25BR100 series Low-Voltage Differential Signaling (LVDS) Buffers with Pre-emphasis and Equalization (DS25BR100, 110, and 120). The device was monitored primarily for destructive events while exposing it to a heavy ion beam at the Texas A&M University’s (TAMU) K500 Cyclotron.
This irradiation campaign was performed to evaluate the destructive single event effect (SEE) susceptibility of a n-channel power MOSFET from SSDI for space-based instrumentation. Testing was performed at Michigan State University’s (MSU) Facility for Rate Isotope Beams (FRIB) using an LET of 50.5 MeV·cm 2 /mg
We report low-energy proton and low-energy alpha particle single-event effects (SEE) data on a 32 nm silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) latches and static random access memory (SRAM) that demonstrates the criticality of using low-energy protons for SEE testing of highly-scaled technologies. Low-energy protons produced a significantly higher fraction of multi-bit upsets relative to single-bit upsets when compared to similar alpha particle data. This difference highlights the importance of performing hardness assurance testing with protons that include energy distribution components below 2 megaelectron-volt. The importance of low-energy protons to system-level single-event performance is based on the technology under investigation as well as the target radiation environment.
Radiation encountered in space environments can be damaging to microelectronics and potentially cause spacecraft failure. Single event effects (SEE) are a type of radiation effect that occur when an ion strikes a device. Single event gate rupture (SEGR) is a type of SEE that can cause failure in power transistors. Unlike other SEE rates in which a constant linear energy transfer (LET) can be used, SEGR rates sometimes require a non-uniform LET to be used to be accurate. A recent analysis shows that SEGR rates are most easily calculated when the environment is described as a stopping rate per unit volume for each ion species. Stopping rates in silicon for pertinent ions were calculated using the Stopping and Range of Ions in Matter (SRIM) software and CREME-MC software. A reference table was generated and can be used by others to calculate SEGR rates for a candidate device. Additionally, lasers can be used to simulate SEEs, providing more control and information at lower cost than heavy ion testing. The electron/hole pair generation rate from a laser pulse in a semiconductor can be related to the LET of an ion. MATLAB was used to generate a plot to easily make this comparison.
This study was undertaken to determine the destructive single event effect and degradation susceptibility of the Si7113DN P-Channel 100V MOSFET from Vishay Siliconix. The device was monitored for destructive single event effects and degradation during exposure to a heavy ion beam at the Berkely Accelerator Space Effects (BASE) Facility at the Lawrence Berkely National Laboratory (LBNL).
This study was undertaken to determine the single-event effect susceptibility of the radiation-hardened MRH25N12U3 (JANSR2N7593) power MOSFET recently developed by Microchip Technology, Inc.
This report covers the time period from May 1976 to December 1979 and encompasses the three phases of accelerated testing: Phase 1, the 250 C testing; Phase 2, the 200 C testing; and Phase 3, the 125 C testing. The duration of the test in Phase 1 and Phase 2 was sufficient to take the devices into the wear out region. The wear out distributions were used to estimate the activation energy between the 250 C and the 200 C test temperatures. The duration of the 125 C test, 20,000 hours, was not sufficient to bring the test devices into the wear out region; consequently the third data point at 125 C for determining the consistency of activation energy could not be obtained. It was estimated that, for the most complex of the three device types, the activation energy between 200 C and 125 C should be at least as high as that between 250 C and 200 C. The practicality of the use of high temperature for the accelerated life tests from the point of view of durability of equipment was assessed. Guidelines for the development of accelerated life test conditions were proposed. The use of the silicon nitride overcoat to improve the high temperature accelerated life test characteristics of CMOS microcircuits was explored in Phase 4 of this study and is attached as an appendix to this report.
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Explore the source record for details and available documents.
Explore the source record for details and available documents.
In developing a software system, we would like to estimate the total number of faults inserted in to the system, its residual fault content at any given time, and the efficacy of the testing activity in executing the code containing the newly inserted faults.