DOE OSTI · 1765610
Submicron Thickness Characterization of Poly-Si Thin Films on Textured Surfaces by X-Ray Diffraction for Minimizing Parasitic Absorption in Poly-Si/SiO2 Passivating Contact Cells
Abstract
Poly-Si/SiO2 passivating contacts have shown great potential for industry-relevant next-generation solar cells. Previous work has demonstrated an improved Jsc from dry reactive ion etching in an SF6 environment, using front metal grids as a self-aligned mask. Here, we show an effective method to measure the front poly-Si thickness on an alkaline textured surface using X-ray diffraction. The calculated thicknesses are compared with cross-section SEM analysis and Quokka simulation. We show that by thinning the front poly-Si from 200 nm to 60 nm, Jsc increases by 2.4 mA/cm2, leading to an absolute efficiency gain of 1.73%. Finally, we discuss possible reasons for the premature loss of passivation before the removal of all poly-Si.
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Chen, Kejun, LaSalvia, Vincenzo, Nemeth, William, Theingi, San, Guthrey, Harvey (ORCID:0000000315743379), Hartenstein, Matthew B., Kale, Abhijit S., Page, Matthew, Bothwell, Alex, Sites, James, Stradins, Paul, Agarwal, Sumit, Young, David L.. 2021-01-05. Submicron Thickness Characterization of Poly-Si Thin Films on Textured Surfaces by X-Ray Diffraction for Minimizing Parasitic Absorption in Poly-Si/SiO2 Passivating Contact Cells. https://doi.org/10.1109/pvsc45281.2020.9300794
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